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Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28D-015/02
출원번호 US-0495961 (1995-06-28)
발명자 / 주소
  • Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA)
출원인 / 주소
  • Aavid Laboratories, Inc. (South Lancaster MA 02)
인용정보 피인용 횟수 : 70  인용 특허 : 20

초록

A two-phase liquid cooling system utilizes and evaporator unit for vaporizing a liquid coolant and a condenser unit for condensing the coolant vapor. The unit is capable of operating in at least two orientations: in one orientation, the condenser is located vertically above the evaporator and conden

대표청구항

Computer apparatus capable of operating in a first orientation and in a second orientation in an environment with an ambient pressure over a temperature range, the apparatus comprising: a heat dissipating microprocessor; a memory unit; an evaporator unit having a first thermally conductive wall in c

이 특허에 인용된 특허 (20)

  1. Berenholz Jack (Lexington MA) Bowman John K. (Brighton MA), Air cooled heat exchanger for multi-chip assemblies.
  2. Novotny Shlomo D. (Wayland MA), Bellows heat pipe apparatus for cooling systems.
  3. Peterson George P. (College Station TX) Oktay Sevgin (Poughkeepsie NY), Bellows heat pipe for thermal control of electronic components.
  4. Lowenstein Andrew (Princeton NJ), Bladder thermosyphon.
  5. Okada Sadayuki (Katsuta JPX) Sonobe Hisao (Naka JPX), Constant pressure type ebullient cooling equipment.
  6. Pianezza ; Anthony, Electrically-heated container.
  7. Hamburgen William R. (Menlo Park CA), Evaporator having etched fiber nucleation sites and method of fabricating same.
  8. Tousignant Lew A. (St. Paul MN), Flow-through heat transfer apparatus with movable thermal via.
  9. Parro James (R.D. 2 ; Sadler Rd. Skaneateles NY 13152), Heat exchange method using natural flow of heat exchange medium.
  10. Parro James (R.D. 2 ; Sadler Rd. Skaneateles NY 13152), Heat exchange method using natural flow of heat exchange medium.
  11. Steffen James E. (Woodbury MN) Grannis Vaughn B. (Inver Grove Heights MN) Schroder Frank S. (Afton MN), Heat exchanger.
  12. Basiulis Algerd (Redondo Beach CA), Heat pipe capable of operating against gravity and structures utilizing same.
  13. Koizumi Hisao (Zushi JPX), Heat transfer apparatus.
  14. Tousignant Lew A. (St. Paul MN), Heat transfer bag with thermal via.
  15. Tousignant Lew A. (St. Paul MN) Hoopman Timothy L. (River Falls WI) Thompson Kenneth C. (Stillwater MN), Jet impingment plate and method of making.
  16. Smolley Robert (Portuguese Bend CA), Liquid cooled high density packaging for high speed circuits.
  17. Huffman Fred N. (Sudbury MA), Pressure balanced heat pipe.
  18. Danielson Richard D. (Hastings MN) Hesselroth David A. (St. Paul Park MN) Stein ; Jr. Ralph J. (So. St. Paul MN), Thermal transfer bag.
  19. Eastman George Y. (Lancaster PA), Unfurlable heat pipe.
  20. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.

이 특허를 인용한 특허 (70)

