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Ultraviolet laser system and method for forming vias in multi-layered targets 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-026/00
출원번호 US-0276797 (1994-07-18)
발명자 / 주소
  • Owen Mark D. (Beaverton OR) O\Brien James N. (Bend OR)
출원인 / 주소
  • Electro Scientific Industries, Inc. (Portland OR 02)
인용정보 피인용 횟수 : 227  인용 특허 : 15

초록

The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential dri

대표청구항

A method for laser processing a multi-layered target including at least two layers having different chemical compositions, comprising: generating, from a non-excimer laser at a repetition rate of greater than about 1 kHz, high power ultraviolet laser output pulses having a predetermined spatial spot

이 특허에 인용된 특허 (15)

  1. LaPlante Mark J. (Walden NY) LaVine Mark G. (Milton VT) Long David C. (Wappingers Falls NY) Lu Poyang (Hopewell Junction NY) Seksinsky John J. (Poughkeepsie NY) Thorp Lawrence D. (Yorktown Heights NY, Formation of high quality patterns for substrates and apparatus therefor.
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  6. Handford Edward F. (Wurtsboro NY) Harvilchuck Joseph M. (Billings NY) Interrante Mario J. (New Paltz NY) Jackson Raymond A. (Wappingers Falls NY) Master Raj N. (Wappingers Falls NY) Ray Sudipta K. (W, Method and structure for repairing electrical lines.
  7. Marrs Robert C. (Scottsdale AZ) Hirakawa Tadashi (Osaka JPX), Method for forming an integrated circuit package with via interconnection.
  8. Wang Carl B. (Chapel Hill NC), Method for forming vias in multilayer circuits.
  9. Nemiroff Michael H. (Del Mar CA), Method of fabricating a tapered via hole in polyimide.
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  11. Traskos Richard T. (Brooklyn CT) Fleischer Cathy A. (Canterbury CT) Barton Carlos L. (Brooklyn CT) Noddin David B. (Ledyard CT), Method of laser drilling fluoropolymer materials.
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  14. Hamilton Harold J. (Santa Clara CA) Martin Timothy W. (Los Altos CA), Unitary micro-flexure structure and method of making same.
  15. Lincoln Thomas S. (Arvada CO) Bauer Charles E. (Evergreen CO), Via formation method for multilayer interconnect board.

