이 특허를 인용한 특허 (207)

1. GanapathiSubramanian,Mahadevan; Sreenivasan,Sldlgata V., Adaptive shape substrate support method.

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2. Sreenivasan, Sidlgata V; Watts, Michael P. C.; Choi, Byung J.; Voisin, Ronald D., Alignment methods for imprint lithography.

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3. Soane, David S.; Tagge, Christopher D., Anti-pathogenic air filtration media and air handling devices having protective capabilities against infectious airborne mircoorganisms.

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4. El-Siblani, Ali, Apparatus and method for forming three-dimensional objects from solidifiable paste.

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5. El-Siblani, Ali, Apparatus and method for forming three-dimensional objects from solidifiable paste.

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6. Hagenau William R., Apparatus and method for production of three-dimensional models by spatial light modulator.

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7. John,Hendrik, Apparatus for manufacturing a three-dimensional object.

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8. Hickerson,Kevin P.; Bedal,Bryan; Diephuis,Richard J., Apparatus for three dimensional printing using image layers.

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9. Hsieh, George; Dishongh, Terrance J.; Armendariz, Norman J.; Spaulding, David V., Attaching components to a printed circuit card.

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10. Hsieh, George; Dishongh, Terrance J.; Armendariz, Norman J.; Spaulding, David V., Attaching components to a printed circuit card.

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11. Hsieh, George; Dishongh, Terrance J.; Armendariz, Norman J.; Spaulding, David V., Attaching components to a printed circuit card.

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12. Choi,Byung Jin; Sreenivasan,Sidlgata V.; Watts,Michael P. C., Capillary imprinting technique.

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13. Cherala, Anshuman; Choi, Byung Jin; Lad, Pankaj B.; Shackleton, Steven C., Chucking system comprising an array of fluid chambers.

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14. Akram, Salman; Ahmad, Syed Sajid, Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same.

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15. Akram, Salman; Ahmad, Syed Sajid, Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same.

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16. Akram,Salman; Ahmad,Syed Sajid, Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same.

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17. Akram,Salman; Ahmad,Syed Sajid, Collars, support structures, and forms for protruding conductive structures.

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18. Watts,Michael P. C.; Voisin,Ronald D.; Sreenivasan,Sidlgata V., Compliant hard template for UV imprinting.

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19. Xu, Frank Y., Composition for adhering materials together.

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20. Xu,Frank Y.; Miller,Michael N.; Watts,Michael P. C., Composition for an etching mask comprising a silicon-containing material.

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21. Xu,Frank Y.; Miller,Michael N., Composition to reduce adhesion between a conformable region and a mold.

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22. Sreenivasan, Sidlgata V.; Choi, Byung-Jin; Voisin, Ronald D., Conforming template for patterning liquids disposed on substrates.

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23. Sreenivasan,Sidlgata V; Choi,Byung J.; Voisin,Ronald D., Conforming template for patterning liquids disposed on substrates.

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24. Shkolnik, Alexandr; El-Siblani, Ali; John, Hendrik, Continuous generative process for producing a three-dimensional object.

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25. El-Siblani, Ali; Schillen, Volker; John, Hendrik, Device and method for producing a three-dimensional object by means of mask exposure.

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26. John, Hendrik; Schillen, Volker; El-Siblani, Ali, Device and method for producing a three-dimensional object by means of mask exposure.

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27. John, Hendrik; Schillen, Volker; El-Siblani, Ali, Device and method for producing a three-dimensional object by means of mask exposure.

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28. Hofmann, Robert; Turck, Harald; Mattes, Thomas, Device for producing a three-dimensional object, especially a laser sintering machine.

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29. Allen, Mark; Book, Wayne J.; Ebert-Uphoff, Imme; Glezer, Ari; Rosen, David W.; Rossignac, Jaroslaw R., Digital clay apparatus and method.

