이 특허를 인용한 특허 (111)

1. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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2. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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3. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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4. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.

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5. Baxter George Addis ; Cohn Charles ; Sattler Theodore Joseph ; Saxena Lakshmendra S., Ball grid array plastic package.

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6. Eun, Younghyo; Kim, Dukman, Chip package and manufacturing method thereof.

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7. Ko, Dongkyun; Lee, Jung; An, Jaesun, Chip package and manufacturing method thereof.

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8. Ko, Dongkyun; Lee, Jung; An, Jaesun, Chip package and manufacturing method thereof.

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9. Liao, Kuo-Hsien, Chip package and manufacturing method thereof.

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10. Davis, Terry W.; Son, Sun Jin, Conformal shield on punch QFN semiconductor package.

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11. Worl, Robert T., Dual cavity, high-heat dissipating printed wiring board assembly.

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12. Schultz,Craig; Oen,Joshua, EMI shield for reducing clock jitter of a transceiver.

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13. Schultz, Craig L.; Petit, Todd Micheal; Oen, Joshua T., EMI shield for transceiver.

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14. Schultz,Craig L.; Petit,Todd Micheal; Oen,Joshua T., EMI shield for transceiver.

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15. Yao, Chin-Tsai; Huang, Chien-Ping; Ke, Chun-Chi, EMI shielding package structure and method for fabricating the same.

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16. Chiu, Chi Tsung; Ou, Ying-Te, EMI-shielded semiconductor devices and methods of making.

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17. Horio, Tomoharu; Murakawa, Shigehiro, Electromagnetic shield cap and infrared data communication module.

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18. Martich Mark E., Electromechanical switching device package with controlled impedance environment.

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19. Kawamoto,Eiji; Hayama,Masaaki; Katsumata,Masaaki; Yabe,Hiroki, Electronic component-built-in module.

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20. Lee, Chun-Che; Su, Yuan-Chang; Lee, Ming Chiang; Huang, Shih-Fu, Embedded component device and manufacturing methods thereof.

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21. Vinciarelli, Patrizio; LaFleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph F.; D'Amico, Andrew T., Encapsulated modular power converter with symmetric heat distribution.

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22. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.

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23. Youker Nick A. ; Blood James E. ; Hansen John E., Integrated EMI shield utilizing a hybrid edge.

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24. Shin, Kyungjae; Kim, Kiwoong, Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module.

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25. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.

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26. Martich, Mark E., Inverted board mounted electromechanical device.

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27. Thijssen, Hendrikus; Narasimhan, Sudarshan, Low cost high performance injection molded hard drive top cover.

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28. Arnold, Shawn X.; Mullins, Scott P.; Thoma, Jeffrey M.; Chandhrasekhar, Ramamurthy, Low profile, space efficient circuit shields.

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29. Li, Jun; Wang, Jianhong; Xu, Xuesong; Yao, Jinzhong; Yu, Wanming, MRAM device and method of assembling same.

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30. Hem P. Takiar ; Nikhil Vishwanath Kelkar ; Ken Pham, Metal coated markings on integrated circuit devices.

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31. Akram Salman, Method and apparatus for semiconductor assembly which includes testing of chips and replacement of bad chips prior to f.

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32. Worl,Robert T.; Blaser,Bruce L.; Heisen,Peter T.; Navarro,Julio A.; Pietila,Douglas A.; Raby,Scott A.; Takeuchi,Jimmy S., Method and system for angled RF connection using a flexible substrate.

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33. Yao, Chin-Tsai; Huang, Chien-Ping; Ke, Chun-Chi, Method for fabricating EMI shielding package structure.

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34. Yao, Chin-Tsai; Huang, Chien-Ping; Ke, Chun-Chi, Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function.

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35. Seryogin, Georgiy; Tetreault, Thomas G.; Golovato, Stephen N.; Chandrasekaran, Ramya, Method for increasing adhesion of copper to polymeric surfaces.

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36. Youker, Nick A.; Blood, James E.; Hansen, John E., Method for integrated EMI shielding.

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37. Anthony, William M.; Anthony, David; Anthony, Anthony, Method for making internally overlapped conditioners.

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38. Chen, Wei Min; Bai, Zhigang; Wang, Zhijie, Method of assembling shielded integrated circuit device.

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39. Vinciarelli, Patrizio; Lavery, Patrick R.; Mutter, Rudolph F.; Kirk, Jeffery J.; D'Amico, Andrew T., Method of electrically interconnecting circuit assemblies.

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40. Joseph M. Brand ; Scott Gooch, Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices.

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41. Wang, Zhi-jie; Liu, Jian-yong, Method of forming a semiconductor package and structure thereof.

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42. Vinciarelli, Patrizio; Balcius, Robert Joseph; Sadler, Steven P.; Thompson, Mark Andrew, Method of forming an electrical connection to an electronic module.

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43. Vinciarelli, Patrizio; LaFleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph F.; D'Amico, Andrew T., Method of making a plurality of electronic assemblies.

