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Polishing method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-049/00
  • B24B-051/00
출원번호 US-0421247 (1995-04-13)
우선권정보 JP-0075625 (1994-04-14)
발명자 / 주소
  • Moriyama Shigeo (Tama JPX) Kawamura Yoshio (Kokubunji JPX) Homma Yoshio (Hinode-machi JPX) Kusukawa Kikuo (Fujino-machi JPX) Furusawa Takeshi (Hachioji JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 241  인용 특허 : 5

초록 ▼

Disclosed is a method of polishing a thin film layer to be polished, which is formed on the surface of a substrate, by pressing the substrate on the surface of a polishing pad and relatively moving the substrate and the polishing pad, the method comprising the steps of: detecting the position of a f

대표청구항 ▼

A method of polishing a thin film layer to be polished, which is formed on the surface of a substrate, by pressing said substrate on the surface of a polishing pad and relatively moving said substrate and said polishing pad, said method comprising the steps of: detecting the position of a front surf

이 특허에 인용된 특허 (5)

  1. Sandhu Gurtej S. (Boise ID) Schultz Laurence D. (Boise ID) Doan Trung T. (Boise ID), Apparatus for endpoint detection during mechanical planarization of semiconductor wafers.
    상세보기
  2. Salugsugan Isi (Fremont CA), Audio end point detector for chemical-mechanical polishing and method therefor.
    상세보기
  3. Arai Hatsuyuki (Zama JPX) Sugiyama Misuo (Hadano JPX), Flat lapping machine with sizing mechanism.
    상세보기
  4. Miller Gabriel L. (Westfield NJ) Wagner Eric R. (South Plainfield NJ), In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection.
    상세보기
  5. Cote William J. (Poughquag NY), Method for determining planarization endpoint during chemical-mechanical polishing.
    상세보기

이 특허를 인용한 특허 (241)

  1. Lugg, Paul S., Abrasive article for the deposition and polishing of a conductive material.
    상세보기
  2. Molnar, Charles J., Abrasive finishing with lubricant and tracking.
    상세보기
  3. Molnar Charles J, Abrasive finishing with partial organic boundary layer.
    상세보기
  4. Molnar, Charles J., Advanced finishing control.
    상세보기
  5. Molnar, Charles J., Advanced finishing control.
    상세보기
  6. Molnar, Charles J., Advanced finishing control.
    상세보기
  7. Molnar,Charles J., Advanced finishing control.
    상세보기
  8. Molnar,Charles J., Advanced wafer refining.
    상세보기
  9. Molnar, Charles J., Advanced workpiece finishing.
    상세보기
  10. Molnar, Charles J., Advanced workpiece finishing.
    상세보기
  11. Lee,Ruojia; Kauffman,Ralph; Keller,J. Dennis, Aluminum interconnects with metal silicide diffusion barriers.
    상세보기
  12. Lee Ruojia ; Kauffman Ralph ; Keller J. Dennis, Aluminum-filled self-aligned trench for stacked capacitor structure and methods.
    상세보기
  13. Lee, Ruojia; Kauffman, Ralph; Keller, J. Dennis, Aluminum-filled self-aligned trench for stacked capacitor structure and methods.
    상세보기
  14. Lee, Ruojia; Kauffman, Ralph; Keller, J. Dennis, Aluminum-filled self-aligned trench for stacked capacitor structure and methods.
    상세보기
  15. Ruojia Lee ; Ralph Kauffman ; J. Dennis Keller, Aluminum-filled self-aligned trench for stacked capacitor structure and methods.
    상세보기
  16. Konermann,Stefan; Stein,Markus, Apparatus and method for capacitive measurement of materials.
    상세보기
  17. Dall'Aglio, Carlo, Apparatus and method for checking thickness dimensions of an element while it is being machined.
    상세보기
  18. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  19. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  20. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  21. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  22. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  23. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  24. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
    상세보기
  25. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
    상세보기
  26. Kazuo Ishizaki JP; Hiroyuki Itoh JP, Apparatus and method for processing thin-film magnetic head material.
    상세보기
  27. Daniel David W. ; Gregory John W. ; Allman Derryl D. J., Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance.
    상세보기
  28. Zhao, Eugene Y.; Jia, Kang; Steiman, Michael David; Litvak, Herbert Elliot; Frederickson, Christian David, Apparatus for accurate endpoint detection in supported polishing pads.
