이 특허를 인용한 특허 (79)

1. Stimmell Jim ; Laia Joe ; Saproo Ajay, Annealing process for low-k dielectric film.

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2. Lawrence, Thomas; Stahl, Nick; Ahling, Jay, Apparatus and method for vapor deposition of dielectric wire coating.

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3. Hideki Gomi JP, Apparatus with high temperature gas releasing means for vapor deposition of parylene polymer without peeling.

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4. Robinson, Marc E.; Vindasius, Alfons; Almen, Donald; Jacobsen, Larry, Assembly having stacked die mounted on substrate.

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5. Vindasius, Al; Robinson, Marc E.; Jacobsen, Larry; Almen, Donald, Assembly having stacked die mounted on substrate.

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6. Lang Chi-I ; Ma Yeming Jim ; Chang Fong ; Lee Peter Wai-Man ; Jeng Shin-Puu,TWX ; Cheung David, Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer.

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7. Lee, Chung J.; Kumar, Atul, Chemically and electrically stabilized polymer films.

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8. Lee Chung J. ; Wang Hui ; Foggiato Giovanni Antonio, Chemicals and processes for making fluorinated poly(para-xylylenes).

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9. Lee, Chung J.; Kumar, Atul, Composite polymer dielectric film.

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10. Lee Chung J. ; Wang Hui ; Foggiato Giovanni Antonio, Deposition systems and processes for transport polymerization and chemical vapor deposition.

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11. Lee, Chung J., Dielectric thin films from fluorinated precursors.

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12. Lee,Chung J., Dielectric thin films from fluorinated precursors.

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13. Co, Reynaldo; Leal, Jeffrey S.; Pangrle, Suzette K.; McGrath, Scott; Melcher, De Ann Eileen; Barrie, Keith L.; Villavicencio, Grant; Del Rosario, Elmer M.; Bray, John R., Electrical connector between die pad and z-interconnect for stacked die assemblies.

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14. Co, Reynaldo; Leal, Jeffrey S.; Pangrle, Suzette K.; McGrath, Scott; Melcher, DeAnn Eileen; Barrie, Keith L.; Villavicencio, Grant; del Rosario, Elmer M.; Bray, John R., Electrical connector between die pad and z-interconnect for stacked die assemblies.

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15. Co, Reynaldo; Villavicencio, Grant; Leal, Jeffrey S.; McElrea, Simon J. S., Electrical interconnect for die stacked in zig-zag configuration.

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16. McElrea, Simon J. S.; Andrews, Jr., Lawrence Douglas; McGrath, Scott; Caskey, Terrence; Crane, Scott Jay; Robinson, Marc E.; Cantillep, Loreto, Electrically interconnected stacked die assemblies.

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17. McElrea, Simon J. S.; Andrews, Jr., Lawrence Douglas; McGrath, Scott; Caskey, Terrence; Crane, Scott Jay; Robinson, Marc E.; Cantillep, Loreto, Electrically interconnected stacked die assemblies.

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18. Leighton, Roger G.; Fromm, Paul M.; Wende, Alexander; Fletcher, Gerald, Electrostatic platen for conductive pet film printing.

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19. Tao, Min; Sun, Zhuowen; Kim, Hoki; Zohni, Wael; Agrawal, Akash, Enhanced density assembly having microelectronic packages mounted at substantial angle to board.

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20. Katkar, Rajesh; Co, Reynaldo; McGrath, Scott; Prabhu, Ashok S.; Lee, Sangil; Wang, Liang; Shen, Hong, Flipped die stack.

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21. Prabhu, Ashok S.; Katkar, Rajesh; Wang, Liang; Uzoh, Cyprian Emeka, Flipped die stack assemblies with leadframe interconnects.

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22. Delacruz, Javier A.; Haba, Belgacem; Vu, Tu Tam; Katkar, Rajesh, Flipped die stacks with multiple rows of leadframe interconnects.

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23. Delacruz, Javier A.; Haba, Belgacem; Vu, Tu Tam; Katkar, Rajesh, Flipped die stacks with multiple rows of leadframe interconnects.

