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Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0207185 (1994-03-08) |
우선권정보 | JP-0079004 (1993-03-12); JP-0079005 (1993-03-12) |
발명자 / 주소 |
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출원인 / 주소 |
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인용정보 | 피인용 횟수 : 319 인용 특허 : 0 |
Method of fabricating a semiconductor circuit is initiated with formation of an amorphous silicon film. Then, a second layer containing at least one catalytic element is so formed as to be in intimate contact with the amorphous silicon film, or the catalytic element is introduced into the amorphous
Method of fabricating a semiconductor circuit is initiated with formation of an amorphous silicon film. Then, a second layer containing at least one catalytic element is so formed as to be in intimate contact with the amorphous silicon film, or the catalytic element is introduced into the amorphous silicon film. This amorphous silicon film is selectively irradiated with laser light or other equivalent intense light to crystallize the amorphous silicon film.
A method of fabricating a semiconductor circuit comprising the steps of: forming a semiconductor film comprising silicon over an insulating surface of a substrate, said film having a first portion and second portion and a surface; selectively forming a substance containing at least one catalytic ele
A method of fabricating a semiconductor circuit comprising the steps of: forming a semiconductor film comprising silicon over an insulating surface of a substrate, said film having a first portion and second portion and a surface; selectively forming a substance containing at least one catalytic element in contact with only, said first portion of said semiconductor film for promoting crystallization of said semiconductor film; and irradiating all of said surface of said semiconductor film with light to promote crystallization of said semiconductor film, wherein the crystallinity of said semiconductor film is increased more in said first portion than in said second portion.
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