    상세보기
  29. Lee Lawrence L., Apparatus for chemical mechanical polishing.
    상세보기
  30. Holzapfel Paul ; Yednak ; III Andrew ; Natalicio John ; Goudie Chad, Apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing.
    상세보기
  31. Taravade Kunal N., Apparatus for detecting an endpoint polishing layer of a semiconductor wafer having a wafer carrier with independent concentric sub-carriers and associated method.
    상세보기
  32. Kimura,Norio; Ishii,Yu; Hiyama,Hirokuni; Okumura,Katsuya; Yano,Hiroyuki, Apparatus for polishing a substrate.
    상세보기
  33. Berman Michael J., Automated inspection system for residual metal after chemical-mechanical polishing.
    상세보기
  34. Yoshihiro Hayashi JP; Kazuo Kobayashi JP, Automatic polishing apparatus capable of polishing a substrate with a high planarization.
    상세보기
  35. Sun, Tao; Medsker, Robert, CMP composition comprising surfactant.
    상세보기
  36. Huang, Hung-Tsung; Yeh, Ming-Chih; Tsai, Chih-Pin, CMP composition for silicon nitride removal.
    상세보기
  37. de Rege Thesauro, Francesco; Bayer, Benjamin P., CMP composition with a polymer additive for polishing noble metals.
    상세보기
  38. Dockery, Kevin P.; Jia, Renhe; Dysard, Jeffrey, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
    상세보기
  39. Reiss, Brian; Whitener, Glenn, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
    상세보기
  40. Reiss, Brian; Willhoff, Michael; Mateja, Daniel, CMP compositions selective for oxide and nitride with high removal rate and low defectivity.
    상세보기
  41. Li, Tina; Dockery, Kevin; Jia, Renhe; Dysard, Jeffrey, CMP compositions selective for oxide over polysilicon and nitride with high removal rate and low defectivity.
    상세보기
  42. Fu, Lin; Grumbine, Steven, CMP compositions with low solids content and methods related thereto.
    상세보기
  43. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.
    상세보기
  44. Redeker, Fred C.; Bajaj, Rajeev, Chemical mechanical polishing of a metal layer with polishing rate monitoring.
    상세보기
  45. Pallikkara Kuttiatoor, Sudeep; Jia, Renhe; Dysard, Jeffrey, Chemical-mechanical planarization of polymer films.
    상세보기
  46. Kim, Kyoung-Woo; Yang, Yu-Sin, Chemical-mechanical polishing apparatus and method for controlling the same.
    상세보기
  47. Fu, Lin; Grumbine, Steven; Stender, Matthias, Chemical-mechanical polishing composition containing zirconia and metal oxidizer.
    상세보기
  48. Ikenaga, Kazuyuki; Tetsuka, Tsutomu; Furuse, Muneo, Cleaning apparatus.
    상세보기
  49. Kraft, Steven; Wolff, Andrew; Carter, Phillip W.; Petro, Benjamin, Cobalt dishing control agents.
    상세보기
  50. Kraft, Steven; Wolff, Andrew; Carter, Phillip W.; Hayes, Kristin; Petro, Benjamin, Cobalt polishing accelerators.
    상세보기
  51. Johansson, Nils; Swedek, Boguslaw A.; Birang, Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.
    상세보기
  52. Johansson,Nils; Swedek,Boguslaw A.; Birang,Manoocher, Combined eddy current sensing and optical monitoring for chemical mechanical polishing.
    상세보기
  53. Feeney, Paul M.; Anjur, Sriram; Dysard, Jeffrey M., Composition and method for damascene CMP.
    상세보기
  54. Reiss, Brian; Clark, John; Jones, Lamon; Gilliland, Jeffrey; White, Michael, Composition and method for polishing bulk silicon.
    상세보기
  55. Reiss, Brian; White, Michael; Jones, Lamon; Clark, John, Composition and method for polishing bulk silicon.
    상세보기
  56. Lau, Hon Wu; Siriwardane, Haresh, Composition and method for polishing glass.
    상세보기
  57. Palanisamy Chinnathambi, Selvaraj; White, Michael, Composition and method for polishing memory hard disks.
    상세보기
  58. Reiss, Brian; Johns, Timothy; White, Michael; Jones, Lamon; Clark, John, Composition and method for polishing polysilicon.
