초록 ▼

The present invention concerns a method of manufacture a method of manufacturing a card wherein there is supplied a compressible positioning structure (6), at least one electronic element (8) and a binder (12). The electronic element is positioned in a manner such that it is superposed onto the comp

The present invention concerns a method of manufacture a method of manufacturing a card wherein there is supplied a compressible positioning structure (6), at least one electronic element (8) and a binder (12). The electronic element is positioned in a manner such that it is superposed onto the compressible positioning structure. In a first case, the binder (12) is supplied in liquid form. In another case, such binder is supplied in the form of a solid sheet, which is subsequently at least partially melted by applying energy. With the help of a press, pressure is applied to the various elements as supplied. The electronic element (8) then penetrates the positioning structure (6) and the binder spreads out so as to coat the electronic element (8). Finally there is obtained following solidification a solid card.

대표청구항 ▼

Method of manufacture of a card, characterized in that it includes a first group of steps including the following steps: B) bringing at least one electronic element (8) onto a work surface (2); C) bringing a compressible positioning structure (6;34;48) onto said work surface in a manner such that sa

Method of manufacture of a card, characterized in that it includes a first group of steps including the following steps: B) bringing at least one electronic element (8) onto a work surface (2); C) bringing a compressible positioning structure (6;34;48) onto said work surface in a manner such that said electronic element is superposed onto said compressible positioning structure; D) bringing a binder (12;42) onto said work surface; this first group of steps being followed by a second group of steps including the following steps: G) application of pressure onto an assembly including said electronic element (8), said compressible positioning structure (6;34;48) and said binder (12;42) in order to cause, on the one hand, said electronic element to penetrate at least partially into said compressible positioning structure and, on the other hand, to permit said binder to form a mass in which said electronic element is immersed; H) solidification of said mass formed by said binder (12;42) at the time of said step G in a manner such that said mass rigidly binds said electronic element (8) and said compressible positioning structure (6;34;48) and solidifies this latter in a configuration resulting from step G.