  1. Wall, Charles B.; Barnes, Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
  2. Wall,Charles B.; Barnes,Cynthia M., Apparatus and method for controlling the temperature of an electronic device under test.
  3. Frank, Michael; Van Hasselt, Peter, Apparatus and method for cooling a super conducting machine.
  4. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
  5. Hao, Li Jia, Bubble cycling heat exchanger.
  6. Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.
  7. Manole,Dan M.; Coffey,Donald L.; Moore,Michael J., Compact refrigeration system for providing multiple levels of cooling.
  8. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  9. Luo, Chin Kuang, Computer module.
  10. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  11. Gradinger, Thomas; Agostini, Francesco, Cooling apparatus for cooling a power electronic device.
  12. Tanaka, Hiroshi; Ohara, Takahide; Suzuki, Kazutaka; Kunikata, Yuhei; Yamaguchi, Hiroo, Cooling device.
  13. Tanaka, Hiroshi; Ohara, Takahide; Suzuki, Kazutaka; Kunikata, Yuhei; Yamaguchi, Hiroo, Cooling device.
  14. Hamman,Brian A., Cooling system.
  15. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
  16. Gates William George,GBX, Electronic apparatus.
  17. Motoyama,Hideyuki; Tanaka,Hideki; Yamada,Hiroshi, Electronic apparatus having energy-saving cooling system.
  18. Davis, Simon Peter, Electronic system.
  19. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  20. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  21. Hartzell, Dennis E.; Oleksy, John; Ognibene, Edward J.; Breaux, Lyle, Finned-tube heat exchangers and cold plates, self-cooling electronic component systems using same, and methods for cooling electronic components using same.
  22. Shedd, Timothy A.; Lindeman, Brett A., Flexible two-phase cooling system.
  23. Shedd, Timothy A.; Meives, Mark S., Fluid distribution unit for two-phase cooling system.
  24. Nishiura,Koei, Gas collecting device, test head and IC device testing apparatus.
  25. Chen, Chien-Fu; Hsieh, Yi-Ping; Chen, Chung-Chen, Heat dissipation system and electronic device utilizing the same.
  26. Lindemuth, James E.; Mast, Brian E.; Gernert, Nelson J.; Smith, Jr., James L.; Todd, Jr., John J., Heat pipe system for cooling flywheel energy storage systems.
  27. Ghantiwala, Nayana V., Heat sink.
  28. Shedd, Timothy A.; Lindeman, Brett A., Heat sink module.
  29. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  30. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
  31. Harris, Daniel W.; Ditri, John; Hahn, Joseph W.; McNulty, Michael K., Integration of chip level micro-fluidic cooling in chip packages for heat flux removal.
  32. Iyengar, Madhusudan K.; Kamath, Vinod; Mahaney, Jr., Howard V.; Steinke, Mark E.; Vallury, Aparna, Liquid coolant conduit secured in an unused socket for memory module cooling.
  33. Kitano,Makoto; Naganawa,Takashi; Yoshitomi,Yuji; Minamitani,Rintaro; Ohashi,Shigeo; Ashiwake,Noriyuki; Kondo,Yoshihiro; Nakagawa,Tsuyoshi, Liquid cooling system and personal computer using thereof.
  34. Alex,Belits; Valeriy,Belits, Low-profile thermosyphon-based cooling system for computers and other electronic devices.
  35. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  36. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  37. Sauciuc, Ioan; Scott, Ward; Chrysler, Gregory M., Method and apparatus for dissipating heat from an electronic device.
  38. Sauciuc,Ioan; Scott,Ward; Chrysler,Gregory M., Method and apparatus for dissipating heat from an electronic device.
  39. Jibb, Richard J., Method for providing refrigeration using capillary pumped liquid.
  40. Shedd, Timothy A., Method of absorbing sensible and latent heat with series-connected heat sinks.
  41. Shedd, Timothy A.; Lindeman, Brett A., Method of cooling series-connected heat sink modules.
  42. Shedd, Timothy A., Method of operating a cooling apparatus to provide stable two-phase flow.
  43. Myers,Alan M.; Prasher,Ravi, Micropin heat exchanger.
  44. Prasher,Ravi, Micropin heat exchanger.
  45. Shedd, Timothy A.; Lindeman, Brett A.; Buchanan, Robert A., Microprocessor assembly adapted for fluid cooling.
  46. Chesser, Jason B.; Faneuf, Barrett M.; Montgomery, Stephen W., Modular capillary pumped loop cooling system.
  47. Chesser,Jason B.; Faneuf,Barrett M.; Montgomery,Stephen W., Modular capillary pumped loop cooling system.
  48. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  49. Rusch, David P; Bhatti, Mohinder Singh; Reyzin, Ilya, Orientation insensitive compact thermosiphon with a remote auxiliary condenser.
  50. Bhatti, Mohinder Singh; Reyzin, Ilya; Joshi, Shrikant Mukund, Orientation insensitive thermosiphon capable of operation in upside down position.
  51. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  52. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  53. Joshi, Shailesh N.; Dede, Ercan Mehmet, Pool boiling system.
  54. Reist, Daniel T.; Dussinger, Peter; Ellis, Michael C., Pumped two phase air to air heat exchanger.
  55. Cho, Wei-Lin, Pumped two phase fluid routing system and method of routing a working fluid for transferring heat.
  56. Shedd, Timothy A.; Lindeman, Brett A., Redundant heat sink module.
  57. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  58. Lehman, Bret W.; Matteson, Jason Aaron; White, Graham Michael, System for cooling a component in a computer system.
  59. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  60. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  61. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  62. Garner, Scott D., Thermal management system and method for electronics system.
  63. Garner, Scott D., Thermal management system and method for electronics system.
  64. Garner,Scott D., Thermal management system and method for electronics system.
  65. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  66. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  67. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  68. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
  69. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
  70. Siu, Wing Ming, Vapor augmented heatsink with multi-wick structure.
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