$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0506155 (1995-07-24)
발명자 / 주소
  • Porter Warren W. (Escondido CA)
출원인 / 주소
  • AT&T Global Information Solutions Company (Dayton OH 02)
인용정보 피인용 횟수 : 42  인용 특허 : 0

초록

Resistive ink elements are applied to the exposed surfaces of thin sections or thermal insulation provided to cooled integrated circuit devices within a computer system. The insulation is made thinner than required to prevent the formation of condensation upon the exposed surfaces of the insulation

대표청구항

In a computer system including an integrated circuit device mounted to a printed circuit board, said integrated circuit device being mounted to a first surface of said printed circuit board, and a cooling system for cooling said integrated circuit device, said cooling system including cooling system

이 특허를 인용한 특허 (42)

  1. Okuda, Noriyuki; Takenaka, Norihiro; Masui, Tomohiro, Air conditioner.
  2. Wall, Charles B.; Barnes, Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
  3. Wall,Charles B.; Barnes,Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
  4. Newman Robert ; Lee Chu-Chung, Ball grid array package having thermoelectric cooler.
  5. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  6. Bhardwaj, Jyoti Kiron; Brainard, Robert James; Chapman, David J.; Crafts, Douglas E.; Dong, Zi-Wen; Dougherty, David; Egan, Erik W.; Farrell, James F.; Farrelly, Mark B.; Gopinathan, Niranjan; Ishida, Compact, low insertion loss, high yield arrayed waveguide grating.
  7. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Cooled IC chip modules with an insulated circuit board.
  8. Espersen,Morten; Kristensen,Thorben, Cooling arrangement for an integrated circuit.
  9. Hamman,Brian A., Cooling system.
  10. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  11. Ashiwake Noriyuki,JPX ; Otaguro Toshio,JPX ; Nishihara Atsuo,JPX ; Honma Mitsuru,JPX, Electronic apparatus.
  12. Yoshikawa, Minoru, Electronic device having dewing prevention structure and dewing prevention structure of electronic device.
  13. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  14. Jones Clifford T., Electronics cabinet cooling system.
  15. Norton, David G.; Kuss, Jeffrey J., Flexible heater for heating electrical components in operator control handle.
  16. Cohen, Alan Mark, Heat dissipation assembly for computing devices.
  17. Cohen, Alan Mark, Heat dissipation assembly for computing devices.
  18. Kang Sukhvinder ; Mahaney ; Jr. Howard Victor ; Schmidt Roger R. ; Singh Prabjit, Heated PCB interconnect for cooled IC chip modules.
  19. Wayburn, Lewis S.; Gage, Derek E.; Hayes, Andrew M.; Barker, R. Walton; Niles, David W., Integrated circuit cooling apparatus.
  20. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Isothermal heat sink with converging, diverging channels.
  21. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Isothermal heat sink with cross-flow openings between channels.
  22. Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Isothermal heat sink with tiered cooling channels.
  23. Hamman,Brian A., Liquid cooling system.
  24. Chu Richard C. ; Ellsworth ; Jr. Michael J. ; Simons Robert E., Local humidity control system for low temperature electronic module.
  25. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
  26. Lenhardt,Ronald Robert James, Method and apparatus for cooling semiconductor chips.
  27. Patrick K. Sullivan, Moisture control system for electrical devices.
  28. Crafts, Douglas E.; Farrell, James F.; Farrelly, Mark B.; Ramalingam, Suresh; Ishida, Kenzo, Package for optical components.
  29. Suga Kazunari,JPX ; Fujimoto Akihiro,JPX, Printed circuit board with electronic devices mounted thereon.
  30. Morton Edward Peter,GBX ; Guiver Andrew Peter James,GBX, Printed circuit boards.
  31. Chengson David P. ; Schmidt William L. ; Agarwala Unmesh ; Foster Alan D. ; Priest Edward C. ; Manton John C. ; Mira Ali, Processor-inclusive memory module.
  32. Chengson David P. ; Schmidt William L. ; Agarwala Unmesh ; Foster Alan D. ; Priest Edward C. ; Manton John C. ; Mira Ali, Processor-inclusive memory module.
  33. Douglas E. Crafts ; James F. Farrell ; Mark B. Farrelly ; Suresh Ramalingam, Redundant package for optical components.
  34. Goth Gary F. ; Loparco John J. ; Singh Prabjit, Sealed multi-chip module cooling system.
  35. Der Ropp, Thomas Von, Semiconductor device with temperature regulation.
  36. Chen, Chien-An; Chen, Yi-Ling, Separable liquid-cooling heat-dissipation module.
  37. Burke Jonathan Christopher, Single component computer.
  38. Best, Christiaan Scott, System and method for air-cooling hard drives in liquid-cooled server rack.
  39. Best, Christiaan Scott, System and method of packaging computing resources for space and fire-resistance.
  40. Steven Schupbach, Temperature stabilization scheme for a circuit board.
  41. Wayburn, Lewis S.; Mahaffey, Charles M.; Spearing, Ian G.; Gage, Derek E.; Sharpley, Todd C.; Barnes, Cynthia M., Thermal apparatus for engaging electronic device.
  42. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트