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Apparatus and method for uniformly polishing a wafer

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-001/00
  • B24B-007/16
출원번호 US-0131949 (1993-10-08)
우선권정보 JP-0270438 (1992-10-08); JP-0270440 (1992-10-08)
발명자 / 주소
  • Kishii Sadahiro (Kawasaki JPX) Arimoto Yoshihiro (Kawasaki JPX) Horie Hiroshi (Kawasaki JPX) Sugimoto Fumitoshi (Kawasaki JPX)
출원인 / 주소
  • Fujitsu Limited (JPX 03)
인용정보 피인용 횟수 : 93  인용 특허 : 0

초록

An apparatus and method for polishing a semiconductor wafer. A polisher includes a supporting plate having a conductive film and a polishing cloth formed on the conductive film of the supporting plate. The polishing cloth has a plurality of openings to expose the conductive film. A wafer holder has

대표청구항

A method for polishing a semiconductor wafer having current detective patterns and an insulating film covering said current detective patterns, comprising the steps of: holding said semiconductor wafer on an electro-conductive wafer holding surface of a wafer holder; turning at least one of said waf

이 특허를 인용한 특허 (93)

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