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30. Allen,Mark; Book,Wayne J.; Ebert Uphoff,Imme; Glezer,Ari; Rosen,David W.; Rossignac,Jaroslaw R., Digital clay apparatus and method.

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31. Kawanami, Eriko; Onuki, Ichiro; Ogura, Shigeo, Display element and display device having it.

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32. Buser, Anthony James; Douglas, Ariel; Lawton, Jennifer J.; McGuire, Robert M.; Pettis, Nathaniel B., Displays for three-dimensional printers.

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33. Zhang,Xiang, Dynamic mask projection stereo micro lithography.

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34. Sperry, Charles R.; McNamara, Jr., Dennis F.; Scott, Suzanne M.; Hull, Charles W.; Mojdeh, Mehdi, Elevator and method for tilting solid image build platform for reducing air entrainment and for build release.

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35. Sreenivasan,Sidlgata V., Eliminating printability of sub-resolution defects in imprint lithography.

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36. Nimmakayala, Pawan Kumar; Choi, Byung-Jin; Rafferty, Tom H.; Schumaker, Philip D., Enhanced multi channel alignment.

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37. Wang,David C.; Xu,Frank Y., Etching technique to planarize a multi-layer structure.

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38. Fletcher, Edward B.; Ye, Zhengmao; LaBrake, Dwayne L.; Xu, Frank Y., Facilitating adhesion between substrate and patterned layer.

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39. Choi, Byung J.; Sreenivasan, Sidlgata V., Flexure based macro motion translation stage.

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40. O'Connor, Stephen D.; Dantsker, Eugene; Pezzuto, Marci, Fluidic impedances in microfluidic system.

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41. Karp, Christoph D.; O'Connor, Stephen D.; Patel, Paren P., Fluidic mixer in microfluidic system.

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42. Choi, Byung Jin; Meissl, Mario J.; Sreenivasan, Sidlagata V.; Watts, Michael P. C., Formation of discontinuous films during an imprint lithography process.

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43. Choi,Byung Jin; Meissl,Mario J.; Sreenivasan,Sidlagata V.; Watts,Michael P. C., Formation of discontinuous films during an imprint lithography process.

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44. Choi, Byung Jin; Sreenivasan, Sidlgata V.; Johnson, Stephen C., High precision orientation alignment and gap control stages for imprint lithography processes.

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45. Mutch, William R.; Fiore, Thomas F.; Porras, Randall A.; Thompson, Chester O. D., High security key scanning system.

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46. Sreenivasan, Sidlgata V.; Choi, Byung J.; Colburn, Matthew; Bailey, Todd, High-resolution overlay alignment methods for imprint lithography.

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47. Voisin, Ronald D., Imprint alignment method, system and template.

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48. Voisin, Ronald D., Imprint alignment method, system, and template.

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49. GanapathiSubramanian, Mahadevan; Choi, Byung-Jin; Meissl, Mario Johannes, Imprint lithography system and method.

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50. Bailey,Todd C.; Choi,Byung Jin; Colburn,Matthew E.; Sreenivasan,Sidlgata V.; Willson,Carlton G.; Ekerdt,John G., Imprint lithography template having a feature size under 250 nm.

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51. Sreenivasan,Sidlgata V.; Schumaker,Philip D., Imprint lithography template having opaque alignment marks.

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52. Sreenivasan, Sidlgata V.; Choi, Byung-Jin, Imprinting of partial fields at the edge of the wafer.

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53. Nimmakayala,Pawan Kumar; Rafferty,Tom H.; Aghili,Alireza; Choi,Byung Jin; Schumaker,Philip D.; Babbs,Daniel A., Interferometric analysis for the manufacture of nano-scale devices.

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54. Nimmakayala, Pawan Kumar; Rafferty, Tom H.; Aghili, Alireza; Choi, Byung Jin; Schumaker, Philip D.; Babbs, Daniel A.; Truskett, Van N., Interferometric analysis method for the manufacture of nano-scale devices.

