이 특허를 인용한 특허 (130)

1. Cook, Ted Staton, Absolute position encoder scale having layers in a stacked configuration.

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2. Cook, Ted Staton, Absolute position encoder scale having plates alternating with varying recesses.

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3. Goldfine Neil J. ; Schlicker Darrell E. ; Washabaugh Andrew P., Absolute property measurement with air calibration.

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4. Goldfine,Neil J.; Schlicker,Darrell E.; Washabaugh,Andrew P., Absolute property measurement with air calibration.

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5. Kanevsky,Valery; Eidson,John C.; Hamilton,Bruce, Adaptive data collection.

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6. Paik,Young J., Adjusting manufacturing process control parameter using updated process threshold derived from uncontrollable error.

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7. Gysling,Daniel L.; Loose,Douglas H.; Maron,Robert; Engel,Thomas; Croteau,Paul, Apparatus and method for measuring unsteady pressures within a large diameter pipe.

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8. Nikolenko, Yury; Fauss, Matthew, Apparatus and method of using impedance resonance sensor for thickness measurement.

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9. Slates, Richard D., Apparatus for determining a gap between a proximity probe component and a conductive target material.

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10. Slates, Richard D., Apparatus for determining dynamic gaps between a proximity probe and a conductive target material.

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11. Slates, Richard D., Apparatus for determining gaps between a proximity probe and a conductive target material.

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12. Goldfine Neil J. ; Clark David C. ; Eckhardt Homer D., Apparatus for measuring bulk materials and surface conditions for flat and curved parts.

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13. Hanawa, Hiroji; Johansson, Nils; Swedek, Bogusla W; Birang, Manoocher, Apparatus for monitoring a metal layer during chemical mechanical polishing using a phase difference signal.

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14. Schwarm,Alexander T., Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools.

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15. Bennett, Doyle E; Koppikar, Sandeep R; David, Jeffrey Drue; Swedek, Boguslaw A; Johansson, Nils, Chemical mechanical polishing apparatus with non-conductive elements.

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16. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.

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17. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.

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18. Johansson, Nils; Swedek, Boguslaw A.; Birang, Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.

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19. Johansson,Nils; Swedek,Boguslaw A.; Birang,Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.

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20. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan, Computer integrated manufacturing techniques.

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21. Arackaparambil,John F.; Chi,Tom; Chow,Billy; D'Souza,Patrick M.; Hawkins,Parris; Huang,Charles; Jensen,Jett; Krishnamurthy,Badri N.; Kulkarni,Pradeep M.; Kulkarni,Prakash M.; Lin,Wen Fong; Mohan,Shan, Computer integrated manufacturing techniques.

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22. Paik, Young Joseph, Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life.

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23. Shanmugasundram, Arulkumar; Parikh, Suketu A., Copper wiring module control.

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24. Buttle, David John; Thayer, Peter John; Dalzell, William, Detection of rolling contact fatigue.

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25. Mednikov, Felix Matveevich; Mednikov, Stanislav Felixovich; Nechaevsky, Mark Lazarevich, Differential eddy-current transducer.

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26. Rich Slates, Digital eddy current proximity system: apparatus and method.

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27. Slates, Richard D., Digital eddy current proximity system: apparatus and method.

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28. Cruise, Nathan; Gross, Paul G.; Elligson, Jeffrey A.; Kenney, James J., Driving tool and method for controlling same.

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29. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.

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30. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.

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31. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T., Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing.

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32. Paik, Young Jeen, Dynamic offset and feedback threshold.

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33. Chi, Yueh-Shian; Hawkins, Parris C M; Huang, Charles Q., Dynamic subject information generation in message services of distributed object systems.

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34. Chi,Yueh shian T.; Hawkins,Parris C. M.; Huang,Charles Q., Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility.

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35. Miller, G. Laurie; Swedek, Boguslaw A.; Birang, Manoocher, Eddy current apparatus and method for in-situ profile measurement.

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36. Bennett, Doyle E.; Osterheld, Thomas H., Eddy current gain compensation.