    상세보기
  59. Dysard, Jeffrey; Anjur, Sriram; Johns, Timothy; Chen, Zhan, Compositions and methods for polishing silicon nitride materials.
    상세보기
  60. Brusic, Vlasta; Zhou, Renjie; Feeney, Paul; Thompson, Christopher, Compositions for polishing aluminum/copper and titanium in damascene structures.
    상세보기
  61. Molnar, Charles J., Controlled lubricated finishing.
    상세보기
  62. Cavanaugh, Mary; Kraft, Steven; Wolff, Andrew; Carter, Phillip W.; Sikma, Elise; Cross, Jeffrey; Petro, Benjamin, Corrosion inhibitors and related compositions and methods.
    상세보기
  63. Berman, Michael J., Determination of film thickness during chemical mechanical polishing.
    상세보기
  64. David,Jeffrey Drue; Johansson,Nils; Birang,Manoocher; Swedek,Boguslaw A.; Carlsson,Ingemar, Determination of position of sensor measurements during polishing.
    상세보기
  65. Asai, Kazumasa, Double-side polishing method.
    상세보기
  66. Sarfaty,Moshe; Sreenivasan,Ramaswamy; Nulman,Jaim, Eddy-optic sensor for object inspection.
    상세보기
  67. Yi, Jingang; Xu, Cangshan, End point detection with imaging matching in semiconductor processing.
    상세보기
  68. Gail D. Shelton ; Gayle W. Miller, Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint.
    상세보기
  69. Shelton Gail D. ; Miller Gayle W., Endpoint detection method and apparatus which utilize a chelating agent to detect a polishing endpoint.
    상세보기
  70. Chisholm Brynne K. ; Miller Gayle W. ; Shelton Gail D., Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material.
    상세보기
  71. Chisholm Brynne K. ; Miller Gayle W. ; Shelton Gail D., Endpoint detection method and apparatus which utilize an endpoint polishing layer of catalyst material.
    상세보기
  72. Swedek Boguslaw ; Wiswesser Andreas Norbert,DEX, Endpoint detection with light beams of different wavelengths.
    상세보기
  73. Swedek, Boguslaw; Wiswesser, Andreas Norbert, Endpoint detection with light beams of different wavelengths.
    상세보기
  74. Wiswesser,Andreas Norbert; Schoenleber,Walter, Endpoint detection with multiple light beams.
    상세보기
  75. Molnar, Charles J, Finishing element using finishing aids.
    상세보기
  76. Charles J Molnar, Finishing element with finishing aids.
    상세보기
  77. Molnar, Charles J, Finishing method for semiconductor wafers using a lubricating boundary layer.
    상세보기
  78. Charles J. Molnar, Finishing with partial organic boundary layer.
    상세보기
  79. Molnar Charles J, Fixed abrasive finishing element having aids finishing method.
    상세보기
  80. Molnar Charles J, Fixed abrasive finishing method using lubricants.
    상세보기
  81. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
    상세보기
  82. Grumbine,Steven K., Gallium and chromium ions for oxide rate enhancement.
    상세보기
  83. Li, Shoutian, Halide anions for metal removal rate control.
    상세보기
  84. Li, Shoutian, Halide anions for metal removal rate control.
    상세보기
  85. Molnar, Charles J., In situ control with lubricant and tracking.
    상세보기
  86. Molnar,Charles J, In situ finishing control.
    상세보기
  87. Molnar, Charles J, In situ friction detector method and apparatus.
    상세보기
  88. Osugi Richard S. ; Nagahara Ronald J. ; Lee Dawn M., In-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradation.
    상세보기
  89. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  90. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
    상세보기
  91. Swedek, Boguslaw A.; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.
    상세보기
  92. Swedek, Boguslaw A; Birang, Manoocher; Johansson, Nils, Integrated endpoint detection system with optical and eddy current monitoring.
    상세보기
  93. Swedek,Boguslaw A.; Birang,Manoocher; Johansson,Nils, Integrated endpoint detection system with optical and eddy current monitoring.
