이 특허를 인용한 특허 (41)

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10. Harrison Donald G., Method and apparatus for molding thermosetting polymers onto substrates.

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18. Huang Chien Ping,TWX ; Huang Yang Chun,TWX ; Yu Kevin,TWX ; Chen Sheng-Fang,TWX, Method of encapsulating a chip.

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19. Wensel Richard W., Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate.

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20. Nakao Junichi,JPX, Method of making a composite button of an electrical device.

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21. De Volder, Edmond; Huber, Dietmar; Doering, Andreas; Schillinger, Jakob; Watzlawik, Martin; Biebricher, Lothar, Method of manufacturing a sensor.

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22. Harrison Donald G., Molding thermosetting polymers onto substrates.

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23. Harrison Donald G., Molding thermosetting polymers onto substrates.

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29. Guy T. Blalock ; Bradley J. Howard, Self-limiting method of reducing contamination in a contact opening, method of making contacts and semiconductor devices therewith, and resulting structures.

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30. De Volder, Edmond; Huber, Dietmar; Doering, Andreas; Schillinger, Jakob; Watzlawik, Martin; Biebricher, Lothar, Sensor element and carrier element for manufacturing a sensor.

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31. Hsu Kao-Yu,TWX ; Lee Shih Chang,TWX ; Kung Wei-Chun,TWX, Substrate strip for use in packaging semiconductor chips.

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32. Kao-Yu Hsu TW; Shih Chang Lee TW; Wei-Chun Kung TW, Substrate strip for use in packaging semiconductor chips and method for making the substrate strip.

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33. Wensel Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.

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34. Wensel Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.

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35. Wensel Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.

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36. Wensel, Richard W., Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.

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37. Richard W. Wensel, Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device.

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38. Wensel Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.

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39. Wensel, Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.

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40. Wensel, Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.

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41. Wensel, Richard W., Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device.

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