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24. Robert P. Mandal, In-situ generation of p-xylyiene from liquid precursors.

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25. Lee, Chung J., Integration of low ε thin films and Ta into Cu dual damascene.

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26. Lee Chung J. ; Wang Hui ; Foggiato Giovanni Antonio, Low dielectric constant materials and method.

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27. Lee, Chung J.; Wang, Hui; Foggiato, Giovanni Antonio, Low dielectric constant materials prepared from photon or plasma assisted chemical vapor deposition and transport polymerization of selected compounds.

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28. Benzing, Jeffrey C.; Kelly, John, Low dielectric constant porous materials having improved mechanical strength.

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29. Sivaramakrishnam Visweswaren ; Nguyen Bang C. ; Rao Gayathri ; Robles Stuardo ; Fong Gary L. ; Lim Vicente ; Lee Peter W., Method and apparatus for forming a thin polymer layer on an integrated circuit structure.

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30. Chappa, Ralph A., Method for depositing a polymeric coating on a substrate.

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31. Babikian, Dikran S., Method for substrate thermal management.

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32. Dikran S. Babikian, Method for substrate thermal management.

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33. Lee, Chung J.; Kumar, Atul; Chen, Chieh; Tzeng, George, Method of encapsulating an organic light emitting device.

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34. Lee, Chung J.; Kumar, Atul; Chen, Chieh, Method of encapsulating an organic light-emitting device.

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35. Haba, Belgacem; Sun, Zhuowen; Delacruz, Javier A., Microelectronic packages and assemblies with improved flyby signaling operation.

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36. Brant, Patrick; Thurman, Derek W.; Cherney, Daniel P., Microporous membrane, methods for making such film, and the use of such film as battery separator film.

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37. Mandal Robert P. ; Cheung David ; Lee Peter Wai-Man ; Lang Chi-I, Nano-porous copolymer films having low dielectric constants.

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38. Seshu B. Desu ; John J. Senkevich, Near-room temperature CVD synthesis of organic polymer/oxide dielectric nanocomposites.

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39. Lee,Chung J.; Chen,Chieh; Kumar,Atul, Organic light emitting device having a protective barrier.

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40. Seshu B. Desu ; John J. Senkevich, Oxide/organic polymer multilayer thin films deposited by chemical vapor deposition.

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41. Hanefeld,Phillip; Horst,Sven; Meise,Markus; Bognitzki,Michael; Greiner,Andreas; Kumar,Rakesh, Parylene variants and methods of synthesis and use.

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42. Kumar, Rakesh; Hanefeld, Phillip; Horst, Sven; Meise, Markus; Greiner, Andreas; Bognitzki, Michael, Parylene variants and methods of synthesis and use.

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43. Brown,Karl; Mehta,Vineet; Phan,See Eng; Sherstinsky,Semyon; Lau,Allen, Pedestal with integral shield.

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44. Dolbier, Jr., William R.; Xie, Puhui; Kumar, Rakesh, Perfluoroparacyclophane and methods of synthesis and use thereof.

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45. Lang, Chi-I; Jeng, Shin-Puu; Ma, Yeming Jim; Chang, Fong; Lee, Peter Wai-Man; Cheung, David W., Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds.

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46. Lee,Chung J.; Kumar,Atul, Porous low E (<2.0) thin films by transport co-polymerization.

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47. Lee,Chung J.; Kumar,Atul, Porous low k(<2.0) thin film derived from homo-transport-polymerization.

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48. Lee Chung J. ; Wang Hui ; Foggiato Giovanni Antonio, Precursors for making low dielectric constant materials with improved thermal stability.

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49. Lee Chung J. ; Wang Hui ; Foggiato Giovanni Antonio, Precursors for making low dielectric constant materials with improved thermal stability.

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50. Lee, Chung J.; Wang, Hui; Foggiato, Giovanni Antonio, Precursors for making low dielectric constant materials with improved thermal stability.

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51. Cornell Robert Wilson, Printhead thermal compensation method and apparatus.

