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특허 상세정보

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Aqueous electroless plating solutions

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C23C-018/31   
미국특허분류(USC) 106/122 ; 106/125
출원번호 US-0559712 (1995-11-15)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 31  인용 특허 : 10
초록
▼

It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating solution which comprises (A) at least one solution-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, a bismuth salt, an indium salt, a gallium salt and a germanium salt; (B) at least one acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, alkanol sulfonic acids, and mixtures ther...

대표
청구항
▼

An aqueous electroless plating solution for depositing one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium onto a metal surface comprising: (A) at least one solution-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, a bismuth salt, an indium salt, a gallium salt and a germanium salt; (B) at least one acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, alkanol sulfonic acids, and mixtures thereof; (C) a complexing agent which is an imi...

이 특허에 인용된 특허 (10)

  1. Uchida Hiroki (Hirakata JPX) Kubo Motonobu (Hirakata JPX) Kiso Masayuki (Hirakata JPX) Hotta Teruyuki (Hirakata JPX) Kamitamari Tohru (Hirakata JPX). Bath and method for the electroless plating of tin and tin-lead alloy. USP1993115266103.
  2. Nishimura Shigefumi (Yawata JPX) Fukuda Masao (Takatsuki JPX) Shimizu Yoshiji (Higashiosaka JPX). Bath for immersion plating tin-lead alloys. USP1992115160422.
  3. Dodd John R. (Wilmington) Arduengo ; III Anthony J. (Wilmington) King Randal D. (Wilmington DE) Vitale Americus C. (West Chester PA). Complexing agent for displacement tin plating. USP1993035196053.
  4. Wilson Harold P. (Huron OH). Electrodeposited eutectic tin-bismuth alloy on a conductive substrate. USP1991085039576.
  5. Melton Cynthia M. (Bolingbrook IL) Growney Alicia (Barrington IL) Fuerhaupter Harry (Lombard IL). Immersion plating of tin-bismuth solder. USP1995075435838.
  6. Nobel Fred I. (Sands Point NY) Ostrow Barnet D. (Roslyn NY) Schram David N. (Freeport NY). Limiting tin sludge formation in tin or tin/lead electroplating solutions. USP1989104871429.
  7. Opaskar Vince (Cleveland Hts. OH) Canaris Valerie (Parma OH) Willis William J. (North Royalton OH). Plating bath and method for electroplating tin and/or lead. USP1986044582576.
  8. Nakaso Akishi (Oyama JPX) Kaneko Youichi (Shimodate JPX) Okamura Toshiro (Shimodate JPX) Yamanoi Kiyoshi (Shimodate JPX). Process for treating metal surface. USP1987024643793.
  9. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX). Use of immersion tin and tin alloys as a bonding medium for multilayer circuits. USP1987124715894.
  10. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX). Use of immersion tin coating as etch resist. USP1987044657632.

