[특허]Integrated sputtering target assembly

Integrated sputtering target assembly 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C23C-014/34
출원번호	US-0449618 (1995-05-24)
발명자 / 주소	Demaray Richard E. (Portola Valley CA) Berkstresser David E. (Los Gatos CA) Herrera Manuel J. (San Mateo CA)
출원인 / 주소	Applied Materials, Inc. (Santa Clara CA 02)
인용정보	피인용 횟수 : 82 인용 특허 : 0

초록 ▼

A target plate assembly completely covers and seals against a top opening of a sputtering processing chamber. Cooling liquid connections are provided only from the perimeter of the target assembly. When a top vacuum chamber seals the side opposite the pressure chamber, the pressure on both sides of the target assembly is nearly equalized. Large thin target assemblies, such as large flat plates used for flat panel displays can be sputtered effectively and uniformly without adverse sputtering effects due to target deflection or cooling deficiencies. A target, target backing plate, and cover plate form the target plate assembly. The sputtering target assembly includes an integral cooling passage. A series of grooves are constructed in either the target backing plate or the target backing cooling cover plate, which are then securely bonded to one another. The sputtering target can be a single monolith with a target backing plate or can be securely attached to the target backing plate by one of any number of conventional bonding methods. Tantalum to titanium, titanium to titanium and aluminum to titanium, diffusion bonding can be used. The energized target assembly is protected from adjacent components by overlapping insulators to prevent accidents and isolate the target assembly from other components. An electrical connection to the target assembly remains unconnected until a vacuum is produced in the top chamber.

대표청구항 ▼

A sputtering process comprising the steps of: placing a target assembly on a top surface of a processing chamber such that when a vacuum is provided to said processing chamber said processing chamber is sealed by said target assembly; evacuating said processing chamber to provide a processing chamber vacuum pressure in said chamber sealed by said target assembly; placing a cover chamber on said target assembly on a back side of said target assembly opposite a target side of said assembly, said cover chamber being supported on said back side of said target assembly such that a vacuum seal is created against said back side of said target assembly, thereby enclosing at least the portion of said back side of said target assembly corresponding to the location on said target side of said target assembly which comprises a sputtering target; and evacuating said cover chamber to provide a cover chamber vacuum pressure in said cover chamber; setting and adjusting the differential pressure between said cover chamber and said processing chamber during sputtering to control the bowing of a portion of the target assembly located between the processing chamber and the cover chamber to adjust the distance between a portion of the sputtering target susceptible to movement due to bowing of the target assembly between adjacent chambers and an object to be sputtered to improve the uniformity of sputtering film sputter deposited on said object in said sputter chamber during sputtering of said sputtering target on said target side of said target assembly as a portion of said sputtering target susceptible to movement due to bowing is eroded away during sputtering.

이 특허를 인용한 특허 (82)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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연합인증

Integrated sputtering target assembly 원문보기

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Integrated sputtering target assembly 원문보기

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연구과제 타임라인

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이 특허를 인용한 특허 (82)

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