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44. Thomsen, III, Donald Laurence; Cano, Roberto J.; Jensen, Brian J.; Hales, Stephen J.; Alexa, Joel A., Methods of making Z-shielding.

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45. Masayoshi Yamaguchi JP; Mitsutoshi Sawano JP; Kazutoshi Hohki JP, Multi-chip module.

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46. Yamaguchi Masayoshi,JPX ; Sawano Mitsutoshi,JPX ; Hohki Kazutoshi,JPX, Multi-chip module having printed wiring board comprising circuit pattern for IC chip.

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47. Vinciarelli, Patrizio; LaFleur, Michael B.; Fleming, Sean Timothy; Mutter, Rudolph F.; D'Amico, Andrew T., Panel-molded electronic assemblies.

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48. Scranton Alec B. ; Rangarajan Bharath ; Baikerikar Kiran K., Photopolymerizable compositions for encapsulating microelectronic devices.

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49. Yao, Chin-Tsai; Huang, Chien-Ping; Ke, Chun-Chi, Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same.

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50. Han, Yi Seul; Lee, Tae Yong; Ryu, Ji Yeon, Semiconductor device and method of manufacturing thereof.

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51. Joseph M. Brand ; Scott Gooch, Semiconductor device encapsulators.

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52. Brand, Joseph M.; Gooch, Scott, Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages.

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53. Naval, Herbert delos Santos; Sur, Noel A.; Soriano, John A., Semiconductor device having EMI shielding and method therefor.

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54. Berry, Christopher J.; Scanlan, Christopher M., Semiconductor device having RF shielding and method therefor.

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55. Berry,Christopher J.; Scanlan,Christopher M., Semiconductor device having RF shielding and method therefor.

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56. Olson, Timothy L.; Scanlan, Christopher M.; Berry, Christopher J., Semiconductor device having RF shielding and method therefor.

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57. Jeon, Jun Ho; Seong, Kyeong Sool; Na, Seok Ho; Kim, Jeong Il; Kim, Young Kyu; Jeon, Sung Ho; Lim, Deok In; Hong, Sung Moo; Kim, Sung Jung; Ryu, Sung Han; Kang, Kyung Nam; Yoo, Seong Hak, Semiconductor device having conductive wire with increased attachment angle and method.

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58. Cheng, Hung-Hsiang; Lin, Tzu-Chih; Hung, Chang-Ying; Wu, Chih-Wei, Semiconductor device having shielded conductive vias.

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59. Liao, Kuo-Hsien; Chan, Chi-Hong; Chen, Jian-Cheng; Ueng, Chian-Her; Sun, Yu-Hsiang, Semiconductor device packages having electromagnetic interference shielding and related methods.

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60. An, JaeSeon; Lee, Jeong; Cha, SangJin; Youn, SungHo, Semiconductor device packages with electromagnetic interference shielding.

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61. Chiu, Chi-Tsung; Hung, Chih-Pin; Huang, Jui-Cheng, Semiconductor device packages with electromagnetic interference shielding.

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62. Chiu, Chi-Tsung; Hung, Chih-Pin; Huang, Jui-Cheng, Semiconductor device packages with electromagnetic interference shielding.

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63. Hsu, Chain-Hau, Semiconductor device packages with electromagnetic interference shielding.

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64. Kim, Seokbong; Yun, Yeonsun; Lee, Yuyong, Semiconductor device packages with electromagnetic interference shielding.

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65. Lee, Yuyong; Kim, Seokbong, Semiconductor device packages with electromagnetic interference shielding.

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66. Liao, Kuo-Hsien; Chen, Jian-Cheng; Fan, Chen-Chuan; Chiu, Chi-Tsung; Hung, Chih-Pin, Semiconductor device packages with electromagnetic interference shielding.

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67. Liao, Kuo-Hsien; Chiu, Chi-Tsung; Hung, Chih-Pin, Semiconductor device packages with electromagnetic interference shielding.

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68. Liao, Kuo-Hsien; Chiu, Chi-Tsung; Hung, Chih-Pin, Semiconductor device packages with electromagnetic interference shielding.

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69. Park, Sung Sun; Jun, Ik Su; Ahn, Ye Sul, Semiconductor device with electromagnetic interference shielding.

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70. Koyama Michio,JPX ; Ohke Hajime,JPX, Semiconductor package.

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71. Koyama Michio,JPX ; Wataya Yukinobu,JPX, Semiconductor package.

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72. Lee, Seok-Hyun, Semiconductor package.

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73. Min, Byoung-Gug; Cho, Sungil; Choi, Jaehoon; Kim, Shi-kyung, Semiconductor package and method for manufacturing the same.

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74. Yen, Han-Chee; Chen, Shih-Yuan; Lai, Chien-Pai; Cheng, Ming-Hsien, Semiconductor package having a waveguide antenna and manufacturing method thereof.

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75. Lin, I-Chia; Jou, Sheng-Jian; Yen, Han-Chee, Semiconductor package having an antenna and manufacturing method thereof.

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76. Yen, Han-Chee; Chen, Shih-Yuan; Lai, Chien-Pai; Cheng, Ming-Hsien, Semiconductor package including antenna layer and manufacturing method thereof.

