초록 ▼

An electronic circuit package is fabricated by providing a substrate having attached to at least one of its major surfaces, at least one integrated circuit chip; and providing a carrier that comprises a polymeric composition. The carrier holds a desired array of conductive pins, which protrude from

An electronic circuit package is fabricated by providing a substrate having attached to at least one of its major surfaces, at least one integrated circuit chip; and providing a carrier that comprises a polymeric composition. The carrier holds a desired array of conductive pins, which protrude from both major surfaces of the carrier. The substrate is placed in contact with the pins to provide a subassembly.

대표청구항 ▼

A carrier which comprises a main body portion that contains stand-off portions and holds a desired array of electrically conductive pins protruding from major surfaces thereof; and being fabricated from a polymeric composition; and wherein electrically conductive pins of said array each contain a bu

A carrier which comprises a main body portion that contains stand-off portions and holds a desired array of electrically conductive pins protruding from major surfaces thereof; and being fabricated from a polymeric composition; and wherein electrically conductive pins of said array each contain a bump located on an intermediate portion of a pin held within said main body portion of said carrier.