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37. Hanawa, Hiroji; Johansson, Nils; Swedek, Boguslaw; Birang, Manoocher, Eddy current sensing of metal removal for chemical mechanical polishing.

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38. Mandl Roland,DEX ; Mednikov Felix,RUX ; Netschaewsky Mark,RUX ; Wisspeintner Karl,DEX, Eddy current sensor.

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39. Felix Mednikov DE; Roland Mandl DE; Mark Netschaevsky RU, Eddy current sensor for analyzing a test object and method of operating same.

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40. Iravani, Hassan G.; Carlsson, Ingemar; Swedek, Boguslaw A., Eddy current sensor with enhanced edge resolution.

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41. Miller,G. Laurie; Swedek,Boguslaw A.; Birang,Manoocher, Eddy current system for in-situ profile measurement.

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42. Miller, G. Laurie; Swedek, Boguslaw A.; Birang, Manoocher, Eddy current system having an elongated core for in-situ profile measurement.

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43. Sarfaty,Moshe; Sreenivasan,Ramaswamy; Nulman,Jaim, Eddy-optic sensor for object inspection.

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44. Krishnamurthy,Badri N.; Hawkins,Parris C. M., Experiment management system, method and medium.

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45. Fukuda,Hiroaki, Fail analysis device.

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46. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Prabhu, Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.

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47. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Prabhu,Gopalakrishna B., Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles.

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48. Shanmugasundram, Arulkumar P.; Schwarm, Alexander T.; Iliopoulos, Ilias; Parkhomovsky, Alexander; Seamons, Martin J., Feedback control of plasma-enhanced chemical vapor deposition processes.

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49. Paik,Young Joseph, Feedforward and feedback control for conditioning of chemical mechanical polishing pad.

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50. Budiarto, Edward W.; Egan, Todd J.; Dzilno, Dmitry A., Film measurement.

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51. Chi, Yuehshian T.; Hawkins, Parris C. M.; Jin, Qiaolin, Generic interface builder.

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52. Goldfine,Neil J.; Zilberstein,Vladimir A.; Schlicker,Darrell E.; Grundy,David C.; Shay,Ian; Washabaugh,Andrew P., High resolution inductive sensor arrays for material and defect characterization of welds.

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53. Nikolenko, Yury, Impedance resonance sensor for real time monitoring of different processes and methods of using same.

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54. Kesil, Boris; Nikolenko, Yury, Impedance sensing systems and methods for use in measuring constituents in solid and fluid objects.

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55. Goldfine, Neil J.; Schlicker, Darrell E.; Zahn, Markus; Ryan, Wayne D.; Shay, Ian C.; Washabaugh, Andrew, Inspection method using penetrant and dielectrometer.

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56. Swedek, Boguslaw A.; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.

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57. Swedek, Boguslaw A; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.

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58. Swedek,Boguslaw A.; Birang,Manoocher; Johansson,Nils, Integrated endpoint detection system with optical and eddy current monitoring.

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59. Shanmugasundram,Arulkumar P.; Schwarm,Alexander T., Integrating tool, module, and fab level control.

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60. Reiss,Terry P.; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T., Integration of fault detection with run-to-run control.

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61. Miyata,Kenji, Magnetic field analysis method and programs for rotating machines.

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62. Goldfine Neil J. ; Schlicker Darrell E. ; Zahn Markus ; Ryan Wayne D., Magnetometer with waveform shaping.

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63. Tonack,Mark, Maintenance request systems and methods.

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64. Tonack,Mark; Abelman,Henry M.; Algiene,Kenneth, Maintenance request systems and methods.

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65. Tonack,Mark; Abelman,Henry M.; Algiene,Kenneth, Maintenance request systems and methods.

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66. Kumar, Sankaran; Avrin, William Frank; Trammell, III, Hoke Smith; Menon, Suresh Meempat, Material thickness measurement using magnetic information.

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67. Buttle, David John, Measurement of the variation of a material property with depth in a ferromagnetic material.

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68. Buttle,David John, Measurement with a magnetic field.

