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Moisture getting composition for hermetic microelectronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C09K-003/18
출원번호 US-0100181 (1993-08-02)
발명자 / 주소
  • Shores A. Andrew (Venice CA)
출원인 / 주소
  • Alpha Fry Limited (Croydon GB2 03)
인용정보 피인용 횟수 : 112  인용 특허 : 19

초록

This invention describes a composition of matter having moisture gettering properties and applicable as coating or adhesive in a hermetic microelectronic device. The composition is applied to the interior surface of the packaging at a thickness of 0.1-25 mil and comprises a desiccant finely disperse

대표청구항

A composition of matter useful as a desiccant in a hermetic electronic device, comprising a powder dispersed in a binder, wherein said powder is selected from the group consisting of zeolite molecular sieves, activated alumina, silica gel, alkaline earth oxide, and alkali metal carbonate; said binde

이 특허에 인용된 특허 (19)

  1. Anderson James E. (Ann Arbor MI) Markovac Vlado (Lathrup Village MI) Troyk Philip R. (Morton Grove IL), Composite polymer/desiccant coatings for IC encapsulation.
  2. Aoki Yoshio (Koga JPX) Saito Masatoshi (Tokyo JPX), Dehumidifying material.
  3. Booe ; James M., Desiccant for electrical and electronic devices.
  4. Fischer John C. (Marietta GA), Desiccant-coated substrate and method of manufacture.
  5. Tokuyama Shinichi (Kyoto JPX) Hongo Masaharu (Uto JPX) Iino Hirokazu (Nishinomiya JPX), Desiccating agent.
  6. Farrell Christopher J. (Arlington Heights IL) Tsai Boh C. (Rolling Meadows IL) Wachtel James A. (Buffalo Grove IL), Drying agent in multi-layer polymeric structure.
  7. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Enclosure for electronic devices.
  8. Taylor R. Daniel (North Ridgeville OH), Flexible desiccant body.
  9. Bowser ; George H., In situ curable sealant and methods for making and using same.
  10. Yoshizaki Haruhiko (Hadano JPX) Kawaguchi Norihito (Tokyo JPX), Inorganic porous substance containing resin composition.
  11. Evani Syamalarao (Midland MI) Oswald James H. (Auburn MI) Staples Thomas L. (Midland MI) Polak Brent T. (Midland MI), Material for absorbing aqueous fluids.
  12. Banfield Charles E. (Nashua NH), Method and compositions for removal of moisture.
  13. Yamamoto Shuji (Tokyo JA) Isshiki Setsuya (Tokyo JA) Igarashi Mitsuru (Tokyo JA), Method of manufacturing insulated electric power cables.
  14. Haville George D. (Santa Barbara CA) Johnson Paul A. (Santa Barbara CA), Modular shaft encoder system for non-binary counts.
  15. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Moisture and particle getter for enclosures.
  16. Shigeta Katsumi (Ootsu JPX) Mukai Hisao (Naruto JPX) Isojima Eiji (Shiga JPX) Saita Yoshio (Naruto JPX), Moisture-absorbent compositions and molded items.
  17. Deffeyes Robert J. (Arlington TX), Package having dessicant composition.
  18. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Substrate attach adhesive film, application method and devices incorporating the same.
  19. Roginski Amy M. (New Kensington PA) Connelly Bruce A. (Gibsonia PA) Bowser George H. (New Kensington PA), Windshield edge seal.

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