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Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0524020 (1995-08-31)
발명자 / 주소
  • Perdue David W. (Anderson SC)
출원인 / 주소
  • AT&T Global Information Solutions Company (Dayton OH 02)
인용정보 피인용 횟수 : 77  인용 특허 : 16

초록

A method of cooling a heat source includes the steps of (1) positioning a thermally conductive base in contact with the heat source, the base having a plurality of fins which define a plurality of channels, (2) generating an initial flow of fluid, (3) positioning a baffle in the path of the initial

대표청구항

A heat source cooling apparatus, comprising: a thermally conductive base having a plurality of channels defined therein, said base adapted to be positioned in contact with a heat source; means for generating an initial flow of fluid; a baffle positioned in the initial flow of fluid so as to create a

이 특허에 인용된 특허 (16)

  1. Messina Gaetano P. (Hopewell Junction NY) Brewster Robert A. (Poughkeepsie NY) Kara Theodore J. (Poughkeepsie NY) Song Seaho (Highland NY), Apparatus for cooling integrated circuit chips.
  2. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips with forced coolant jet.
  3. Young Steven P. (LaGrangeville NY) Acocella John (Hopewell Junction NY) Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Song Seaho (Highland NY), Apparatus for indirect impingement cooling of integrated circuit chips.
  4. Fahey Albert J. (Pleasant Valley NY) Messina Gaetano P. (Hopewell Junction NY) Pavelka John B. (Beacon NY) Sherif Raed A. (Pleasant Valley NY), Blind hole cold plate cooling system.
  5. Azar Kaveh (Westwood MA), Circuit pack cooling using turbulators.
  6. Zingher Arthur R. (White Plains NY), Convection transfer system.
  7. Garner Robin E. (Rolling Meadows IL), Cooling module for electronic equipment.
  8. Daikoku Takahiro (Ushiku JPX) Takagi Ryuichi (Tokyo JPX), Cooling system and method for electronic circuit devices.
  9. Akamatsu Shinya (Tokyo JPX), Cooling system for a package with electronic circuit components.
  10. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Inagi JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
  11. Hatada Toshio (Tsuchiura JPX) Atarashi Takayuki (Tsuchiura JPX) Daikoku Takahiro (Ushiku NY JPX) Kobayashi Satomi (New York NY) Zushi Shizuo (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Iwai Susu, Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system.
  12. Mok Lawrence S.-W. (Brewster NY) Purushothaman Sampath (Yorktown Heights NY) Sammakia Bahgat G. (Newark Valley NY) Wilczynski Janusz S. (Ossining NY) Wu Tien Y. (Endwell NY), Electronic package having active means to maintain its operating temperature constant.
  13. Mayer Arnold H. (Dayton OH), Integral electric module and assembly jet cooling system.
  14. Lapinski John R. (St. Charles MO) Grote Michael G. (St. Louis MO), Isothermal multi-passage cooler.
  15. Nakajima Tadakatsu (Ibaraki JPX) Ohashi Shigeo (Tsuchiura JPX) Kuwahara Heikichi (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Sato Motohiro (Ibaraki JPX) Hatsuda Toshio (Ibaraki JPX) Daikoku Takah, Liquid impingement cooling module for semiconductor devices.
  16. Nelson Richard D. (Austin TX) Gupta Omkarnath R. (Englewood CO) Herrell Dennis J. (Austin TX), Method and apparatus for adjustably mounting a heat exchanger for an electronic component.

