Plating bath, and corresponding method, for electrolessly depositing a metal onto a substrate, and resulting metallized
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-018/52
C23C-018/38
출원번호
US-0437755
(1995-05-09)
발명자
/ 주소
Ballard Gerald L. (Apalachin NY) Gaudiello John G. (Apalachin NY)
출원인 / 주소
International Business Machines Corp. (Armonk NY 02)
인용정보
피인용 횟수 :
7인용 특허 :
0
초록▼
An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemi
An electroless metal plating bath composition, a corresponding method for electrolessly depositing a metal onto a substrate surface, as well as the resulting, metallized substrate, are disclosed. The inventive bath composition includes water, a soluble source of the metal ions it is desired to chemically reduce at, and deposit onto, the substrate surface of interest, and a complexing agent for the metal ions. In addition, the bath composition includes a soluble source of any one or more of a select group of what are termed mediator ions, which group includes palladium (Pd), platinum (Pt), silver (Ag), ruthenium (Ru), iridium (Ir), osmium (Os) and rhodium (Rh) ions, as well as a complexing agent for the mediator ions. Moreover, the bath composition includes a chemical reducing agent, which primarily serves to chemically reduce the mediator ions at the substrate surface of interest. Significantly, by using an appropriate ratio of the concentration of the metal ions in solution to the concentration of the mediator ions in solution, and depending upon which mediator ions are used, the inventive bath composition serves to electrolessly deposit the metal of interest onto the substrate surface of interest, with the resulting deposited metal containing less than or equal to about 3.0 atomic percent, or less than or equal to about 2.0 atomic percent, or even less than or equal to about 1.0 atomic percent, of the corresponding mediator metal.
대표청구항▼
An electroless metal plating bath composition, comprising: water; a soluble source of metal ions; a soluble source of mediator ions, different from said metal ions, chosen from the group consisting of palladium ions, platinum ions, silver ions, ruthenium ions, iridium ions, osmium ions and rhodium i
An electroless metal plating bath composition, comprising: water; a soluble source of metal ions; a soluble source of mediator ions, different from said metal ions, chosen from the group consisting of palladium ions, platinum ions, silver ions, ruthenium ions, iridium ions, osmium ions and rhodium ions; a first complexing agent for at least said metal ions; and a reducing agent for reducing said mediator ions.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허를 인용한 특허 (7)
Lee Chwan-Ying,TWX ; Huang Tzuen-Hsi,TWX, Copper metallization of USLI by electroless process.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.