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69. Reining,William N., Method and apparatus for metal target proximity detection at long distances.

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70. Hanawa, Hiroji; Johansson, Nils; Swedek, Boguslaw; Birang, Manoocher, Method and apparatus for monitoring a metal layer during chemical mechanical polishing.

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71. Hanawa,Hiroji; Johansson,Nils; Swedek,Boguslaw; Birang,Manoocher, Method and apparatus for monitoring a metal layer during chemical mechanical polishing.

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72. Spitaels, James S.; Rasmussen, Neil, Method and apparatus for preventing overloads of power distribution networks.

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73. Spitaels, James; Rasmussen, Neil, Method and apparatus for preventing overloads of power distribution networks.

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74. Spitaels,James; Rasmussen,Neil, Method and apparatus for preventing overloads of power distribution networks.

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75. Hoyte, Scott Mordin; Ferguson, Jeremiah Robert, Method and apparatus for using eddy current transducers in magnetic fields.

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76. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.

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77. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.

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78. Hoyte,Scott Mordin; Slates,Richard Dale, Method and system for multi-frequency inductive ratio measurement.

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79. Hoyte,Scott Mordin; Slates,Richard Dale, Method and system for multi-frequency inductive ratio measurement.

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80. Neil J. Goldfine ; Kevin G. Rhoads ; Karen E. Walrath ; David C. Clark, Method for characterizing coating and substrates.

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81. Matsuda,Katsuhiko, Method for collecting remote maintenance and diagnostic data from subject equipment, other device and manufacturing execution system.

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82. Slates, Richard D., Method for digitally measuring electrical impedance.

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83. Linder, Sten, Method for inductive measurement of a dimension of an object.

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84. Slates, Richard D., Method for measuring a characteristic of a conductive target material using a proximity probe.

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85. Slates, Rich, Method for measuring a gap between a proximity probe and a conductive target material.

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86. Slates, Richard D., Method for measuring a gap between a proximity probe and a conductive target material.

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87. Slates, Richard D., Method for measuring a gap between a proximity probe and a conductive target material.

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88. Slates, Richard D., Method for measuring a gap between a proximity probe and a conductive target material.

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89. Slates, Richard D., Method for measuring a gap between a proximity probe and a conductive target material.

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90. Slates, Richard D., Method for measuring a gap between a proximity probe and a conductive target material.

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91. Slates, Richard D., Method for measuring a gap between a proximity probe and a conductive target material.

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92. Slates, Richard D., Method for measuring a position of a conductive target material.

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93. Crouzen, Paulus Carolus Nicolaas; Looljer, Mark Theodoor; van der Steen, Johan, Method for measuring the wall thickness of an electrically conductive object.

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94. Hanawa, Hiroji; Johansson, Nils; Swedek, Boguslaw; Birang, Manoocher, Method for monitoring a metal layer during chemical mechanical polishing using a phase difference signal.

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95. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Pan,Rong; Hernandez,Manuel; Mohammad,Amna, Method of feedback control of sub-atmospheric chemical vapor deposition processes.

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96. Kokotov,Yuri; Entin,Efim; Seror,Jacques; Fisher,Yossi; Sarel,Shalomo; Shanmugasundram,Arulkumar P.; Schwarm,Alexander T.; Paik,Young Jeen, Method, system and medium for controlling manufacture process having multivariate input parameters.

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97. Al Bayati,Amir; Adibi,Babak; Foad,Majeed; Somekh,Sasson, Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements.

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98. Schwarm,Alexander T.; Shanmugasundram,Arulkumar P.; Seror,Jacques; Kokotov,Yuri; Entin,Efim, Method, system, and medium for handling misrepresentative metrology data within an advanced process control system.

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99. Bailey, III,Andrew D., Methods and apparatus for determining the thickness of a conductive layer on a substrate.

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100. Bailey, III,Andrew D., Methods and apparatus for optimizing an electrical response to a set of conductive layers on a substrate.

