초록 ▼

A plastic container for storing and shipping semiconductor wafers comprising a wafer carrier of substantially rigid and transparent material supporting the wafers and maintaining the wafers in spaced relation to each other, top and bottom covers for the wafer carrier formed of stiff but resiliently

A plastic container for storing and shipping semiconductor wafers comprising a wafer carrier of substantially rigid and transparent material supporting the wafers and maintaining the wafers in spaced relation to each other, top and bottom covers for the wafer carrier formed of stiff but resiliently flexibly yieldable material, the wafer carrier having upper and lower enlarged rim portions extending around the peripheries of the top and bottom of the wafer carrier and being embraced by enlarged peripherally extending rim portions of the top and bottom covers, the top and bottom covers having partially cylindrical panels with elongate beads or ridges formed thereon to engage and maintain the edges of the wafers spaced from the partially cylindrical surfaces, offset tabs on the wafer carrier and top and bottom covers facilitating of flexibly lifting small portions of the covers off the wafer carriers and then progressively disengaging the covers from the wafer carriers; a package comprising a multiplicity of cover trays with compartments receiving the shipping containers therein, the cover trays supporting the containers at the tab portions on the wafer carriers and the cover trays also bearing downwardly on the side edge portions of the cover to maintain the covers in closed condition on the wafer carrier.

대표청구항 ▼

A plastic container for storing and shipping semiconductor wafers and interfacing with processing machines in indexing relation comprising a wafer carrier comprising sidewalls with wafer supporting offset portions and wafer separating ribs, the carrier also comprising first and second end walls inte

A plastic container for storing and shipping semiconductor wafers and interfacing with processing machines in indexing relation comprising a wafer carrier comprising sidewalls with wafer supporting offset portions and wafer separating ribs, the carrier also comprising first and second end walls interconnecting the sidewalls, the sidewalls and end walls comprising upper edge portions defining a top opening of the carrier facilitating loading and unloading of wafers, the sidewalls and end walls also defining lower edge portions defining a bottom opening of the carrier providing access to the wafers in the carrier, said upper edge portions comprising enlarged upper rim portions, said lower edge portions of the carrier comprise enlarged lower rim portions, the wafer carrier comprises a periphery adjacent the lower edge portions thereof, the lower edge portions and the lower rim portions of the carrier extend entirely around the periphery of the wafer carrier, a bottom cover removably traversing the bottom opening of the wafer carrier and lying against said lower edge portions to close the bottom opening, and the bottom cover comprises a periphery and also comprises enlarged bottom cover rim portions extending around the entire periphery of the bottom cover and engaging and embracing the lower rim portions of the wafer carrier in a snap fit and removably retaining the bottom cover on the carrier, said lower edge portions of the sidewalls comprising indexing notches opening through said lower edge portions, the lower rim portions of the carrier and the bottom cover rim portions continuing along and bypassing said indexing notches, a bottom cover removably traversing the bottom opening of the wafer carrier and lying against said lower edge portions to close the bottom opening, and the bottom cover comprises a periphery and also comprises enlarged bottom cover rim portions extending around the entire periphery of the bottom cover and engaging and embracing the lower rim portions of the wafer carrier in a snap fit and removably retaining the bottom cover on the wafer carrier, and a top cover removably traversing the top opening of the wafer carrier and lying against said upper edge portion of the carrier to close the top opening and retain the wafers, the top cover comprising enlarged top cover rim portions engaging and embracing upper rim portions of the wafer carrier in a snap fit and removably retaining the top cover on the wafer carrier.