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  1. Johnson Eric A. ; Sathe Sanjeev B., Air flow devices for electronic boards.
  2. Barsun,Stephan K., Airflow control baffle.
  3. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  4. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  5. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
  6. McKeen Wilbert John,CAX ; Rhodes Steven James,CAX, Baffle arrangement for an airflow balance system.
  7. Hamilton Roger Duane ; Kang Sukhvinder Singh ; Mann Christopher William, Bi-directional cooling arrangement for use with an electronic component enclosure.
  8. Noble, Scott; Garcia, Edward; Polyakov, Evgeny; Truebenbach, Eric L.; Merrow, Brian S., Bulk feeding disk drives to disk drive testing systems.
  9. Noble, Scott; Garcia, Edward; Polyakov, Evgeny; Truebenbach, Eric L.; Merrow, Brian S., Bulk feeding disk drives to disk drive testing systems.
  10. Truebenbach, Eric L., Bulk transfer of storage devices using manual loading.
  11. Truebenbach, Eric L., Bulk transfer of storage devices using manual loading.
  12. Chang, Shyy-Woei, CPU and electronic chipset cooler.
  13. Lin, Shih-Jen, CPU cooling structure.
  14. C. Michael Hayward ; Richard N. Rehlander, Card guide including air deflector means.
  15. Nakahama,Takafumi; Kijima,Kenji, Cooling device for heat-generating elements.
  16. Nakahama,Takafumi; Kijima,Kenji, Cooling device for heat-generating elements.
  17. Nair, Manu Kumar Velayudhan; Ravikumar, Frederick Rajendran, Cooling device with air shower.
  18. Asakura, Ken, Cooling structure for electric device.
  19. Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Behar Moises ; Dutta Arindum ; Link Kevin J. ; Ahearn Bill, Cooling system for semiconductor die carrier.
  20. Martino, Peter, Damping vibrations within storage device testing systems.
  21. Merrow, Brian S.; Truebenbach, Eric L.; Smith, Marc Lesueur, Dependent temperature control within disk drive testing systems.
  22. Miyoshi, Toyokazu, Device for air-cooling electronic apparatus.
  23. Besold, Jean-Eric; Merlet, Etienne, Device with integrated electronic components provided with a partition for separating ventilated zones.
  24. Merrow, Brian S.; Garcia, Edward; Polyakov, Evgeny, Disk drive transport, clamping and testing.
  25. Merrow, Brian S.; Garcia, Edward; Polyakov, Evgeny, Disk drive transport, clamping and testing.
  26. Merrow, Brian S.; Garcia, Edward; Polyakov, Evgeny, Disk drive transport, clamping and testing.
  27. Pawar, Rahul; Karnbach, Rob S, Electrical switchgear system.
  28. Mongia, Rajiv K.; Bhattacharya, Anandaroop, Electromagnetic interference shielding for device cooling.
  29. Arena, John Joseph; Suto, Anthony J., Electronic assembly test system.
  30. Wang,Jian; Yu,Gang, Electronic device having a temperature control system including a ductwork assembly.
  31. Clarke John Edward ; Patel Naresh C., Electronic equipment shelf with blank for unequipped position.
  32. Merrow, Brian S., Enclosed operating area for disk drive testing systems.
  33. Merrow, Brian S., Enclosed operating area for storage device testing systems.
  34. Campbell, Philip; Wrinn, Joseph F., Engaging test slots.
  35. John McKeen ; Willie Braun, Equipment enclosure having separate compartments cooled by separate cooling airflows.
  36. Lai, Cheng-Tien; Lee, Tsung-Lung; Jiang, Shuai, Fan duct assembly.
  37. Chang, Yu-Wei; Chang, Hu-Sung; Chung, Chao-Tsai, Heat dissipation device and method.
  38. Yamagiwa, Daisuke, Heat radiation mechanism of electronic apparatus and electronic apparatus.
  39. Roberts, John H.; Goss, Ronald David; Sondermeyer, Jack C., Heat sink alignment.
  40. Bo-Yao Lin TW; Iris Huang TW; Michael Sun TW, Heat sink capable of having a fan mounted aslant to the lateral side thereof.
  41. Roman, Alfred R.; Hardy, Michael; Estes, Wayne; White, Daniel; Black, Jerry, Heat sink for a silicon controlled rectifier power controller.
