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Heterogeneous polymerization in carbon dioxide 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B01F-017/00
  • B01F-001/00
출원번호 US-0443478 (1995-05-18)
발명자 / 주소
  • DeSimone Joseph M. (Chapel Hill NC) Maury Elise E. (Chapel Hill NC) Combes James R. (Carboro NC) Menceloglu Yusuf Z. (Chapel Hill NC)
출원인 / 주소
  • The University of North Carolina at Chapel Hill (Chapel Hill NC 02)
인용정보 피인용 횟수 : 49  인용 특허 : 0

초록

The heterogeneous polymerization of water-insoluble polymer in CO2 is disclosed. The method comprises providing a heterogeneous reaction mixture comprising CO2, a monomer, and a surfactant, then polymerizing the monomer to form a water-insoluble polymer.

대표청구항

A mixture comprising carbon dioxide and a surfactant, wherein said surfactant comprises a carbon dioxide soluble segment and a CO2-phobic group covalently linked to said carbon dioxide soluble segment, wherein said carbon dioxide soluble segment further comprises a fluoropolymer and wherein said sur

이 특허를 인용한 특허 (49)

  1. Christian, Paul; Howdle, Steven Melvyn; Irvine, Derek John, Addition polymerization in a homogeneous reaction mixture.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  3. Beckman, Eric J.; Sarbu, Traian; Styranec, Thomas J., Carbon dioxide-philic compounds and methods of synthesis thereof.
  4. DeSimone, Joseph M.; Birnbaum, Eva; Carbonell, Ruben G.; Crette, Stephanie; McClain, James B.; McCleskey, T. Mark; Powell, Kimberly R.; Romack, Timothy J.; Tumas, William, Carbon dioxide-soluble polymers and swellable polymers for carbon dioxide applications.
  5. Wai, Chien M.; Ohde, Hiroyuki; Kramer, Stephen J., Compositions comprising supercritical carbon dioxide and metallic compounds.
  6. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  7. Arena Foster,Chantal J.; Awtrey,Allan Wendell; Ryza,Nicholas Alan; Schilling,Paul, Developing photoresist with supercritical fluid and developer.
  8. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Developing photoresist with supercritical fluid and developer.
  9. Arena-Foster, Chantal J.; Awtrey, Allan Wendell; Ryza, Nicholas Alan; Schilling, Paul, Drying resist with a solvent bath and supercritical CO2.
  10. Gleason, Karen K.; Ober, Christopher; Herr, Daniel, Electrical device including dielectric layer formed by direct patterning process.
  11. Joseph M. Desimone ; Terri Johnson Carson ; John F. Miller ; Sharon Wells, Fluorinated copolymer surfactants and use thereof in aerosol compositions.
  12. Gupta, D. V. Satyanarayana, Liquid CO2/hydrocarbon oil emulsion fracturing system.
  13. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  14. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  15. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  16. Adams, Lea; Fisher, Edward C.; Malone, Josh; Miller, Seth; Smith, Jack C.; Dennis, William Kevin; Marsh, Jeffrey W., Method for lubricating MEMS components.
  17. Malone, Joshua, Method for stripping sacrificial layer in MEMS assembly.
  18. Malone,Joshua, Method for stripping sacrificial layer in MEMS assembly.
  19. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  20. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  21. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  22. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  23. Hillman,Joseph, Method of inhibiting copper corrosion during supercritical COcleaning.
  24. Joseph M. DeSimone ; Saad A. Khan ; Joseph R. Royer ; Richard J. Spontak ; Teri Anne Walker, Method of making foamed materials using surfactants and carbon dioxide.
  25. Toma,Dorel Ioan; Schilling,Paul, Method of passivating of low dielectric materials in wafer processing.
  26. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  27. Schilling,Paul, Method of treating a composite spin-on glass/anti-reflective material prior to cleaning.
  28. Schilling,Paul, Method of treatment of porous dielectric films to reduce damage during cleaning.
  29. Miller, Seth Andrian, Method of undercutting micro-mechanical device with super-critical carbon dioxide.
  30. DeSimone, Joseph M.; Paisner, Sara Naomi, Methods of forming polymeric structures using carbon dioxide and polymeric structures formed therapy.
  31. Wai, Chien M.; Ohde, Hiroyuki; Kramer, Stephen J., Methods of increasing the solubility of materials in supercritical carbon dioxide.
  32. DeSimone, Joseph M.; Khan, Saad A.; Royer, Joseph R.; Spontak, Richard J.; Walker, Teri Anne; Gay, Yvon J.; Siripurapu, Srinivas, Methods of making foamed materials of blended thermoplastic polymers using carbon dioxide.
  33. DeSimone, Joseph M.; Siripurapu, Srinivas; Khan, Saad A.; Spontak, Richard J.; Royer, Joseph, Nano-and micro-cellular foamed thin-walled material, and processes and apparatuses for making the same.
  34. Mullee,William H.; de Leeuwe,Marc; Roberson, Jr.,Glenn A.; Palmer,Bentley J., Removal of CMP and post-CMP residue from semiconductors using supercritical carbon dioxide process.
  35. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  36. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  37. Bertram, Ronald Thomas; Scott, Douglas Michael, Removal of contaminants from a fluid.
  38. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  39. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  40. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  41. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  42. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  43. Gleason, Karen K.; Ober, Christopher; Herr, Daniel, Solventless, resistless direct dielectric patterning.
  44. Dickinson, C. John; Jansen, Frank; Murphy, Daimhin P., Substrate processing apparatus and related systems and methods.
  45. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  46. Charles W. Manke ; Esin Gulari ; Deborah Frances Mielewski ; Ellen Cheng-chi Lee, System and method of delaminating a layered silicate material by supercritical fluid treatment.
  47. Mielewski, Deborah Frances; Lee, Ellen Cheng-chi; Manke, Charles W; Gulari, Esin, System and method of preparing a reinforced polymer by supercritical fluid treatment.
  48. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  49. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
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