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101. Redko, Volodymyr I; Shembel, Elena M; Khandetskyy, Volodymyr S; Meshri, Dayal T; Angres, Isaac A; Adams, Robert; Sivtsov, Dmytro; Redko, Oxana V; Pastushkin, Tymofiy V, Methods and systems for non-destructive determination of fluorination of carbon powders.

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102. Neil J. Goldfine ; Markus Zahn ; Alexander V. Mamishev ; Darrell E. Schlicker ; Andrew P. Washabaugh, Methods for processing, optimization, calibration and display of measured dielectrometry signals using property estimation grids.

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103. Shimizu,Koichi, Micromagnetization analytical program and apparatus.

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104. Hanawa,Hiroji; Johansson,Nils; Swedek,Boguslaw; Birang,Manoocher, Monitoring a metal layer during chemical mechanical polishing.

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105. Slates, Richard Dale, Multi-coil eddy current proximity probe system.

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106. Somekh, Sasson; Grunes, Howard E., Multi-tool control system, method and medium.

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107. Nikolenko, Yury, NMR spectroscopy device based on resonance type impedance (IR) sensor and method of NMR spectra acquisition.

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108. Denis, Kevin L, Non-contacting crack sensor.

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109. Arai, Makoto, Non-destructive inspection device.

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110. Prabhakaran,Joy P; Srinivasmurthy,Jayaram B, Potentiometer providing a high resolution.

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111. Kiss, Michael; Kohla, Bernhard; Graze, Bernd, Process and device for differentiating objects influencing an electromagnetic alternating field, in particular metal objects.

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112. Paik,Young J., Process control by distinguishing a white noise component of a process variance.

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113. Paik,Young Jeen, Process control by distinguishing a white noise component of a process variance.

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114. Al-Hamrani, Majed, Reactive power optimization with adaptive excitation control.

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115. Xiaofeng Yang ; Michael Nagy, Resistive bridge interface circuit.

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116. Neil J. Goldfine ; Darrell E. Schlicker ; Markus Zahn ; Wayne D. Ryan ; Yanko Sheiretov ; Andrew Washabaugh, Segmented field dielectrometer.

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117. Padhi,Deenesh; Gandikota,Srinivas; Naik,Mehul; Parikh,Suketu A.; Dixit,Girish A., Selective metal encapsulation schemes.

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118. Swedek,Boguslaw A.; Birang,Manoocher, Signal improvement in eddy current sensing.

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119. Sobel, Jarl, Signal processing method and unit for a dimension-gauging system.

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120. LeGore,Lawrence J.; Jackson, III,Robert H.; Yang,Zhong Yu; DeNoyer,Linda K.; Kleban,Peter H.; Frederick,Brian G., Spectroscopy instrument using broadband modulation and statistical estimation techniques to account for component artifacts.

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121. LeGore,Lawrence J.; Jackson, III,Robert H.; Yang,Zhong Yu; DeNoyer,Linda K.; Kleban,Peter H.; Frederick,Brian G., Spectroscopy instrument using broadband modulation and statistical estimation techniques to account for component artifacts.

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122. Swedek, Boguslaw A; Johansson, Nils; Wiswesser, Andreas Norbert; Birang, Manoocher, System and method for in-line metal profile measurement.

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123. Swedek,Boguslaw A; Johansson,Nils; Wiswesser,Andreas Norbert; Birang,Manoocher, System and method for in-line metal profile measurement.

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124. Ziarani,Alireza K., System and method of extraction of nonstationary sinusoids.

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125. Schwarm,Alexander T., System, method, and medium for monitoring performance of an advanced process control system.

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126. Surana,Rahul; Zutshi,Ajoy, Technique for process-qualifying a semiconductor manufacturing tool using metrology data.

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127. Neil J. Goldfine, Test circuit on flexible membrane with adhesive.

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128. Goldfine Neil J., Test material analysis using offset scanning meandering windings.

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129. McLaurin,Teresa Louise; Frederick,Frank David, Testing memory access signal connections.

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130. Palou-Rivera, Ignasi; Swedek, Boguslaw A.; Karuppiah, Lakshmanan, Wafer edge characterization by successive radius measurements.

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