  42. Hofmann,Wilfried, Heat-exchanging device.
  43. Merrow, Brian S.; Akers, Larry W., Heating storage devices in a testing system.
  44. Charles W. Frank, Jr. ; Thomas D. Hanan ; Wally Szeremeta, Integrated computer module with airflow accelerator.
  45. Metheny Larry J. ; Sudhoff Douglas H. ; Thompson Anthony D. ; Budzynski Richard J., Integrated electric motor and drive system with auxiliary cooling motor and asymmetric heat sink.
  46. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  47. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  48. Dubrule, Craig Donald; Ho, Phong Hoang, Method and apparatus for ventilating a computerized device.
  49. Cushman,James; Iyengar,Sridevi; Liang,Hsing Sheng, Methods and apparatus for directing an air stream through a circuit board assembly.
  50. Kirkendall, Robert; Monis, Michael R.; Moore, Judson W.; Meier, Timothy G., Modular pod.
  51. Rasmussen, Benjamin D.; Kirkendall, Robert; Monis, Michael R.; Berliner, III, Aubrey A.; Moore, Judson W.; Heberling, Dale W.; Kibbee, Keith L.; Seger, David W.; Meier, Timothy G., Modular pod.
  52. Loth, Michael William, Power electronic module cooling system and method.
  53. Schweers Michael R. ; Anderson Paul H., Processor assembly cooling cell.
  54. Hileman Vince P. ; Harpell Gary A., Refrigeration cooled disk storage assembly.
  55. Noha El-Ghobashy ; Albert Pedoeem ; Jana Regenwetter, Removable fan tray assembly with latching features.
  56. Duret Michael J. ; Hasenkamp Erin Martin ; Markulec Jeffrey R. ; Rex Dennis G. ; Schuster Richard E., Sieve like structure for fluid flow through structural arrangement.
  57. Merrow, Brian S.; Akers, Larry W., Storage device temperature sensing.
  58. Merrow, Brian S.; Akers, Larry W., Storage device temperature sensing.
  59. Merrow, Brian S., Storage device testing system cooling.
  60. Merrow, Brian S., Storage device testing system cooling.
  61. Merrow, Brian S.; Akers, Larry W., Storage device testing system with a conductive heating assembly.
  62. Gregory W. Pautsch ; Kent T. McDaniel ; Eric Dwayne Lakin ; James Joseph Jirak, System and method for cooling electronic components.
  63. Merrow, Brian S., Temperature control within disk drive testing systems.
  64. Merrow, Brian S., Temperature control within disk drive testing systems.
  65. Merrow, Brian S., Temperature control within storage device testing systems.
  66. Merrow, Brian S.; Krikorian, Nicholas C., Test slot cooling system for a storage device testing system.
  67. Merrow, Brian S.; Krikorian, Nicholas C., Test slot cooling system for a storage device testing system.
  68. Merrow, Brian S., Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit.
  69. Gilliland,Don A.; Huettner,Cary M.; Wurth,Dennis J., Thermal management apparatus and method for printed circuit boards.
  70. Pirillis, Alexandros, Thermal management for electronic device housing.
  71. Ozawa, Tadashi, Thermal-resistance variable heat sink structure and method of using the same.
  72. Polyakov, Evgeny; Garcia, Edward; Truebenbach, Eric L.; Merrow, Brian S.; Whitaker, Brian J., Transferring disk drives within disk drive testing systems.
  73. Polyakov, Evgeny; Garcia, Edward; Truebenbach, Eric L.; Merrow, Brian S.; Whitaker, Brian J., Transferring disk drives within disk drive testing systems.
  74. Polyakov, Evgeny; Garcia, Edward; Truebenbach, Eric L.; Merrow, Brian S.; Whitaker, Brian J., Transferring storage devices within storage device testing systems.
  75. Toscano, John; Polyakov, Evgeny; Garcia, Edward; Truebenbach, Eric L.; Merrow, Brian S.; Whitaker, Brian J., Transferring storage devices within storage device testing systems.
  76. Toscano, John; Polyakov, Evgeny; Garcia, Edward; Truebenbach, Eric L.; Merrow, Brian S.; Whitaker, Brian J., Transferring storage devices within storage device testing systems.
  77. Merrow, Brian S., Vibration isolation within disk drive testing systems.
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