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Polishing pad with abrasive particles in a non-porous binder 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-007/00
출원번호 US-0308399 (1994-09-19)
우선권정보 GB-0005664 (1992-03-16); GB-0021397 (1992-10-12)
발명자 / 주소
  • Sexton John S. (Bobcat
  • West Street Odiham GB2) Wright Derek N. (No. 5 Eagle Close
  • Heathlake Crowthorne
  • Berkshire GB2)
인용정보 피인용 횟수 : 58  인용 특허 : 8

초록

A polishing pad comprises a carrier and layer of a non-porous thermoplastic polymer secured to a surface thereof and containing a mass of discrete abrasive particles, comprising diamond or cubic boron nitride, uniformly dispersed therein. The abrasive particles have a particle size of up to 500 micr

대표청구항

A polishing pad comprising a carrier having major surfaces on opposite sides thereof, said major surfaces having longitudinal edges, and at least one of said major surfaces having an abrasive layer structure secured thereto, said abrasive layer structure comprising a plurality of elongate strips arr

이 특허에 인용된 특허 (8)

  1. Boucher John N. (Longwood FL) Bajune David E. (Sanford FL), Abrasive blade having a polycrystalline ceramic core.
  2. Gagne Yvon (Mont St. Hilaire CAX), Abrasive member.
  3. Tselesin Naum N. (2900 Lookout Pl. Atlanta GA 30305), Composite material.
  4. Wiand Ronald C. (1494 Heatherwood Dr. Troy MI 48098), Diamond tool with non-abrasive segments.
  5. Sexton, John S.; Stone, Brian J.; Howes, Trevor D.; Andrew, Colin, Grinding wheel.
  6. Hall George H. (P.O. Box 244 Westford MA 01886), Method of forming a cutting tool.
  7. Budinger William D. (Kennett Square PA) Jensen Elmer W. (Wilmington DE), Pad material for grinding, lapping and polishing.
  8. Bruschek Dieter K. (Wilmington DE) Levering Richard M. (Wilmington DE), Process for making an abrasive grinding wheel.

이 특허를 인용한 특허 (58)

