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특허 상세정보

Moisture getting composition for hermetic microelectronic devices

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) C09K-003/18   
미국특허분류(USC) 252/194 ; 501/32 ; 501/39 ; 501/80
출원번호 US-0100181 (1993-08-02)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 112  인용 특허 : 19
초록

This invention describes a composition of matter having moisture gettering properties and applicable as coating or adhesive in a hermetic microelectronic device. The composition is applied to the interior surface of the packaging at a thickness of 0.1-25 mil and comprises a desiccant finely dispersed in a binder which is a water vapor permeable solid material. This may be a polymer, porous ceramic or glass. The desiccant is a particulate solid with 0.2-100 micrometer average particle size. It ought to be able to absorb from a one atmosphere pressure gas ...

대표
청구항

A composition of matter useful as a desiccant in a hermetic electronic device, comprising a powder dispersed in a binder, wherein said powder is selected from the group consisting of zeolite molecular sieves, activated alumina, silica gel, alkaline earth oxide, and alkali metal carbonate; said binder is a continuous matrix of porous glass or porous ceramic; and said powder to binder volume ratio is 0.001-2.

이 특허에 인용된 특허 (19)

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