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55. Nimmakayala, Pawan Kumar; Rafferty, Tom H.; Aghili, Alireza; Choi, Byung-Jin; Schumaker, Philip D.; Babbs, Daniel A.; Truskett, Van Nguyen, Interferometric analysis method for the manufacture of nano-scale devices.

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56. Thompson, Chester O. D.; Mutch, William R.; Porras, Randall A., Key blank identification system with bitting analysis.

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57. Thompson, Chester O. D.; Mutch, William R., Key blank identification system with groove scanning.

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58. Thompson, Chester O. D.; Mutch, William R., Key blank identification system with groove scanning.

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59. Bass, Michael A.; Mutch, William R.; Ryai, Sr., Richard W.; Thompson, Chester O. D.; Drake, Robert E.; Porras, Randall A., Key duplication machine.

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60. Bass, Michael A.; Mutch, William R.; Ryai, Sr., Richard W.; Thompson, Chester O. D.; Drake, Robert E.; Porras, Randall A., Key duplication machine.

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61. Bass, Michael A.; Mutch, William R.; Ryai, Sr., Richard W.; Thompson, Chester O. D.; Drake, Robert E.; Porras, Randall A., Key duplication machine.

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62. Mutch, William R.; Porras, Randall A.; Fiore, Thomas F., Key duplication machine.

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63. Mutch, William R.; Porras, Randall A.; Fiore, Thomas F., Key duplication machine.

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64. Prejean, Ronald Martin, Key manufacturing method.

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65. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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66. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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67. Farnworth, Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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68. Farnworth,Warren M., Layer thickness control for stereolithography utilizing variable liquid elevation and laser focal length.

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69. Withey, Paul Anthony; Schlienger, Max Eric, Manufacture of field activated components by stereolithography.

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70. Bredt, James F.; Anderson, Timothy; Russell, David B.; Clark, Sarah L.; DiCologero, Matthew J., Material systems and methods of three-dimensional printing.

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71. Xu, Frank Y.; Watts, Michael P. C.; Stacey, Nicholas A., Materials for imprint lithography.

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72. Blom,Claes; Vieider,Christian; Larsson,Olov, Metallic building element for optoelectronics.

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73. Jeffrey M. Smith, Method and apparatus for creating three-dimensional objects by cross-sectional lithography.

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74. Chartoff Richard P. ; Schultz John W. ; Ullett Jill S., Method and apparatus for stereolithography.

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75. Schillen, Volker; John, Hendrik; Siblani, Ali, Method and device for producing a three-dimensional object, and computer and data carrier useful therefor.

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76. Droscher Michael,DEX ; Schmidt Friedrich Georg,DEX, Method and device for producing three-dimensional objects.

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77. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Method and system for double-sided patterning of substrates.

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78. Xu, Frank Y., Method for adhering materials together.

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79. Xu, Frank; McMackin, Ian; Lad, PanKaj B.; Watts, Michael P. C., Method for controlling distribution of fluid components on a body.

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80. Schumaker, Philip D., Method for detecting a particle in a nanoimprint lithography system.

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81. Choi, Byung-Jin; GanapathiSubramanian, Mahadevan; Choi, Yeong-jun; Meissl, Mario J., Method for expelling gas positioned between a substrate and a mold.

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82. Choi, Byung-Jin; Sreenivasan, Sidlgata V.; McMackin, Ian M.; Lad, Pankaj B., Method for expelling gas positioned between a substrate and a mold.

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83. Choi, Byung-Jin; Sreenivasan, Sidlgata V.; McMackin, Ian Matthew; Lad, Pankaj B., Method for expelling gas positioned between a substrate and a mold.

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84. Watts,Michael P. C.; Sreenivasan,Sidlgata V., Method for fabricating bulbous-shaped vias.

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85. Willson, Carlton Grant; Sreenivasan, Sidlgata V.; Bonnecaze, Roger T., Method for fabricating nanoscale patterns in light curable compositions using an electric field.

