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Integrated circuit micromodule obtained by the continuous assembly of patterned strips 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/28
출원번호 US-0413379 (1995-03-30)
우선권정보 FR-0001934 (1991-02-19)
발명자 / 주소
  • Gloton Jean-Pierre (La Ciotat FRX) Laroche Damien (Chateauneuf le Rouge FRX) Turin Joel (Marseille FRX) Fallah Michel (Carnoux FRX)
출원인 / 주소
  • Gemplus Card International (Gemenos FRX 03)
인용정보 피인용 횟수 : 86  인용 특허 : 0

초록 ▼

A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric

대표청구항

A micromodule comprising a slotted metal strip bonded to a perforated dielectric strip having a thickness of less than 70 micrometers, and a chip bonded to one of the dielectric strip and the metal strip and connected to the metal strip through the perforations of the dielectric strip.

이 특허를 인용한 특허 (86)

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