    상세보기
  94. Li, Shoutian; Carter, Phillip W.; Zhang, Jian, Iodate-containing chemical-mechanical polishing compositions and methods.
    상세보기
  95. Bly,Vincent T., Lightweight optical mirrors formed in single crystal substrate.
    상세보기
  96. Redeker,Fred C.; Birang,Manoocher; Li,Shijian; Somekh,Sasson, Linear polishing sheet with window.
    상세보기
  97. Oshiki Mitsumasa,JPX ; Iijima Nobuo,JPX ; Watanuki Motoichi,JPX, Magnetoresistive type magnetic head and method of manufacturing the same and apparatus for polishing the same.
    상세보기
  98. Motoichi Watanuki JP; Tomokazu Sugiyama JP; Kazuo Yokoi JP; Yoshiaki Yanagida JP; Koji Suto JP, Manufacturing method for magnetic heads.
    상세보기
  99. Hiroshi Mizuno JP; Osamu Kinoshita JP; Tetsuaki Murohashi JP; Akihisa Ueno JP; Yoshifumi Sakuma JP; Kostas Amberiadis, Method and apparatus for chemical-mechanical polishing.
    상세보기
  100. Berman Michael J. ; Holland Karey L., Method and apparatus for concurrent pad conditioning and wafer buff in chemical mechanical polishing.
    상세보기
  101. Allman Derryl D. J. ; Daniel David W. ; Gregory John W., Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system.
    상세보기
  102. Derryl D. J. Allman ; David W. Daniel ; John W. Gregory, Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system.
    상세보기
  103. Allman Derryl D. J. ; Daniel David W. ; Chisholm Michael F., Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer.
    상세보기
  104. Allman Derryl D. J. ; Daniel David W. ; Gregory John W., Method and apparatus for detecting a polishing endpoint based upon infrared signals.
    상세보기
  105. Wiswesser Andreas Norbert,DEX ; Pan Judon Tony ; Swedek Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  106. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  107. Wiswesser, Andreas Norbert; Pan, Judon Tony; Swedek, Boguslaw, Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers.
    상세보기
  108. Taravade Kunal N., Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer.
    상세보기
  109. Miller Gayle W. ; Chisholm Michael F., Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor wafer.
    상세보기
  110. Wiswesser,Andreas Norbert; Schoenleber,Walter; Swedek,Boguslaw; Birang,Manoocher, Method and apparatus for determining polishing endpoint with multiple light sources.
    상세보기
  111. Thomas Frederick Allen Bibby, Jr. ; John A. Adams ; Robert A. Eaton, Method and apparatus for endpoint detection for chemical mechanical polishing.
    상세보기
  112. Chalmers,Scott A.; Geels,Randall S., Method and apparatus for high-speed thickness mapping of patterned thin films.
    상세보기
  113. Jairath Rahul ; Pecen Jiri ; Chadda Saket ; Krusell Wilbur C. ; Cutini Jerauld J. ; Engdahl Erik H., Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher.
    상세보기
  114. Meloni Mark, Method and apparatus for in-situ measurement of workpiece displacement during chemical mechanical polishing.
    상세보기
  115. Pecen, Jiri; Chadda, Saket; Jairath, Rahul; Krusell, Wilbur C., Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing.
    상세보기
  116. Kimba, Toshifumi; Nakai, Shunsuke, Method and apparatus for measuring film thickness.
    상세보기
  117. Mautz, Karl E., Method and apparatus for monitoring a polishing condition of a surface of a wafer in a polishing process.
    상세보기
  118. Ishikawa, Akira; Ushio, Yoshijiro, Method and apparatus for monitoring polishing state, polishing device, process wafer, semiconductor device, and method of manufacturing semiconductor device.
    상세보기
  119. Nagahara Ronald J. ; Lee Dawn M., Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing.
    상세보기
  120. Nagahara, Ronald J.; Lee, Dawn M., Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing.
    상세보기
  121. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  122. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.
    상세보기
  123. Ni, Tuqiang, Method and system for detecting an exposure of a material on a semiconductor wafer during chemical-mechanical polishing.