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52. Gomi Hideki,JPX, Residue removal process for forming inter-level insulating layer of paraylene polymer without peeling.

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53. Leal, Jeffrey S., Selective die electrical insulation by additive process.

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54. Leal, Jeffrey S., Selective die electrical insulation by additive process.

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55. Co, Reynaldo; Melcher, DeAnn Eileen; Pan, Weiping; Villavicencio, Grant, Semiconductor die array structure.

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56. Crane, Scott Jay; McElrea, Simon J. S.; McGrath, Scott; Pan, Weiping; Melcher, De Ann Eileen; Robinson, Marc E., Semiconductor die mount by conformal die coating.

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57. Crane, Scott Jay; McElrea, Simon J. S.; McGrath, Scott; Pan, Weiping; Melcher, De Ann Eileen; Robinson, Marc E., Semiconductor die mount by conformal die coating.

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58. Crane, Scott Jay; McElrea, Simon J. S.; McGrath, Scott; Pan, Weiping; Melcher, DeAnn Eileen; Robinson, Marc E., Semiconductor die mount by conformal die coating.

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59. Lee,Chung J.; Kumar,Atul, Single and dual damascene techniques utilizing composite polymer dielectric film.

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60. Weyburne, David William; Sun-Paduano, Qing, Spin coating of substrate with chemical.

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61. Lee, Chung J., Stabilized polymer film and its manufacture.

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62. McGrath, Scott; Leal, Jeffrey S.; Shenoy, Ravi; Cantillep, Loreto; McElrea, Simon; Pangrle, Suzette K., Stacked die assembly having reduced stress electrical interconnects.

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63. Dikran S. Babikian, Substrate thermal management system.

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64. McElrea, Simon J. S.; Robinson, Marc E.; Andrews, Jr., Lawrence Douglas, Support mounted electrically interconnected die assembly.

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65. Duva, Frank A., Surface flashover resistant capacitors and method for producing same.

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66. Duva, Frank A., Surface flashover resistant capacitors and method for producing same.

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67. Lee,Chung J.; Kumar,Atul; Chen,Chieh; Pikovsky,Yuri, System for forming composite polymer dielectric film.

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68. Hironaka, Takashi; Read, Christopher Jensen, TV-centric system.

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69. Wing James, Temperature control of parylene dimer.

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70. Paul Wickboldt ; Albert R. Ellingboe ; Steven D. Theiss ; Patrick M. Smith, Thick adherent dielectric films on plastic substrates and method for depositing same.

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71. Farooq, Mukta G.; Landers, William F.; Liu, Jin; Martin, Andrew J.; Schlichting, Kathryn E.; Smith, Melissa A., Three dimensional organic or glass interposer.

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72. Vindasius, Al; Robinson, Marc, Three dimensional six surface conformal die coating.

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73. Shi Jianou ; Mitchener James C., UV exposure for improving properties and adhesion of dielectric polymer films formed by chemical vapor deposition.

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74. Willson, C. Grant; Durand, William; Ellison, Christopher John; Bates, Christopher; Seshimo, Takehiro; Cushen, Julia; Santos, Logan; Dean, Leon; Rausch, Erica, Using chemical vapor deposited films to control domain orientation in block copolymer thin films.

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75. Wilson, C. Grant; Durand, William J.; Ellison, Christopher John; Bates, Christopher M.; Seshimo, Takehiro; Cushen, Julia; Santos, Logan J.; Dean, Leon; Rausch, Erica L., Using chemical vapor deposited films to control domain orientation in block copolymer thin films.

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76. Christensen,Dennis R., Vapor deposition apparatus.

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77. Edelstein Sergio ; Chen Steven A. ; Parkhe Vijay D., Wafer heater assembly.

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78. Prabhu, Ashok S.; Katkar, Rajesh; Moran, Sean, Wafer-level flipped die stacks with leadframes or metal foil interconnects.

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79. Prabhu, Ashok S.; Katkar, Rajesh; Moran, Sean, Wafer-level flipped die stacks with leadframes or metal foil interconnects.

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