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Collapsible cooling apparatus for portable computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • G06F-001/20
출원번호 US-0227779 (1994-04-14)
발명자 / 주소
  • Nelson Daryl J. (Beaverton OR) Noble Scott L. (Beaverton OR)
출원인 / 주소
  • Intel Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 59  인용 특허 : 0

초록

A collapsible heat sink for cooling heat generated by components in a computer system. The heat sink is positioned in an open space formed between a base casing and a bottom cover of the computer system. The heat sink comprises folding fins and cold plates made of conductive surfaces. When the heat

대표청구항

A computer system, comprising: a base casing; a heat source in said base casing; a bottom cover coupled to said base casing such that an open space exists between said base casing and said bottom cover in a first position of said computer system, wherein a minimal space exists between said base casi

이 특허를 인용한 특허 (59)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  2. Sagal, E. Mikhail, Capacitor post with improved thermal conductivity.
  3. Farris-Gilbert, Cezanne-Simon; Adamson-Mohan, Arjun, Collapsible support device.
  4. Farris-Gilbert, Cezanne-Simon; Adamson-Mohan, Arjun, Collapsible support device and composite material for making the same.
  5. Tabasso, Alain; Chevalley, Simone; Monney, Patrick, Comfortable laptop computer stand.
  6. Hood ; III Charles D. ; Utz James, Computer and computer/docking assembly with improved internal cooling.
  7. Tracy, Mark S.; Yin, Memphis-Zhihong, Computer thermal dissipation system and method.
  8. Hood ; III Charles D. ; Utz James, Computer with improved internal cooling system.
  9. Ozaki, Yuzo; Nakai, Yasuhiro; Sonehara, Takashi; Hokao, Shigeyuki; Mizoguchi, Motoshi, Cooling device, cooling method, and electronic apparatus.
  10. Yuzo Ozaki JP; Yasuhiro Nakai JP; Takashi Sonehara JP; Shigeyuki Hokao JP; Motoshi Mizoguchi JP, Cooling device, cooling method, and electronic apparatus.
  11. Jeong,Kwang Jin, Display module.
  12. Sagal, E. Mikhail; Panek, Jeffrey; McCullough, Kevin A., Elastomeric heat sink with a pressure sensitive adhesive backing.
  13. Cheng, Yi-Lun; Wang, Feng-Ku; Yang, Chih-Kai; Lin, Wei-Yi; Chen, Po-Hsuan, Electronic apparatus.
  14. Iwamoto, Akira; Furujiku, Masaru; Matsuyama, Yoshinari, Electronic apparatus.
  15. Lin, Wei-Yi; Wang, Li-Ting; Sun, Kuang-Chung; Huang, Ting-Chiang; Wang, Feng-Ku, Electronic apparatus with improved heat dissipation.
  16. Chen, Hung-Chi; Su, Iou-Ren; Chang, Cheng-Mao; Yeh, Yi-Chang, Electronic device.
  17. Cheng, Wen-Chieh; Wang, Chih-Yi, Electronic device housing having a movable foot pad mechanism.
  18. Wu, Chung Hsin; Lin, Shu Mu, Electronic device including a movable baffle to enhance cooling.
  19. Tye, Trentent; Tye, Troy, Electronic device with deployable air flow enhancing support.
  20. Chu Richard C. ; Chrysler Gregory M., Extended cooling for portable computers.
  21. McCullough, Kevin A.; Sagal, E. Mikhail; Miller, James D., Flexible glove-like heat sink.
  22. McCutcheon, Jeffrey W.; Narum, Timothy N.; Soo, Philip P.; Liu, Yaoqi J., Flexible heat sink.
  23. McCutcheon,Jeffrey W.; Narum,Timothy N.; Soo,Philip P.; Liu,Yaoqi J., Flexible heat sink.
  24. Chen, Kuan-Ting; Clark, Peter Timothy, Foldable electronic apparatus with an enhanced pivotal mechanism.
  25. Altic James E. ; Karl Rex A. ; Vinson Samuel L., Heat frame for portable computer.
  26. Okada, Akira; Imabayashi, Hirofumi; Yajima, Hideaki; Kanasaki, Katsumi; Miyazaki, Takehide; Nishida, Kazuya, Heat radiator.
  27. Miller, James D.; Sagal, E. Mikhail; McCullough, Kevin A., Highly thermally conductive electronic connector.
  28. McCullough, Kevin A.; Miller, James D.; Sagal, Mikhail, Injection moldable elastomeric gasket.
  29. Chen, Qiang, Laptop computer cooling stand.
  30. Trang, Brian T., Laptop elevation device.
  31. Trang, Brian T., Laptop elevation device.
  32. McCullough,Kevin A., Method of applying phase change thermal interface materials.
  33. Sagal, E. Mikhail, Method of making a capacitor post with improved thermal conductivity.
  34. McCullough, Kevin A., Method of manufacturing a structural frame.
  35. Foster, Jon S., Method of manufacturing athermally conductive drive belt.
  36. Eric DiStefano ; Krishna Seshan, Mobile computer having a housing with openings for cooling.
  37. Miller,James D.; Sagal,E. Mikhail; McCullough,Kevin A., Molded electronic connector formed from a thermally conductive polymer composition and method of making the same.
  38. Unrein, Edgar J., Partitioned computer platform.
  39. Schripsema, Jason E.; Janvrin, William M., Photovoltaic module with adjustable heat sink and method of fabrication.
  40. Viswanath Ram S., Pickup chuck with an integral heat pipe.
  41. Cipolla Thomas Mario ; Feger Claudius, Portable computer riser for enhanced cooling.
  42. Chuang, Wei-Pin; Yang, Wei-Che; Chuang, Han-Min; Chin, Hsu-Lung; Chang, Ya-Chu, Portable electronic device capable of enhancing heat dissipation.
  43. Jones,Jeffrey Allen; Jones,Scott Thomas; Kaply,Michael Aaron; Sanchez Cifuentes,Alvaro, Portable electronic device with adaptive sizing.
  44. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  45. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Redundant assembly for a liquid and air cooled module.
  46. Moore Andrew ; Moss David, Smart bi-metallic heat spreader.
  47. Bakker, Willem Hendrik; Elkhuizen, Jan Willem, Support for and method for use of a portable computer.
  48. Law David John ; Janik Craig M., Swiveling computer peripheral support assembly.
  49. Siba, Erick Arsene; Damani, Anil, System and method for managing portable information handling system cooling.
  50. Foster, Jon S., Thermally conductive drive belt.
  51. Sagal, E. Mikhail, Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduit.
  52. Kevin A. McCullough ; E. Mikhail Sagal ; James D. Miller, Thermally conductive electronic device case.
  53. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient computer incorporating deploying CPU module.
  54. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  55. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  56. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
  57. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat.
  58. Thomas Daniel Lee, Thin, planar heat spreader.
  59. Janik Craig M. ; Lillios Tony ; Morgan Garth ; Rohrbach Matthew, Vertical docking and positioning apparatus for a portable computer.
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