    상세보기
  124. Finarov, Moshe, Method and system for endpoint detection.
    상세보기
  125. Finarov, Moshe, Method and system for endpoint detection.
    상세보기
  126. Finarov, Moshe, Method and system for endpoint detection.
    상세보기
  127. Finarov, Moshe, Method and system for endpoint detection.
    상세보기
  128. Finarov,Moshe, Method and system for endpoint detection.
    상세보기
  129. Kishida, Takenobu; Harada, Takeshi; Hinomura, Toru; Abe, Hiromitsu; Satake, Mitsunari; Kunimitsu, Kenichi, Method for fabricating a semi-conductor device having a tungsten film-filled via hole.
    상세보기
  130. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Method for in-situ endpoint detection for chemical mechanical polishing operations.
    상세보기
  131. Strasbaugh, Alan, Method for making a polishing pad with built-in optical sensor.
    상세보기
  132. Kimura, Norio; Ishii, Yu; Hiyama, Hirokuni; Okumura, Katsuya; Yano, Hiroyuki, Method for polishing a substrate.
    상세보기
  133. Hsia Shouli Steve ; Wang Yanhua ; Pallinti Jayanthi, Method for shallow trench isolations with chemical-mechanical polishing.
    상세보기
  134. Ping-Yi Chang TW, Method of CMP endpoint detection.
    상세보기
  135. Miller Gayle W. ; Shelton Gail D. ; Chisholm Brynne K., Method of detecting a polishing endpoint layer of a semiconductor wafer which includes a non-reactive reporting specie.
    상세보기
  136. Swedek,Boguslaw A.; Birang,Manoocher, Method of forming a polishing pad for endpoint detection.
    상세보기
  137. Birang, Manoocher; Gleason, Allan; Guthrie, William L., Method of forming a transparent window in a polishing pad.
    상세보기
  138. Wiswesser, Andreas Norbert; Oshana, Ramiel; Hughes, Kerry F.; Rohde, Jay; Huo, David Datong; Benvegnu, Dominic J., Method of making and apparatus having polishing pad with window.
    상세보기
  139. Holzapfel Paul ; Schlueter James ; Karlsrud Chris ; Lin Warren, Methods and apparatus for detecting removal of thin film layers during planarization.
    상세보기
  140. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
    상세보기
  141. Lehman, Kurt; Chen, Charles; Allen, Ronald L.; Shinagawa, Robert; Sethuraman, Anantha; Bevis, Christopher F.; Trikas, Thanassis; Chen, Haiguang; Meng, Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
    상세보기
  142. Lehman,Kurt; Chen,Charles; Allen,Ronald L.; Shinagawa,Robert; Sethuraman,Anantha; Bevis,Christopher F.; Trikas,Thanassis; Chen,Haiguang; Meng,Ching Ling, Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool.
    상세보기
  143. Laursen,Thomas; Quarantello,Justin; Stotts,Thomas; Franzen,Paul, Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization.
    상세보기
  144. Reiss, Brian; Nalaskowski, Jakub; Lam, Viet; Jia, Renhe; Dysard, Jeffrey, Mixed abrasive polishing compositions.
    상세보기
  145. Mrzyglod, Brian; Nair, Jayakrishnan; Blake, Garrett, Multi-layer polishing pad for CMP.
    상세보기
  146. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.
    상세보기
  147. Tolles, Robert D., Multilayer polishing pad and method of making.
    상세보기
  148. Weldon, Matthew; Laursen, Thomas; Grief, Malcolm; Holzapfel, Paul; Meloni, Mark A.; Eaton, Robert, Multiprobe detection system for chemical-mechanical planarization tool.
    상세보기
  149. Weldon, Matthew; Laursen, Thomas; Grief, Malcolm; Holzapfel, Paul; Meloni, Mark A.; Eaton, Robert, Multiprobe detection system for chemical-mechanical planarization tool.
    상세보기
  150. Yagi Takeshi,JPX, Optical polishing apparatus and methods.
    상세보기
  151. Schietinger, Charles W.; Hoang, Ahn N., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.
    상세보기
  152. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.
    상세보기
  153. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.
    상세보기
  154. Schietinger,Charles W.; Hoang,Anh N.; Bakin,Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.
    상세보기
  155. Randolph E. Treur ; John M. Boyd ; Stephan H. Wolf, Optical view port for chemical mechanical planarization endpoint detection.
