Metal on plastic films with adhesion-promoting layer
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-014/00
G02B-001/10
B32B-015/08
B32B-009/00
출원번호
US-0014447
(1993-02-05)
발명자
/ 주소
Gibbons Kevin P. (Sunnyvale CA) Lau Louis C. (Alameda CA) Woodard Floyd E. (Los Altos CA)
출원인 / 주소
Southwall Technologies Inc. (Palo Alto CA 02)
인용정보
피인용 횟수 :
48인용 특허 :
0
초록▼
The adhesion to plastic substrates of thick layers of functional metals having an oxide heat of formation that is greater than -40,000 calories/gram atom of metal, such as silver, copper, gold, and the like, is improved if a thin layer of a metal having an oxide heat of formation of less than -50,00
The adhesion to plastic substrates of thick layers of functional metals having an oxide heat of formation that is greater than -40,000 calories/gram atom of metal, such as silver, copper, gold, and the like, is improved if a thin layer of a metal having an oxide heat of formation of less than -50,000 calories/gram atom of metal is present as an adhesion-promoting primer layer. When the primer layer metal has a melting point greater than 1100°C., it should be present as the metal or as a substoichiometric oxide. When the primer layer metal has a melting point less than 1100°C., it may be present as the metal, as a substoichiometric oxide, or as a full stoichiometric oxide. Processes for preparing these materials using sputter-depositing and reflectors incorporating these materials are also disclosed.
대표청구항▼
A metal-on-plastic material comprising a plastic substrate having a surface, a 3 to 200 Åthick, substantially transparent first layer sputter-deposited upon the surface of the substrate comprising metal selected from the group consisting of hafnium, zirconium, tantalum, titanium, niobium, tungsten,
A metal-on-plastic material comprising a plastic substrate having a surface, a 3 to 200 Åthick, substantially transparent first layer sputter-deposited upon the surface of the substrate comprising metal selected from the group consisting of hafnium, zirconium, tantalum, titanium, niobium, tungsten, vanadium, molybdenum, chromium, nickel and alloys thereof, the metal in said first layer being deposited in the form of metal or substoichiometric oxide, and a second layer sputter-deposited upon the first layer comprising 100-10,000 Åof metal selected frown the group consisting of copper, silver, gold, palladium, rhodium, iridium and alloys thereof.
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