초록 ▼

There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit dev

There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

대표청구항 ▼

A component for an electronic package comprising: a metallic substrate coated with an electrically non-conductive layer; at least two integrated circuit devices bonded to opposing surfaces of said metallic substrate; and a first plurality of conductive circuit traces formed on opposing surfaces of s

A component for an electronic package comprising: a metallic substrate coated with an electrically non-conductive layer; at least two integrated circuit devices bonded to opposing surfaces of said metallic substrate; and a first plurality of conductive circuit traces formed on opposing surfaces of said metallic substrate wherein the input/output pads of said at least two integrated circuit devices are directly soldered to said first plurality of circuit traces, said first plurality of circuit traces further bonded to a second plurality of circuit traces.