    상세보기
  156. Treur Randolph E. ; Boyd John M. ; Wolf Stephan H., Optical view port for chemical mechanical planarization endpoint detection.
    상세보기
  157. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.
    상세보기
  158. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.
    상세보기
  159. Schultz,Stephen C.; Herb,John D.; Marquardt,Dave, Platen and manifold for polishing workpieces.
    상세보기
  160. Kimura, Norio; Isobe, Hideji; Shimizu, Kazuo; Osawa, Hiroyuki, Polishing apparatus.
    상세보기
  161. Kimura,Norio; Isobe,Hideji; Shimizu,Kazuo; Osawa,Hiroyuki, Polishing apparatus.
    상세보기
  162. Kobata, Itsuki; Kobayashi, Yoichi; Ono, Katsutoshi; Kinoshita, Masaki; Kimba, Toshifumi, Polishing apparatus.
    상세보기
  163. Inaba Shoichi,JPX ; Katsuyama Takao,JPX ; Tanaka Morimitsu,JPX, Polishing apparatus and method.
    상세보기
  164. Kobata, Itsuki; Kobayashi, Yoichi; Ono, Katsutoshi; Kinoshita, Masaki; Kimba, Toshifumi, Polishing apparatus and polishing method.
    상세보기
  165. Ohta, Shinrou; Shimizu, Noburu; Kobayashi, Yoichi, Polishing apparatus and polishing method.
    상세보기
  166. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing assembly with a window.
    상세보기
  167. Akira Ihsikawa JP; Tatsuya Senga JP; Akira Miyaji JP; Yoshijiro Ushio JP, Polishing body, polishing apparatus, polishing apparatus adjustment method, polished film thickness or polishing endpoint measurement method, and semiconductor device manufacturing method.
    상세보기
  168. Carter, Phillip W.; Johns, Timothy, Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  169. Carter,Phillip W.; Johns,Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  170. Dysard, Jeffrey M.; Johns, Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  171. Dysard, Jeffrey M.; Johns, Timothy P., Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios.
    상세보기
  172. Dysard, Jeffrey; Anjur, Sriram; Grumbine, Steven; White, Daniela; Ward, William, Polishing composition and method utilizing abrasive particles treated with an aminosilane.
    상세보기
  173. Grumbine, Steven; Li, Shoutian; Ward, William; Singh, Pankaj; Dysard, Jeffrey, Polishing composition and method utilizing abrasive particles treated with an aminosilane.
    상세보기
  174. Reiss, Brian; Sauter Van Ness, Dana; Lam, Viet; Jia, Renhe, Polishing composition containing cationic polymer additive.
    상세보기
  175. Reiss, Brian; Sauter Van Ness, Dana; Lam, Viet; Hains, Alexander; Kraft, Steven; Jia, Renhe, Polishing composition containing ceria abrasive.
    상세보기
  176. Dysard, Jeffrey M.; Feeney, Paul M.; Anjur, Sriram P.; Johns, Timothy P.; Xin, Yun Biao; Wang, Li, Polishing composition containing polyether amine.
    상세보기
  177. Dysard, Jeffrey M.; Feeney, Paul M.; Anjur, Sriram P.; Johns, Timothy P.; Xin, Yun-Biao; Wang, Li, Polishing composition containing polyether amine.
    상세보기
  178. Lau, Hon Wu; White, Michael, Polishing composition for edge roll-off improvement.
    상세보기
  179. Palanisamy Chinnathambi, Selvaraj; Siriwardane, Haresh, Polishing composition for nickel-phosphorous-coated memory disks.
    상세보기
  180. Dickenscheid Wolfgang,DEX ; Springer Goetz,DEX, Polishing device and polishing cloth for semiconductor substrates.
    상세보기
  181. Kakita, Shinichiro, Polishing method and polishing apparatus permitting control of polishing time at a high accuracy.
    상세보기
  182. Nyui Masaru,JPX ; Ban Mikichi,JPX ; Takahashi Kazuo,JPX, Polishing method and polishing apparatus using the same.
    상세보기
  183. Nyui, Masaru; Ban, Mikichi, Polishing method and polishing apparatus using the same.
    상세보기
  184. Koike, Hisao; Arai, Takeshi; Ikeda, Akihiko, Polishing pad and polisher.
    상세보기
  185. Newell, Kelly J., Polishing pad comprising a filled translucent region.
    상세보기
  186. Prasad,Abaneshwar, Polishing pad comprising hydrophobic region and endpoint detection port.
    상세보기
  187. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.