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86. McMackin, Ian M.; Lad, Pankaj B.; Truskett, Van N., Method for fast filling of templates for imprint lithography using on template dispense.

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87. Faber, Jacob Simon; Mulders, Johannes Jacobus Lambertus; de Jong, Alan Frank; van Vilsteren, Carmen Francisca Maria, Method for forming microscopic 3D structures.

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88. Neckers Douglas C. ; Specht Kathleen G. ; Grinevich Oleg V. ; Mejiritski Alexandre, Method for forming polymeric patterns, relief images and colored polymeric bodies using digital light processing technology.

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89. Xu, Frank Y.; Sreenivasan, Sidlgata V.; Fletcher, Edward Brian, Method for imprint lithography utilizing an adhesion primer layer.

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90. Jones, Ronald D., Method for making freeform-fabricated core composite articles.

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91. John, Hendrik; Schillen, Volker; El-Siblani, Ali, Method for producing a three-dimensional object by means of mask exposure.

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92. Batchelder John Samuel ; Crump Steven Scott, Method for rapid prototyping of solid models.

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93. Choi, Byung-Jin; Sreenivasan, Sidlgata V.; Willson, Carlton Grant; Colburn, Mattherw E.; Bailey, Todd C.; Ekerdt, John G., Method of automatic fluid dispensing for imprint lithography processes.

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94. Sreenivasan,Sidlgata V.; Xu,Frank Y., Method of compensating for a volumetric shrinkage of a material disposed upon a substrate to form a substantially planar structure therefrom.

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95. Sreenivasan, Sidlgata V.; McMackin, Ian M.; Melliar-Smith, Christopher Mark; Choi, Byung-Jin, Method of concurrently patterning a substrate having a plurality of fields and a plurality of alignment marks.

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96. LaBrake,Dwayne L., Method of controlling the critical dimension of structures formed on a substrate.

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97. McMackin, Ian M.; Stacey, Nicholas A.; Babbs, Daniel A.; Voth, Duane J.; Watts, Mathew P. C.; Truskett, Van N.; Xu, Frank Y.; Voisin, Ronald D.; Lad, Pankaj B., Method of creating a turbulent flow of fluid between a mold and a substrate.

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98. Sreenivasan,Sidlgata V., Method of forming a recessed structure employing a reverse tone process.

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99. Vidusek,David A.; Sreenivasan,Sidlgata V.; Wang,David C., Method of forming an in-situ recessed structure.

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100. Sreenivasan,Sidlgata V., Method of forming stepped structures employing imprint lithography.

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101. Andre ; Sr. Larry Edward, Method of incremental layered object fabrication.

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102. Miller,Michael N.; Stacey,Nicholas A., Method of patterning surfaces while providing greater control of recess anisotropy.

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103. Sreenivasan,Sidlgata V., Method of planarizing a semiconductor substrate with an etching chemistry.

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104. Rubin, Daniel I., Method of reducing pattern distortions during imprint lithography processes.

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105. Choi, Byung Jin; Cherala, Anshuman; Babbs, Daniel A., Method of retaining a substrate to a wafer chuck.

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106. Schleier-Smith, Johann M., Method of robotic manipulation using fluidic patterning.

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107. Sreenivasan, Sidlgata V.; Watts, Michael P. C., Method to arrange features on a substrate to replicate features having minimal dimensional variability.

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108. Choi, Yeong-Jun; Choi, Byung-Jin, Method to control an atmosphere between a body and a substrate.

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109. Choi,Byung Jin; Xu,Frank Y.; Stacey,Nicholas A.; Truskett,Van Xuan Hong; Watts,Michael P. C., Method to reduce adhesion between a conformable region and a pattern of a mold.

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110. Truskett,Van N.; Mackay,Christopher J.; Choi,B. Jin, Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer.

