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Packaging multi-chip modules without wire-bond interconnection

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/34
출원번호 US-0393628 (1995-02-24)
발명자 / 주소
  • Degani Yinon (Highland Park NJ) Dudderar Thomas D. (Chatham NJ) Han Byung J. (Scotch Plains NJ) Lyons Alan M. (New Providence NJ) Tai King L. (Berkeley Heights NJ)
출원인 / 주소
  • Lucent Technologies Inc. (Murray Hill NJ 02)
인용정보 피인용 횟수 : 243  인용 특허 : 1

초록

Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least one chip flip-chip mounted on the substrate. T

대표청구항

A low profile multi-chip module (MCM) circuit arrangement which comprises an MCM tile and a printed wiring board (PWB), the MCM tile comprising a substrate and at least one silicon chip physically and electrically connected to the substrate, said PWB having an aperture through the PWB and contact fi

이 특허에 인용된 특허 (1)

  1. Beene Gary L. (Allen TX) Petrovich Thomas D. (Richardson TX) Williams Charles E. (Dallas TX), Chip carrier with interconnects on lid.

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