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  150. Holden, James M., Multi-step and asymmetrically shaped laser beam scribing.
  151. Lei, Wei-Sheng; Eaton, Brad; Yalamanchili, Madhava Rao; Singh, Saravjeet; Kumar, Ajay; Holden, James M., Multi-step and asymmetrically shaped laser beam scribing.
  152. Lei, Wei-Sheng; Eaton, Brad; Yalamanchili, Madhava Rao; Singh, Saravjeet; Kumar, Ajay; Holden, James M., Multi-step and asymmetrically shaped laser beam scribing.
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  156. Gross,Abraham; Kotler,Zvi; Lipman,Eliezer, Multiple beam micromachining system for removing at least two different layers of a substrate.
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  162. Garcia, Jaime E.; Carroll, Craig Allen, Optical alignment system for power tool.
  163. Kreuzer,Justin L., Optical reduction system with control of illumination polarization.
  164. Ouye, Alan Hiroshi, Plasma thermal shield for heat dissipation in plasma chamber.
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  166. Etter,Mark A.; Hearn,Melinda J., Power tool control system user interface.
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  173. Sun, Yunlong; Harris, Richard S., Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same.
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  175. Garcia,Jaime E.; Weston,Jeffrey D.; Carroll,Craig A., Riving knife assembly for a dual bevel table saw.
  176. Kumar, Prabhat; Eaton, Brad; Lei, Wei-Sheng; Papanu, James S.; Kumar, Ajay, Screen print mask for laser scribe and plasma etch wafer dicing process.
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  180. Telfair William B. ; Hoffman Hanna J., Short pulse mid-infrared laser source for surgery.
  181. Cutler, Donald R., Simulated laser spot enlargement.
  182. Lei, Wei-Sheng; Papanu, James S.; Eaton, Brad; Kumar, Ajay, Singulation of wafers having wafer-level underfill.
  183. Nangoy, Roy C., Stationary actively-cooled shadow ring for heat dissipation in plasma chamber.
  184. Manfred Jendick DE, Strip guiding device.
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  187. Dance, Bruce Guy Irvine, Surface modification.
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  189. Baker, Christopher; Jinasundera, Sudirukkuge Tharanga; Li, Weixin, System and method for laser modulation.
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  191. Lipman, Eliezer; Kotler, Zvi; Prior, Yehiam, System and method for unveiling targets embedded in a multi-layered electrical circuit.
  192. Keller,David V., System for rapidly stopping a spinning table saw blade.
  193. Wang, Winston; Guo, Jianjin, System of laser positioning of an aperture processing machine.
  194. Ouye, Alan Hiroshi; Lerner, Alexander N., Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber.
  195. Lei, Wei-Sheng; Eaton, Brad; Park, Jungrae; Kumar, Ajay; Papanu, James S.; Kumar, Prabhat, UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach.
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  200. Mead, Roy D.; Pierce, Jeffrey W., Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates.
  201. Lei, Wei-Sheng; Kumar, Prabhat; Papanu, James S.; Eaton, Brad; Kumar, Ajay, Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach.
  202. Park, Jungrae; Lei, Wei-Sheng; Kumar, Prabhat; Papanu, James S.; Eaton, Brad; Kumar, Ajay, Wafer coating.
  203. Park, Jungrae; Lei, Wei-Sheng; Kumar, Prabhat; Papanu, James S.; Eaton, Brad; Kumar, Ajay, Wafer coating.
  204. Lei, Wei-Sheng; Eaton, Brad; Iyer, Aparna; Singh, Saravjeet; Yalamanchili, Madhava Rao; Kumar, Ajay, Wafer dicing from wafer backside.
  205. Lei, Wei-Sheng; Eaton, Brad; Kumar, Ajay, Wafer dicing from wafer backside and front side.
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  209. Lei, Wei-Sheng; Eaton, Brad; Yalamanchili, Madhava Rao; Singh, Saravjeet; Kumar, Ajay; Holden, James M., Wafer dicing using femtosecond-based laser and plasma etch.
  210. Lei, Wei-Sheng; Eaton, Brad; Yalamanchili, Madhava Rao; Singh, Saravjeet; Kumar, Ajay; Holden, James M., Wafer dicing using femtosecond-based laser and plasma etch.
  211. Lei, Wei-Sheng; Eaton, Brad; Yalamanchili, Madhava Rao; Singh, Saravjeet; Kumar, Ajay; Holden, James M., Wafer dicing using femtosecond-based laser and plasma etch.
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  216. Lei, Wei-Sheng; Eaton, Brad; Yalamanchili, Madhava Rao; Singh, Saravjeet; Kumar, Ajay; Iyer, Aparna, Wafer dicing using hybrid split-beam laser scribing process with plasma etch.
  217. Lei, Wei-Sheng; Singh, Saravjeet; Yalamanchili, Madhava Rao; Eaton, Brad; Kumar, Ajay, Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch.
  218. Lei, Wei-Sheng; Singh, Saravjeet; Dinev, Jivko; Iyer, Aparna; Eaton, Brad; Kumar, Ajay, Wafer dicing with etch chamber shield ring for film frame wafer applications.
  219. Lei, Wei-Sheng; Eaton, Brad; Iyer, Apama; Yalamanchili, Madhava Rao; Kumar, Ajay, Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach.
  220. Lei, Wei-Sheng; Eaton, Brad; Kumar, Ajay, Wafer edge warp suppression for thin wafer supported by tape frame.
  221. Lei, Wei-Sheng; Eaton, Brad; Kumar, Ajay, Wafer edge warp supression for thin wafer supported by tape frame.
  222. Lei, Wei-Sheng; Singh, Saravjeet; Yalamanchili, Madhava Rao; Eaton, Brad; Kumar, Ajay, Water soluble mask for substrate dicing by laser and plasma etch.
  223. Lei, Wei-Sheng; Singh, Saravjeet; Yalamanchili, Madhava Rao; Eaton, Brad; Kumar, Ajay, Water soluble mask for substrate dicing by laser and plasma etch.
  224. Lei, Wei-Sheng; Papanu, James S.; Eaton, Brad; Kumar, Ajay, Water soluble mask formation by dry film lamination.
  225. Lei, Wei-Sheng; Papanu, James S.; Eaton, Brad; Kumar, Ajay, Water soluble mask formation by dry film lamination.
  226. Lei, Wei-Sheng; Papanu, James S.; Kumar, Prabhat; Eaton, Brad; Kumar, Ajay, Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing.
  227. Hert, Thomas, Workpiece cutting.
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