이 특허를 인용한 특허 피인용횟수: 31

  1. Whitney, Jr., Dickson L.; Bokisa, George S.; Bishop, Craig V.; Vitale, Americus C.. Adhesion of polymeric materials to metal surfaces. USP2003016506314.
  2. Bokisa George S. ; Willis William J.. Aqueous immersion plating bath and method for plating. USP2000056063172.
  3. Kozo Arao JP. Aqueous solution for the formation of an indium oxide film by electroless deposition. USP2002106464762.
  4. McGrath Peter T. ; Owei Abayomi I.. Bismuth coating protection for copper. USP2001126331201.
  5. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen. Composite coatings for whisker reduction. USP2012078226807.
  6. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen. Composite coatings for whisker reduction. USP2014128906217.
  7. Frenier, Wayne; Chang, Frank F.. Composition and method for treating a subterranean formation. USP2004106806236.
  8. Bishop Craig V. ; Kochilla John R. ; Durante Robert J. ; Bokisa George S.. Copper etching compositions and method for etching copper. USP2000076086779.
  9. Chen, Qingyun; Valverde, Charles; Paneccasio, Vincent; Petrov, Nicolai; Stritch, Daniel; Witt, Christian; Hurtubise, Richard. Defectivity and process control of electroless deposition in microelectronics applications. USP2009117611987.
  10. Aksu,Serdar; Wang,Jiaxiong; Basol,Bulent M.. Efficient gallium thin film electroplating methods and chemistries. USP2009037507321.
  11. Toben,Michael P.; Brown,Neil D.; Chirafisi,Angelo. Electroplating composite substrates. USP2008047357853.
  12. Aksu, Serdar; Pinarbasi, Mustafa. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films. USP2013048425753.
  13. Aksu, Serdar; Wang, Jiaxiong; Basol, Bulent M.. Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films. USP2011027892413.
  14. Cooper,Emanuel I.; Goldsmith,Charles C.; Kilpatrick,Stephen; Mojica,Carmen M.; Nye, III,Henry A.. Immersion plating and plated structures. USP2007107276296.
  15. Cooper,Emanuel I.; Goldsmith,Charles C.; Kilpatrick,Stephen; Mojica,Carmen M.; Nye, III,Henry A.. Immersion plating and plated structures. USP2006057037559.
  16. Choczaj, Barbara G.; Bartelme, Michael J.; Lentsch, Steven E.; Vetter, Katherine O.; Trulsen, Marvin C.; Olson, Erik C.; Levitt, Mark D.. Limescale and soap scum removing composition containing methane sulfonic acid. USP2014058722609.
  17. Kawagoshi, Ryosuke; Ishii, Hitoshi. Metal material with a bismuth film attached and method for producing same, surface treatment liquid used in said method, and cationic electrodeposition coated metal material and method for producing same. USP2015059039882.
  18. Bishop Craig V. ; Bokisa George S. ; Durante Robert J. ; Kochilla John R.. Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom. USP2001096284309.
  19. Bishop, Craig V.; Bokisa, George S.; Durante, Robert J.; Kochilla, John R.. Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom. USP2003066579591.
  20. Bishop, Craig V.; Bokisa, George S.; Durante, Robert J.; Kochilla, John R.. Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom. USP2003086602440.
  21. Edelstein, Daniel C.; Kang, Sung Kwon; McGlashan-Powell, Maurice; O'Sullivan, Eugene J.; Walker, George F.. Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped. USP2004086784088.
  22. Edelstein, Daniel C.; Kang, Sung Kwon; McGlashan-Powell, Maurice; O'Sullivan, Eugene J.; Walker, George F.. Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped. USP2003046551931.
  23. Edelstein,Daniel C.; Kang,Sung Kwon; McGlashan Powell,Maurice; O'Sullivan,Eugene J.; Walker,George F.. Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped. USP2006107115996.
  24. Kolics, Artur. Methods and materials for anchoring gapfill metals. USP2014118895441.
  25. Kolics, Artur. Methods and materials for anchoring gapfill metals. USP2016079382627.
  26. Bokisa George S.. Multilayer circuit boards and processes of making the same. USP1999075928790.
  27. Bell, Jane; Heyer, Joachim; Hupe, Jürgen; Kalker, Ingo; Kleinfeld, Marlies. Process for the non-galvanic tin plating of copper or copper alloys. USP2004116821323.
  28. George S. Bokisa ; Craig V. Bishop ; John R. Kochilla. Process for whisker-free aqueous electroless tin plating. USP2002036361823.
  29. Hayasaka, Taichi; Mizusawa, Shuichi. Quartz crystal device and method for fabricating the same. USP2017049614493.
  30. Arduengo, III, Anthony J.. Solventless one-step process for the production of imidazole-2-thiones. USP2011017868182.
  31. Bokisa, George S.; Bishop, Craig V.; Kochilla, John R.. Tin whisker-free printed circuit board. USP2004046720499.

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