초록 ▼

An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of th

An electronic package having improved electrical properties in which a plastic Quad Flat Pack is provided with upper and lower metallic plates encased in the plastic body and overlapping at least a portion of the length of the encased portion of the leads whereby the self and mutual inductance of the package is reduced. A ceramic Quad Flat Pack is provided with metal plates attached to the mating surfaces of the ceramic cover component and the ceramic base component so that at least a portion of the enclosed portion of the leads which are electrically connected to the electronic component inside the components is overlapped on the top and bottom by the metallic plates.

대표청구항 ▼

An electronic package comprising: a) a leadframe having a plurality of leads, each of said plurality of leads having an inner lead portion and an outer lead portion, and a die pad; b) an electronic device mounted on said die pad and electrically connected to said inner lead portions; c) a plastic bo

An electronic package comprising: a) a leadframe having a plurality of leads, each of said plurality of leads having an inner lead portion and an outer lead portion, and a die pad; b) an electronic device mounted on said die pad and electrically connected to said inner lead portions; c) a plastic body encasing said electronic device and said inner lead portions with said outer lead portions projecting beyond said plastic body; and d) at least one metallic plate within the plastic body overlapping at least 66% of the length of said encased inner lead portions, said at least one metallic plate extending in a plane generally parallel to said inner lead portions and in contact only with the plastic body.