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For use with a heatsink a shroud having a varying cross-sectional area 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0515726 (1995-08-18)
발명자 / 주소
  • Smith Randall (Georgetown TX) Mills R. Steven (Austin TX)
출원인 / 주소
  • Dell USA, L.P. (Austin TX 02)
인용정보 피인용 횟수 : 41  인용 특허 : 4

초록

The present invention provides a shroud for cooling a heatsink that is associated with a heat generating electrical component. Conventionally, the heatsink has a base portion with a first side and an oppositely disposed second side. The first side has cooling projections with outer ends that extend

대표청구항

A method of cooling a heat generating electrical component, said heat generating electrical component having a heatsink associated therewith, said heatsink having a base portion with a first side and an oppositely disposed second side, said first side having cooling projections with outer ends, said

이 특허에 인용된 특허 (4)

  1. Dunn Robert M. (Endicott NY) Schulman Martin D. (Wappingers NY) Timko ; Jr. Nicholas (Johnson City NY), Electronic circuit module cooling.
  2. Mitchell ; Jr. John W. (Pasadena CA), Heat sink for integrated circuit package.
  3. Nelson Richard D. (Austin TX) Herrell Dennis J. (Austin TX), Low pressure high heat transfer fluid heat exchanger.
  4. Nelson Richard D. (Austin TX) Herrell Dennis J. (Austin TX), Low pressure high heat transfer fluid heat exchanger.

이 특허를 인용한 특허 (41)

  1. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  2. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  3. Tanner, James; Hamburgen, William Riis, Active cooling debris bypass fin pack.
  4. Cravens,Zachary A.; Wobig,Eric C., Adjustable heat sink shroud.
  5. Ong, Brett C.; Milo, Michael T.; Vu, Quyen T., Air baffle with integrated tool-less expansion card attachment.
  6. Chen,Chin Hui, Air guiding cover.
  7. Chen,Richard, Air shroud for dissipating heat from an electronic component.
  8. Sun, Zheng-Heng; Ma, Xiao-Feng, Airflow guide member and electronic device having the same.
  9. Artman, Paul T.; Bailey, Mark M., Airflow shroud mounted fan system and method for cooling information handling system components.
  10. Shawn P. Hoss ; Brently L. Cooper, Apparatus for cooling heat generating devices.
  11. John R. Sterner, Apparatus to enhance cooling of electronic device.
  12. John R. Sterner, Apparatus to enhance cooling of electronic device.
  13. John R. Sterner, Apparatus to enhance cooling of electronic device.
  14. John R. Sterner, Apparatus to enhance cooling of electronic device.
  15. John R. Sterner, Apparatus to enhance cooling of electronic device.
  16. John R. Sterner, Apparatus to enhance cooling of electronic device.
  17. Sterner John R., Apparatus to enhance cooling of electronic device.
  18. Sterner,John R., Apparatus to enhance cooling of electronic device.
  19. Pawlak, III,John Lawrence; Reyzin,Ilya; Bhatti,Mohinder Singh, Compact modular CPU cooling unit.
  20. Kadota Shigeru,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Yamada Kenji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  21. Gonner Johannes,DEX ; Masatz Joachim,DEX, Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same.
  22. Crane ; Jr. Stanford W. ; Krishnapura Lakshminarasimha ; Behar Moises ; Dutta Arindum ; Link Kevin J. ; Ahearn Bill, Cooling system for semiconductor die carrier.
  23. Miyoshi, Toyokazu, Device for air-cooling electronic apparatus.
  24. Jensen, Ralph W.; Bailey, Mark M., Dishrack shroud for shielding and cooling.
  25. Marquis Terrance M. ; Duley Raymond S., Duct processor cooling for personal computer.
  26. Downing, Robert Scott, Efficient cooling duct.
  27. Wang, Shih-Yuan; Kuekes, Philip J.; Patel, Chandrakant, Electronic components, systems and apparatus with air flow devices.
  28. Bird, John; Larson, Ralph I.; North, Lyne Dor?; Bussiere, Paul; Allen, Amy, Electronics cooling subassembly.
  29. Tian,Wei Qiang; Xia,Wan Lin; Li,Tao, Heat dissipation device.
  30. Bird, John; Larson, Ralph I.; North, Lyne Dore; Bussiere, Paul; Allen, Amy, Heat removal system.
  31. North, Mark T.; Koffs, Steven E., Heat sink with converging device.
  32. Park,Hee sung; Kim,Sun soo, Heatsink.
  33. Al-Garni, Ahmed Z.; Hawwa, Muhammad A., Hybrid cooling system and method for cooling electronic devices.
  34. Turney, Joseph; St. Rock, Brian; Whiton, John H., Integrated blower diffuser and heat exchanger for electronics enclosure.
  35. Craft, Jr.,Thomas Francis, Jet impingement cooling apparatus and method.
  36. Jeffries John ; Cook Stephen ; Hernandez Gilberto, Method and apparatus for mounting a component and heat sink.
  37. Tantoush, Mohammed A.; Kitlas, Kenneth, Method and apparatus for removing heat from an electronic device.
  38. Li,Nien Lun; Yeh,Yun Yeu; Hsu,To; Chu,Hung Chung; Lee,Cheng Hsing, Method and apparatus for side-type heat dissipation.
  39. Engelhardt, Michel; Stehlik, Paul Otto; Hannaford, Jr., Lawrence Joseph, Phase change heat sink for transient thermal management.
  40. Bird, John; Bussiere, Paul; Dor?-North, Lyne; Allen, Amy; Larson, Ralph I., System and method for mounting a heat sink.
  41. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
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