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Packaging and cooling structure for the personal processor module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/14
  • G06F-013/00
출원번호 US-0303318 (1994-09-09)
발명자 / 주소
  • Rahamim Uriel (Palo Alto CA) Minobe Randy (San Jose CA) Chahrour Ahmad A. (Santa Clara CA) Ben-Zur Raanan (Campbell CA)
출원인 / 주소
  • Hitachi Computer Products (America), Inc. (Santa Clara CA 02)
인용정보 피인용 횟수 : 72  인용 특허 : 0

초록

A housing and cooling structure for a personal processor module (PPM) is provided which includes a case which is sealed and will fit within both a desktop sized docking station and a smaller notebook sized docking station. Within the case, the components which make up the PPM are located in such a w

대표청구항

A computer system module having high performance and transportability, known as a personal processor module (PPM), for use with any one of a plurality of external clocking stations, each said docking station providing necessary computer system components not provided by said PPM so that said PPM and

이 특허를 인용한 특허 (72)

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  2. Bhatia Rakesh, Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station.
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