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Integrated circuit cooling apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0424791 (1995-04-18)
발명자 / 주소
  • Meyer
  • IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA)
출원인 / 주소
  • Thermacore, Inc. (Lancaster PA 02)
인용정보 피인용 횟수 : 57  인용 특허 : 0

초록 ▼

The apparatus is a cooling device for an integrated circuit chip which includes a heat conductive pad for contact with the top surface of the chip and for attachment to a heat pipe to dispose of the heat. One surface of the pad is flat and contacts the circuit chip while the opposite surface of the

대표청구항 ▼

An apparatus for cooling an integrated circuit chip comprising: an integrated circuit chip with a first surface and a second flat surface; a mounting board to which the integrated circuit chip is attached, with the first surface of the integrated circuit chip in contact with the mounting board and t

이 특허를 인용한 특허 (57)

  1. Habing Robert D. ; Odegard Thomas Allan, Adapter kit to allow extended width wedgelock for use in a circuit card module.
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  8. Webb Matthew L., Computer having a heat sink structure incorporated therein.
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  9. Ram S. Viswanath ; Hong Xie ; Robert Sankman, Computer utilizing refrigeration for cooling.
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  13. Suzuki, Masahiro, Cooling system for electronic packages.
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  15. Erez,Shmuel; Geva,Ehood, Device and method for fastener-free connection via a heat-shrinkable insert.
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  16. Frutschy, Kris; Prasher, Ravi; Distefano, Eric; Sathe, Ajit, Direct heatpipe attachment to die using center point loading.
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  18. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
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  19. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
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  20. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
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  21. Tsai,Kuo Ying; Ku,Shih Chang, Electronic apparatus and thermal dissipating module thereof.
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  22. Chiu George Liang-Tai ; Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Electronic component cooling using a heat transfer buffering capability.
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  23. Tanahashi Makoto,JPX ; Asawa Tsutomu,JPX ; Ichikawa Mitsuru,JPX, Electronic device with improved heat dissipation.
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  24. Bjorndahl William D. ; Tsutsumi Paul T. ; Coronel Ramon ; Espinosa Janice W., Electronics cooling technique for spacecraft modules.
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  25. Gailus, David W; Clemens, Donald L., Heat collector with mounting plate.
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  26. He,Li, Heat dissipating device with heat reservoir.
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  27. Wang, Shaw-Fuu; Huang, Ting-Chiang; Syu, Sheng-Jie; Chen, Chiun-Peng; Chung, Chih-Kuang; Wang, Li-Ting, Heat dissipating module.
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  28. Wu, Hung-Yi; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Heat dissipation assembly.
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  29. Katsui Tadashi,JPX, Heat sink and information processor using heat sink.
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  30. Katsui, Tadashi, Heat sink and information processor using heat sink.
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  31. Tadashi Katsui JP, Heat sink and information processor using heat sink.
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  32. Hougham Gareth Geoffrey ; Mok Lawrence Shungwei, Heat transfer in electronic apparatus.
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  34. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
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  35. Bhate, Suresh K.; Cestra, John; Harrington, Christopher B.; Hoogenboom, Leo, High power density inverter and components thereof.
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  36. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
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  37. Prasher, Ravi; Watwe, Abhay A.; Chrysler, Gregory M.; Frutschy, Kristopher; Ofman, Leo; Sathe, Ajit V., Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment.
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  39. Van Elmpt, Rob Franciscus Maria, Light emitting module, heat sink and illumination system.
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  40. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.
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  42. Kimura Yuichi,JPX ; Yamamoto Masaaki,JPX ; Tanaka Suemi,JPX, Method for manufacturing cooling unit comprising heat pipes and cooling unit.
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  43. Kimura Yuichi,JPX ; Yamamoto Masaaki,JPX ; Tanaka Suemi,JPX, Method for manufacturing cooling unit comprising heat pipes and cooling unit.
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  44. Zimmerman Daniel,CAX ; Corbeil Leo,CAX, Modular multizone heater system and method.
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  45. Kelty, Matthew James, Optical module blind mating heat relay system.
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  46. Facusse, Mario E.; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
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  47. Facusse, Mario; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
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  48. Facusse, Mario, Passive cooling system and method for electronics devices.
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  49. Yamaura, Satoshi, Power conversion apparatus.
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  50. Abe, Koji; Hongo, Takeshi, Pressing member, pressing structure for heat receiving block of substrate, and electronic device.
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  51. Holung Joseph Anthony ; Wong Tin-Lup ; Kamath Vinod, Quick-release hinge joint for heat pipe.
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  52. Shutou Akimi,JPX ; Doi Takashi,JPX, Radiator.
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  53. Park, JaeHong; Lee, Hanhong; Joo, Sungwoo; Baek, Woon-young, Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package.
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  54. Sarraf David B. ; Toth Jerome E. ; Gernert Nelson J., Stress relieved integrated circuit cooler.
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  55. Zhao, Liang Hui; Wu, Yi Qiang, Thermal module.
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  56. Wu, Chun-Ming, Thermal module and manufacturing method thereof.
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  57. Thomas Daniel Lee, Thin, planar heat spreader.
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