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111. Johnston, Scott Robert; Vance, Jonathan Blake; Fonda, James William; Lyons, Brett Ian, Method, apparatus and material mixture for direct digital manufacturing of fiber reinforced parts.

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112. Richard P. Chartoff ; John W. Schultz ; Jill S. Ullett, Methods and apparatus for producing ordered parts from liquid crystal monomers.

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113. Bredt, James F.; Clark, Sarah L.; Uy, Evert F.; DiCologero, Matthew J.; Anderson, Timothy; Tarkanian, Michael; Williams, Derek X., Methods and compositions for three-dimensional printing of solid objects.

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114. Williams,Vernon M., Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads.

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115. Farnworth,Warren M.; Wood,Alan G., Methods for forming protective layers on semiconductor device substrates.

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116. Choi, Byung J.; Colburn, Matthew; Sreenivasan, S. V.; Willson, C. Grant; Bailey, Todd; Ekerdt, John, Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography.

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117. Tandy,William D.; Street,Bret K., Methods for marking a bare semiconductor die including applying a tape having energy-markable properties.

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118. Tandy,William D.; Street,Bret K., Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape.

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119. Grigg,Ford B., Methods for providing support for conductive structures protruding from semiconductor device components.

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120. Adzima, Brian, Methods for stereolithography three-dimensional printing.

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121. Hirata Yoshihiro,JPX ; Haga Tsuyoshi,JPX, Microconnector and method of manufacturing the same.

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122. O'Connor, Stephen D.; Dantsker, Eugene; Pezzuto, Marci, Microfluidic systems with inter-channel impedances.

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123. McMackin,Ian M.; Lad,Pankaj B., Moat system for an imprint lithography template.

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124. Zenere, Sergio, Modeling plate for a stereolithography machine, stereolithography machine using said modeling plate and tool for cleaning said modeling plate.

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125. Karp, Christoph D.; Covington, Joseph F., Multi-stream microfludic mixers.

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126. Karp, Christoph D., Multi-stream microfluidic aperture mixers.

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127. Cherala,Anshuman; Lad,Pankaj B.; McMackin,Ian M.; Choi,Byung Jin, Partial vacuum environment imprinting.

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128. Sreenivasan, Sidlgata V., Pattern reversal employing thick residual layers.

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129. Sreenivasan, Sidlgata V.; Schumaker, Philip D., Patterning a plurality of fields on a substrate to compensate for differing evaporation times.

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130. Stacey,Nicholas A.; Sreenivasan,Sidlgata V.; Miller,Michael N., Patterning substrates employing multi-film layers defining etch-differential interfaces.

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131. Choi, Byung-Jin; Sreenivasan, Sidlgata V., Patterning substrates employing multiple chucks.

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132. Yamamura, Tetsuya; Takeuchi, Akira; Watanabe, Tsuyoshi; Ukachi, Takashi, Photocurable liquid resin composition.

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133. Sreenivasan,Sidlgata V., Positive tone bi-layer imprint lithography method.

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134. Sreenivasan, Sidlgata V., Positive tone bi-layer method.

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135. El-Siblani, Ali, Process and device for producing a three-dimensional object.

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136. El-Siblani, Ali, Process and device for producing a three-dimensional object.

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137. Schillen, Volker; El-Siblani, Ali, Process and device for producing a three-dimensional object.

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138. El-Siblani, Ali, Process and freeform fabrication system for producing a three-dimensional object.

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139. El-Siblani, Ali, Process and freeform fabrication system for producing a three-dimensional object.

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140. El-Siblani, Ali, Process and freeform fabrication system for producing a three-dimensional object.

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141. El-Siblani, Ali; Shkolnik, Alexandr; John, Hendrik, Process for the production of a three-dimensional object with an improved separation of hardened material layers from a construction plane.

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142. Shkolnik, Alexandr; John, Hendrik; El-Siblani, Ali, Process for the production of a three-dimensional object with an improved separation of hardened material layers from a construction plane.