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77. Yen, Han-Chee, Semiconductor package including antenna substrate and manufacturing method thereof.

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78. Liao, Kuo-Hsien; Chan, Chi-Hong; Fuyu, Shih, Semiconductor package integrated with conformal shield and antenna.

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79. Yen, Han-Chee; Chung, Chi-Sheng; Liao, Kuo-Hsien; Yeh, Yung-I, Semiconductor package integrated with conformal shield and antenna.

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80. Yang, Jun-Young; Lim, Sung-Mook, Semiconductor package with grounding and shielding layers.

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81. Su, Yuan-Chang; Huang, Shih-Fu; Chen, Chia-Cheng; Chen, Tzu-Hui; Chen, Kuang-Hsiung; Hsieh, Pao-Ming; Lee, Ming Chiang; Appelt, Bernd Karl, Semiconductor package with single sided substrate design and manufacturing methods thereof.

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82. Su, Yuan-Chang; Huang, Shih-Fu; Chen, Chia-Cheng; Chen, Tzu-Hui; Chen, Kuang-Hsiung; Hsieh, Pao-Ming; Lee, Ming Chiang; Appelt, Bernd Karl, Semiconductor package with single sided substrate design and manufacturing methods thereof.

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83. Tsai, Fu-Yung, Semiconductor packages with heat dissipation structures and related methods.

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84. Lin, I-Chia; Tseng, Yu-Chou; Yang, Jin-Feng; Chung, Chi-Sheng; Liao, Kuo-Hsien, Semiconductor packages with thermal dissipation structures and EMI shielding.

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85. Chen, Chi-Han; Chiu, Chi-Tsung, Semiconductor structure having aperture antenna.

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86. Chino, Kenji; Iwanaga, Yoshihisa, Sensor installation structure for vehicles.

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87. Chun, Jong Ok; Karim, Nozad; Chen, Richard; Selli, Giuseppe; Kelly, Michael, Shield lid interconnect package and method.

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88. Pabst, Eduard J.; Pacheco, Sergio P.; Yap, Weng F., Shielded device packages having antennas and related fabrication methods.

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89. Fuentes, Ruben; Miller, Jr., August Joseph, Shielded electronic component package and method.

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90. Patel,Viresh; Kirloskar,Mohan, Shielded integrated circuit package.

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91. Patel,Viresh; Kirloskar,Mohan, Shielded integrated circuit package.

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92. Foster, Donald Craig, Shielded package having shield lid.

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93. Foster, Donald Craig, Shielded package having shield lid.

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94. St. Amand, Roger D.; Karim, Nozad O.; Longo, Joseph M.; Smith, Lee J.; Darveaux, Robert F.; Chun, Jong Ok; Mao, Jingkun, Shielding for a semiconductor package.

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95. Chen, Chia-Ching; Ding, Yi-Chuan, Stackable semiconductor package and manufacturing method thereof.

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96. Fuentes, Ruben; Scanlan, Christopher; Chun, Jong, System and method for RF shielding of a semiconductor package.

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97. Bolognia, David; Kelly, Mike; Smith, Lee, System and method for compartmental shielding of stacked packages.

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98. Kelly, Michael G.; Cambas, John; Tan, Francis; Montero, Pam, System and method for lowering contact resistance of the radio frequency (RF) shield to ground.

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99. Scanlan, Christopher M., System and method for shielding of package on package (PoP) assemblies.

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100. Kapusta, Christopher James; Cunningham, Donald Paul, System and method of forming a patterned conformal structure.

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101. Kapusta, Christopher James; Cunningham, Donald Paul, System and method of forming a patterned conformal structure.

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102. Kapusta, Christopher James; Cunningham, Donald Paul, System and method of forming isolated conformal shielding areas.

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103. Bolognia, David, System and method to reduce shorting of radio frequency (RF) shielding.

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104. Ahn, Kie Y.; Forbes, Leonard, System-on-a-chip with multi-layered metallized through-hole interconnection.

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105. Ahn,Kie Y.; Forbes,Leonard, System-on-a-chip with multi-layered metallized through-hole interconnection.

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106. Ahn,Kie Y.; Forbes,Leonard, System-on-a-chip with multi-layered metallized through-hole interconnection.

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107. Kie Y. Ahn ; Leonard Forbes, System-on-a-chip with multi-layered metallized through-hole interconnection.

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108. Chun, Jong Ok; Karim, Nozad; Chen, Richard; Selli, Giuseppe; Kelly, Michael, Top feature package and method.

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109. Chiu, Chi-Tsung; Liao, Kuo-Hsien; Yih, Wei-Chi; Chen, Yu-Chi; Fan, Chen-Chuan, Wafer-level semiconductor device packages with electromagnetic interference shielding.

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110. Beatson, David T.; Hmiel, Andrew F., Wirebonded semiconductor package structure and method of manufacture.

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111. Hashimoto, Koh; Tsutsumi, Yukako; Ito, Takayoshi; Akita, Koji, Wireless device, and information processing apparatus and storage device including the wireless device.

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