초록 ▼

In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in

In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

대표청구항 ▼

A method for producing an electronic device casing, said casing including a resin frame for arranging at least two circuit boards in a mutually parallel relationship to each other and at least one connecting metallic lead disposed inside a side wall of said frame, said connecting metallic lead inclu

A method for producing an electronic device casing, said casing including a resin frame for arranging at least two circuit boards in a mutually parallel relationship to each other and at least one connecting metallic lead disposed inside a side wall of said frame, said connecting metallic lead including an intermediate portion, a first contacting portion for electrically connecting with a first circuit board, and a second contacting portion for electrically connecting with a second circuit board, said method comprising the steps of: arranging said connecting metallic lead as an insert in a cavity of a mold for molding said frame; pressing said intermediate portion of said connecting metallic lead with an extended portion of a supporting plate which extends through a groove in said mold toward said cavity so as to press said first and second contacting portions of said connecting metallic lead against a surface of said cavity and to fix said connecting metallic lead in said cavity; and molding said frame while pressing said connecting metallic lead against said mold cavity surface with said extended portion of said supporting plate so as to fix said connecting metallic lead in said cavity.