  1. Kodani, Noriomi; Nagaya, Akihiko; Kawasaki, Katsuhiro, Abrasive disc.
  2. Fujimori Keiichi,JPX ; Matsuo Junji,JPX, Abrasive dresser for polishing disc of chemical-mechanical polisher.
  3. Palushi,Simon; Goldberg,Howard, Abrasive sanding surface.
  4. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
  5. Copoulos, Paul, Apparatus and method for surface finishing cured concrete.
  6. Thysell, Hakan; Thysell, Karl; Olsen, Lars, Carrier plate holding an abrading element and abrading plate.
  7. Thysell, Håkan; Thysell, Karl; Olsen, Lars, Carrier plate holding an abrading element and abrading plate.
  8. Gillet, Thierry; Renneson, Martin, Cutting disk.
  9. Ruoff Rodney S., Designer particles of micron and submicron dimension.
  10. Lampley,Leonard A.; Draper,Tyron B., Diamond trowel blade.
  11. Lampley,Leonard A.; Draper,Tyron B., Diamond trowel blade.
  12. Mas García, José Antonio, Disk for grinding concrete.
  13. Vogtmann, Michael; Vepa, Krishna; Wisnieski, Michael, Eccentric abrasive wheel for wafer processing.
  14. Williams, Sr., Bruce Michael, Floor resurfacing disk.
  15. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  16. Harding,William R., Grinder disc, insert holder and insert assembly.
  17. Hwang, Young Min; Lee, Jeong Joon; Shim, Chang Bo, Grinder wheel for liquid crystal display device and method of fabricating liquid crystal display device using the same.
  18. Mehrabi,Mohsen, Grinding and cutting head.
  19. Van Eijden, Barry Johannes; Van Houten, Adrianus Gerardes, Grinding head for a surface grinding machine.
  20. Van Eijden, Barry Johannes; Van Houten, Adrianus Gerardes, Grinding head for a surface grinding machine.
  21. Song, Young-Choul; Chung, Sung-Hoon; Choi, Jong-Suk; Hong, Jae-Hyun, Grinding tool.
  22. Chou, Jui-Lin; Chiu, Chia-Feng; Liao, Wen-Jen; Su, Xue-Shen, Grinding tool and method of manufacturing the same.
  23. Ilgner, Thomas, Grinding tool for natural stone floors, artificial stone floors and industrial soils.
  24. Park,Rin Soon, Grinding wheel.
  25. Tchakarov, Tchavdar V., Grouting pan assembly with reinforcement ring.
  26. Boone Charles Daniel, Hardwood floor finishing process.
  27. Blick, John, Leather head finishing system having plurality of apertures and angled shoe rails.
  28. Yagur, Ron; Pollitt, Patrick, Method and apparatus for treating a floor surface with zero-tolerance edging.
  29. Tchakarov, Tchavdar V.; Gallup, Eric; Michielutti, Robert James, Method for finishing a surface using a grouting pan.
  30. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
  31. Reed, Johnny; Copoulos, Paul, Methods and apparatuses for surface finishing cured concrete.
  32. Vogtmann, Michael R.; Wisnieski, Michael S., Mixing manifold for multiple inlet chemistry fluids.
  33. Kim Young-Soo,KRX, Polishing apparatus for a semiconductor wafer.
  34. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
  35. Boyer,Thomas; Mahmood,Waqar; Chandler,Keith; Cspikes,Andrei, Polishing fixture assembly for a fiber optic cable connector polishing apparatus.
  36. Tchakarov, Tchavdar V., Polishing or grinding pad assembly.
  37. Tchakarov, Tchavdar V., Polishing or grinding pad assembly.
  38. Tchakarov, Tchavdar V., Polishing or grinding pad assembly.
  39. Tchakarov, Tchavdar V.; Gallup, Eric, Polishing pad.
  40. Tchakarov, Tchavdar V.; Gallup, Eric, Polishing pad.
  41. Ono, Koichi; Shimomura, Tetsuo; Nakamori, Masahiko; Yamada, Takatoshi; Komai, Shigeru; Tsutsumi, Masayuki, Polishing pad and cushion layer for polishing pad.
  42. Ono, Koichi; Shimomura, Tetsuo; Nakamori, Masahiko; Yamada, Takatoshi; Komai, Shigeru; Tsutsumi, Masayuki, Polishing pad and cushion layer for polishing pad.
  43. Boyer, Thomas; Mahmood, Waqar; Chandler, Keith; Cspikes, Andrei; Cammarata, Michael R., Polishing pad assembly for fiber optic cable connector polishing apparatus.
  44. Nishiyama,Masaya; Habiro,Masanobu; Iwatsuki,Yasuhito; Hiraoka,Hirokazu, Polishing pad for CMP, method for polishing substrate using it and method for producing polishing pad for CMP.
  45. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.
  46. David B. James ; Lee Melbourne Cook ; Arthur Richard Baker, Polishing pads and methods relating thereto.
  47. David B. James ; Lee Melbourne Cook ; Arthur Richard Baker, Polishing pads and methods relating thereto.
  48. Estes, Michael Jack, Quick-change grinding pad and mounting system.
  49. Mehrabi,Mohsen, Rotary cutting head.
  50. Imai, Atsumi; Aiga, Takehide; Nagai, Masanori; Sato, Takayuki; Fujimoto, Kenji; Matsumoto, Tsuyoshi; Kihira, Hiroshi, Rotary grinding tool and its production method.
  51. Edwards Kerri O., Sanding disk with extended blades.
  52. Abrams,Allan D.; Brouillette,Donald W.; Danaher,Joseph D.; Krywanczyk,Timothy C.; Lamothe,Rene A.; Stone,Ivan J.; Whalen,Matthew R., Semiconductor wafer front side protection.
  53. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  54. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  55. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  56. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
  57. Gallup, Eric; Tchakarov, Tchavdar V., Tool holder with tapered slot for a grinding machine.
  58. Preston Jay B. ; Tselesin Naum N. ; Gorsuch Ian,GBX, Tools with abrasive segments.
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