초록 ▼

In the covered-wire connection method and structure in which at least one of members to be conductively connected to each other is a covered wire comprising a conductive wire portion and a cover portion of resin which is coated around the outer periphery of the conductive wire portion, both of the m

In the covered-wire connection method and structure in which at least one of members to be conductively connected to each other is a covered wire comprising a conductive wire portion and a cover portion of resin which is coated around the outer periphery of the conductive wire portion, both of the members are overlapped with each other at connection portions thereof, the overlapped connection portions are pinched between a pair of resin chips, and then the cover portion are melted and dispersed by ultrasonic vibration while pressing the connection portions of the members from the outside of the resin chips to conductively connect both of the members to each other at the connection portions thereof. Thereafter, the pair of the resin chips are melted to be fixed to each other, so that the connection portions are sealed with the melted resin chips.

대표청구항 ▼

A covered wire connection method for conductively connecting members at least one of which is a covered wire having a conductive wire portion and a cover portion formed by coating resin around an outer periphery of the conductive wire portion, said method comprising: a first step of overlapping said

A covered wire connection method for conductively connecting members at least one of which is a covered wire having a conductive wire portion and a cover portion formed by coating resin around an outer periphery of the conductive wire portion, said method comprising: a first step of overlapping said members with each other and pinching an overlapping portion of said members between a pair of resin chips; and a second step of pressurizing and exciting said overlapping portion pinched by said resin chips using an ultrasonic vibration welding apparatus so as to melt and disperse said cover portion, thereby to expose the conductive wire portion and electrically conductively connect the conductively wire portions of said members at said overlapping portion and so as to melt-fix said pair of resin chips to seal the connected overlapping protion of said members with said melted resin chips.