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특허 상세정보

Method for material removal

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B24C-001/00   
미국특허분류(USC) 451/39 ; 451/40 ; 451/53 ; ; 83/53
출원번호 US-0265430 (1994-06-24)
발명자 / 주소
인용정보 피인용 횟수 : 60  인용 특허 : 21
초록

A method and apparatus that allows the removal of solid material from a workpiece utilizes a high velocity stream of ice which is caused to impinge on the workpiece. A working liquid, such as water, is supplied at high pressure to a discharge nozzle with an orifice for forming the needle-like stream. The water is cooled before it reaches the nozzle to a temperature below its freezing point so that at least some of the stream is transformed to ice. Optionally, the stream is cooled after it is emitted from the orifice by flowing an envelope of cryogenic ga...

대표
청구항

A method of cutting a solid workpiece, comprising the steps of: (a) forcing a stream of liquid working material through a conduit having an orifice for emitting the working material, (b) cooling a section of said conduit that extends through a heat exchanger having a cryogenic fluid in heat exchange relationship with said working material to thereby cause solidification of at least some of the working material emitted through said orifice, (c) impinging said working material on the workpiece to bore a hole that is dimensioned so as to accept said conduit...

이 특허에 인용된 특허 (21)

  1. Krasnoff Eugene L. (Somerville NJ). Abrasive-jet cutting system. USP1988024723387.
  2. Whitlock Walter H. (Peapack NJ) Weltmer ; Jr. William R. (Murray Hill NJ) Clark James D. (Mountainside NJ). Apparatus and method for removing minute particles from a substrate. USP1989024806171.
  3. Fong Calvin C. (Beverly Hills CA) Altizer John W. (Simi Valley CA) Arnold Vernon E. (Fillmore CA) Lawson John K. (Granada Hills CA). Blasting machine utilizing sublimable particles. USP1983064389820.
  4. Lightstone John Bernard (White Plains NY) Mazzarella Richard Benedict (Indianapolis IN). Cryogenic shearing of metal. USP1976093979981.
  5. Hagler Herbert K. (Dallas TX). Cryogenic ultramicrotome seal. USP1990044918941.
  6. Bettin Elizabeth M. (228 S. Kensington Ave. LaGrange IL 60525). Device for cooling microtome blade. USP1981044262567.
  7. Elkins James H. (Picayune MS). Device for underwater cryogenic cutting. USP1984054447952.
  8. Conn Andrew F. (Baltimore MD) Lindenmuth William T. (Columbia MD) Frederick Gary S. (Reisterstown MD). Fluid jet apparatus and method for cleaning tubular components. USP1985044508577.
  9. Phillips Robert (Epsom GB2). High pressure liquid cutting method. USP1987044658683.
  10. Windisch Franz (Kapfenberg ATX). Liquid jet cutting apparatus. USP1986064594924.
  11. Jaritz Erich (Kapfenberg ATX) Krammer Gnter (Vienna ATX). Liquid jet cutting machine for cutting workpieces, especially flat workpieces. USP1987084686877.
  12. Wainwright Ronald C. (Hertfordshire GB2) Beesley Lawrence R. (Essex GB2). Method and apparatus for controlling the cutting of an object. USP1987094693153.
  13. Vives Michel (Eysines FRX) Daubigny Pierre (Saint Medard en Jalles FRX) Ruet Claude (Martignas FRX). Method and apparatus for cutting up fixed layers of flexible material using a high pressure water jet. USP1992035097731.
  14. Rufin Denis A. (Hinsdale IL). Method and apparatus for in situ cleaning of excimer laser optics. USP1991035001873.
  15. Mains ; Jr. Gilbert L. (1200 Hayes Industrial Dr. Marietta GA 30062). Method and apparatus for material removal. USP1994085341608.
  16. Mains ; Jr. Gilbert L. (1200 Hayes Industrial Dr. Marietta GA 30062). Method for material removal. USP1993065222332.
  17. Yankoff Gerald K. (Cincinnati OH). Method of high speed machining. USP1989054829859.
  18. Lloyd Daniel L. (Mason OH). Phase change injection nozzle. USP1991055018667.
  19. Arnout Michel (Franconville FRX) Thonnelier Jean-Yves (Voisin Le Bretonneux FRX). Process and device for cutting by liquid jet. USP1992115165602.
  20. Tada Masuo (Yao JPX) Hata Takeki (Kobe JPX) Fukumoto Takaaki (Itami JPX) Ohmori Toshiaki (Itami JPX). Processing apparatus for semiconductor wafers. USP1991065025597.
  21. Levi Mark W. (Utica NY). Wafer cleaning method. USP1991045009240.

이 특허를 인용한 특허 피인용횟수: 60

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