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143. Shkolnik, Alexandr; John, Hendrik; El-Sibiani, Ali, Process for the production of a three-dimensional object with resolution improvement by pixel-shift.

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144. Shkolnik, Alexandr; John, Hendrik; El-Siblani, Ali, Process for the production of a three-dimensional object with resolution improvement by “pixel shift”.

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145. Shkolnik, Alexandr; John, Hendrik; El-Siblani, Ali, Process for the production of a three-dimensional object with resolution improvement by “pixel-shift”.

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146. Kasumi, Kazuyuki; Ota, Hirohisa; Kawakami, Eigo; Nakamura, Takashi; Tokita, Toshinobu, Processing apparatus.

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147. Williams,Vernon M., Programmed material consolidation methods for fabricating printed circuit board.

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148. Johnston Richard R. ; Czesak Theodore M. ; Scott Anthony J. ; Beaufils Igor F., Prototype mold for blow-molding hollow plastic containers and method of making same.

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149. Bo Yang ; Ming C. Leu, Rapid production of engineering tools and hollow bodies by integration of electroforming and solid freeform fabrication.

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150. Lipsker Daniel,ILX, Rapid prototyping.

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151. Williams, Vernon M.; Grigg, Ford B.; Street, Bret K., Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same.

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152. Choi,Byung Jin; Sreenivasan,Sidlgata V.; Johnson,Stephen C., Remote center compliant flexure device.

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153. Jones, Christopher Ellis; Khusnatdinov, Niyaz; Johnson, Stephen C.; Schumaker, Philip D.; Lad, Pankaj B., Residual layer thickness measurement and correction.

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154. El-Siblani, Ali; Shkolnik, Alexandr, Resin solidification substrate and assembly.

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155. El-Siblani, Ali; Shkolnik, Alexandr, Resin solidification substrate and assembly.

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156. Sreenivasan,Sidlgata V.; Stacey,Nicholas A., Reverse tone patterning on surfaces having planarity perturbations.

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157. Grigg, Ford B., Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad.

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158. Grigg, Ford B., Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad.

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159. Grigg, Ford B., Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad.

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160. Schleier-Smith, Johann M., Robotic manipulation system utilizing fluidic patterning.

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161. Williams, Vernon M., Selective consolidation processes for electrically connecting contacts of semiconductor device components.

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162. Schmid, Gerard M.; Stacey, Nicholas A; Resnick, Douglas J.; Voisin, Ronald D.; Myron, Lawrence J., Self-aligned process for fabricating imprint templates containing variously etched features.

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163. Farnworth,Warren M.; Wood,Alan G., Semiconductor devices including protective layers on active surfaces thereof.

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164. Xu, Frank Y.; Khusnatdinov, Niyaz, Single phase fluid imprint lithography method.

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165. Carlton Grant Willson ; Matthew Earl Colburn, Step and flash imprint lithography.

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166. Willson, Carlton Grant; Colburn, Matthew Earl, Step and flash imprint lithography.

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167. Sreenivasan, Sidlgata V.; Choi, Byung J.; Schumaker, Norman E.; Voisin, Ronald D.; Watts, Michael P. C.; Meissl, Mario J., Step and repeat imprint lithography processes.

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168. Sreenivasan,Sidlgata V.; Choi,Byung J.; Schumaker,Norman E.; Voisin,Ronald D.; Watts,Michael P. C.; Meissl,Mario J., Step and repeat imprint lithography processes.

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169. Farnworth, Warren M., Stereolithographic method for applying materials to electronic component substrates and resulting structures.

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170. Williams, Vernon M., Stereolithographic methods for fabricating conductive elements.

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171. Farnworth, Warren M.; Wood, Alan G., Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed.

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172. Williams, Vernon M., Stereolithographic methods for securing conductive elements to contacts of semiconductor device components.

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173. Vernon M. Williams, Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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174. Vernon M. Williams, Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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175. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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176. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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177. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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178. Williams, Vernon M., Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods.

