초록 ▼

A multi-chip module includes a mechanically floated substrate on which integrated circuit devices are mounted. The substrate is located within a heat exchanger. In one embodiment, a spring or an array of springs biases the substrate upwardly to press the integrated circuit devices against a surface

A multi-chip module includes a mechanically floated substrate on which integrated circuit devices are mounted. The substrate is located within a heat exchanger. In one embodiment, a spring or an array of springs biases the substrate upwardly to press the integrated circuit devices against a surface within the heat exchanger. The substrate is displaceable with respect to the heat exchanger, allowing accommodations to differences in thermal expansion coefficients and to non-uniformities resulting from less than exact manufacturing tolerances of the substrate, the heat exchanger and the integrated circuit devices. Another embodiment includes resting the substrate on a conformable membrane that is used to entrap a fixed volume of thermally-conductive liquid. The membrane-and-liquid arrangement mechanically floats the substrate and ensures a proper integrated circuit device/exchanger thermal interface. A flexible multi-conductor interconnect is electrically coupled to the substrate to allow conduction of signals to and from the substrate without interfering with the ability of the substrate to float mechanically. Also disclosed is a module in which the membrane-and-liquid arrangement is used at the integrated circuit device side of the substrate to achieve a deformable electrical and thermal flow path from the integrated circuit devices to the heat exchanger. The membrane adapts to variations in the heights and/or angles of the integrated circuit devices.

대표청구항 ▼

A multi-chip module comprising: a substrate having a component surface; a plurality of integrated circuit devices mounted on said component surface of said substrate; a heat exchanger body having interior walls defining a substrate chamber, said substrate movably housed within said substrate chamber

A multi-chip module comprising: a substrate having a component surface; a plurality of integrated circuit devices mounted on said component surface of said substrate; a heat exchanger body having interior walls defining a substrate chamber, said substrate movably housed within said substrate chamber with said integrated circuit devices thermally coupled to a first interior wall of said heat exchanger body; a serpentine spring for yieldingly holding said substrate within said heat exchanger body such that said substrate is displaceable relative to and towards said first interior wall of said heat exchanger body to accommodate non-uniformities with respect to thermal expansion coefficients and dimensional tolerances of said substrate, said heat exchanger body and said integrated circuit devices, wherein said serpentine spring is disposed to maintain said thermal coupling of said integrated circuit devices with said first interior wall; and thermal grease enclosing and embedding the spring.