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|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||29/8 ; ; 29/896412 ; ; 29/4011 ; 228/213|
|발명자 / 주소|
|인용정보||피인용 횟수 : 12 인용 특허 : 1|
Method and apparatus for the sizing of annular objects by cutting through an arcuate portion of the object to be sized; separating and straightening the cut ends of the object; placing sizing stock coated with solder into temporary adherence with a holder and then placing the stock, while held in the holder, between the cut ends; followed by heating the holder and the stock to release the sizing stock from the holder and cause solder paste to adhere the stock to the annular object between its cut ends.
The method of sizing an annular object, which comprises the steps of: (a) cutting through an arcuate portion of the object to be sized; (b) separating and straightening the cut ends of said object; and (c) placing sizing stock coated with solder in a holder; the stock being temporarily adhered to the holder; then placing the stock while held in the holder between the cut ends; and (d) heating said holder and said stock to release said sizing stock from said holder and cause said solder paste to adhere said stock to said object between said cut ends.