초록 ▼

An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined

An integral solder preform is disclosed for application to a printed circuit card having first and second sides, a first edge and first and second pluralities of conductive pads disposed on the respective first and second sides of the printed circuit card in respective first and second predetermined conductive pad arrangements. The integral solder preform has first and second pluralites of solder pads having respective first and second solder pad arrangements which are maintained in position by a plurality of bridging solder bands. The first and second solder pad arrangements correspond to the first and second predetermined conductive pad arrangements and are spaced apart by a predetermined distance by spacing solder bands. The printed circuit card is aligned over the spacing solder bands and the first and second solder pad arrangements are wrapped around the first edge such that the first and second solder pad pluralities of solder pads overlay respective first and second pluralities of conductive pads on the printed circuit card. A fixture which may be employed to facilitate the alignment of the solder preform for use with the solder preform is also disclosed.

대표청구항 ▼

A solder preform for use with a printed circuit card having first and second sides, a first edge, a first pattern of conductive pads disposed on said first side of said printed circuit card and a second pattern of conductive pads disposed on said second side of said circuit card, said solder preform

A solder preform for use with a printed circuit card having first and second sides, a first edge, a first pattern of conductive pads disposed on said first side of said printed circuit card and a second pattern of conductive pads disposed on said second side of said circuit card, said solder preform comprising: a first array of solder pads arranged in a first solder pad pattern corresponding to said first pattern of conductive pads on said first side of said printed circuit card; a first plurality of bridging solder bands connecting selected ones of said first array of solder pads to maintain said first array of solder pads in said first solder pad pattern; a second array of solder pads arranged in a second solder pad pattern corresponding to said second pattern of conductive pads on said second side of said circuit card; a second plurality of bridging solder bands connecting selected ones of said second array of solder pads to maintain said second array of solder pads in said second solder pad pattern; and a plurality of spacing solder bands interconnecting selected ones of said first array of solder pads with selected ones of said second array of solder pads to form an integral solder preform, said first array of solder pads being arranged to overlay said plurality of conductive pads on said first side of said printed circuit and said second array of solder pads being arranged to overlay said plurality of conductive pads on said second side of said printed circuit card when said solder preform is wrapped around said first edge of said printed circuit card.