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179. Farnworth, Warren M.; Duesman, Kevin G., Stereolithographically packaged, in-process semiconductor die.

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180. Kihara, Nobuhiro; Kuzusako, Junichi; Honda, Katsuhisa, Stereolithography apparatus.

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181. Syao, Kao-Chih, Stereolithography apparatus.

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182. Sauerhoefer Marc Raymond, Strong, dimensionally stable object.

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183. Grigg, Ford B., Support ring for use with a contact pad and semiconductor device components including the same.

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184. Grigg,Ford B., Support ring for use with a contact pad and semiconductor device components including the same.

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185. Farnworth, Warren M.; Duesman, Kevin G, Surface smoothing of stereolithographically formed 3-D objects.

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186. Farnworth, Warren M.; Duesman, Kevin G., Surface smoothing of stereolithographically formed 3-D objects.

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187. Farnworth,Warren M.; Duesman,Kevin G., Surface smoothing of stereolithographically formed 3-D objects.

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188. McMackin,Ian M.; Stacey,Nicholas A.; Babbs,Daniel A.; Voth,Duane J.; Watts,Mathew P. C.; Truskett,Van N.; Xu,Frank Y.; Voisin,Ronald D.; Lad,Pankaj B., System for creating a turbulent flow of fluid between a mold and a substrate.

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189. Choi,Byung J.; Sreenivasan,Sidlgata V., System for determining characteristics of substrates employing fluid geometries.

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190. Choi,Yeong Jun; Choi,Byung Jin, System to control an atmosphere between a body and a substrate.

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191. Schumaker, Philip D.; Fancello, Angelo; Kim, Jae H.; Choi, Byung-Jin; Babbs, Daniel A., System to transfer a template transfer body between a motion stage and a docking plate.

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192. Border, John; Mclaughlin, Paul O., Technique for making deep microstructures in photoresist.

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193. GanapathiSubramanian, Mahadevan; Choi, Byung-Jin; Miller, Michael N.; Stacey, Nicholas A., Technique for separating a mold from solidified imprinting material.

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194. Bailey, Todd; Choi, Byung J.; Colburn, Matthew; Sreenivasan, S. V.; Willson, C. Grant; Ekerdt, John, Template for room temperature, low pressure micro-and nano-imprint lithography.

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195. Selinidis, Kosta S.; Choi, Byung-Jin; Schmid, Gerard M.; Thompson, Ecron D.; McMackin, Ian Matthew, Template having alignment marks formed of contrast material.

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196. Sreenivasan, Sidlgata V.; Schumaker, Philip D.; McMackin, Ian M., Tessellated patterns in imprint lithography.

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197. Bredt, James F.; Clark, Sarah L.; Williams, Derek X.; DiCologero, Matthew J., Thermoplastic powder material system for appearance models from 3D printing systems.

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198. Chung, Chan Woo; Ramani, Karthik, Three dimensional object fabrication techniques.

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199. Bredt,James F.; Anderson,Timothy C.; Russell,David B., Three dimensional printing material system and method.

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200. Williams, Derek X., Three dimensional printing material system and method using peroxide cure.

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201. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.

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202. Giller, Eugene; Williams, Derek X., Three dimensional printing material system and method using plasticizer-assisted sintering.

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203. Tamura Yorikazu,JPX ; Hagiwara Tsuneo,JPX, Three-dimensional object by optical stereography and resin composition containing colorant for producing the same.

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204. Alam, Amir; Bredt, James F.; Clark, Nanette; Flynn, Mary; Sprauer, Jean; Williams, Derek X., Three-dimensional printing material system with improved color, article performance, and ease of use.

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205. Xu, Frank Y.; Fletcher, Edward Brian, Ultra-thin polymeric adhesion layer.

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206. Connell, Michael E.; Jiang, Tongbi, Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive.

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207. Connell,Michael E.; Jiang,Tongbi, Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive.

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