    상세보기
  188. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad for endpoint detection and related methods.
    상세보기
  189. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.
    상세보기
  190. Barbour, Greg, Polishing pad sensor assembly with a damping pad.
    상세보기
  191. Aiyer Arun A., Polishing pad thinning to optically access a semiconductor wafer surface.
    상세보기
  192. Yang, Charles Chiun-Chieh; Herb, John D.; Schultz, Stephen C., Polishing pad window for a chemical-mechanical polishing tool.
    상세보기
  193. Budinger, William D.; Roberts, John V. H., Polishing pad with a transparent portion.
    상세보기
  194. Wiswesser, Andreas Norbert; Swedek, Boguslaw A., Polishing pad with transparent window.
    상세보기
  195. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
    상세보기
  196. Tolles, Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
    상세보기
  197. Tolles,Robert D., Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus.
    상세보기
  198. Swedek, Boguslaw A.; Birang, Manoocher, Polishing pad with two-section window having recess.
    상세보기
  199. Wiswesser,Andreas Norbert, Polishing pad with window.
    상세보기
  200. Wiswesser,Andreas Norbert, Polishing pad with window.
    상세보기
  201. Wiswesser,Andreas Norbert; Oshana,Ramiel; Hughes,Kerry F.; Rohde,Jay; Huo,David Datong; Benvegnu,Dominic J., Polishing pad with window.
    상세보기
  202. Birang,Manoocher; Gleason,Allan; Guthrie,William L., Polishing pad with window and method of fabricating a window in a polishing pad.
    상세보기
  203. Birang,Manoocher; Swedek,Boguslaw A., Polishing pads useful for endpoint detection in chemical mechanical polishing.
    상세보기
  204. Zhou,Renjie; Grumbine,Steven K.; Zhang,Jian; Cherian,Isaac K., Polymeric inhibitors for enhanced planarization.
    상세보기
  205. Naguib Sant, Nevin, Polypyrrolidone polishing composition and method.
    상세보기
  206. Swedek,Bogdan; Lischka,David J.; David,Jeffrey Drue; Benvegnu,Dominic J., Sealed polishing pad methods.
    상세보기
  207. Swedek,Bogdan; Lischka,David J.; David,Jeffrey Drue; Benvegnu,Dominic J., Sealed polishing pad, system and methods.
    상세보기
  208. Molnar, Charles J, Semiconductor wafer finishing control.
    상세보기
  209. Miyaji Akira,JPX ; Arai Takashi,JPX ; Yagi Takeshi,JPX, Semiconductor wafer polishing apparatus.
    상세보기
  210. Torii Koji,JPX, Semiconductor wafer polishing device and polishing method thereof.
    상세보기
  211. Shouli Steve Hsia ; Yanhua Wang ; Jayanthi Pallinti, Shallow trench isolation chemical-mechanical polishing process.
    상세보기
  212. Sikma, Elise; Paw, Witold; Petro, Benjamin; Cross, Jeffrey; Whitener, Glenn, Slurry for chemical mechanical polishing of cobalt.
    상세보기
  213. Birang,Manoocher; David,Jeffrey Drue; Swedek,Boguslaw A., Substrate edge detection.
    상세보기
  214. Kimba, Toshifumi; Nakai, Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  215. Kimba, Toshifumi; Nakai, Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  216. Kimba,Toshifumi; Nakai,Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  217. Kimba,Toshifumi; Nakai,Shunsuke, Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus.
    상세보기
  218. Wiswesser,Andreas Norbert; Birang,Manoocher; Swedek,Boguslaw A., Substrate monitoring during chemical mechanical polishing.
    상세보기
  219. Allman, Derryl D. J.; Gregory, John W., Substrate planarization with a chemical mechanical polishing stop layer.
    상세보기
  220. Kobayashi, Yoichi; Nakai, Shunsuke; Tsuji, Hitoshi; Tsukuda, Yasuo; Yamauchi, Hiroki, Substrate polishing apparatus.
    상세보기
  221. Kobayashi, Yoichi; Nakai, Shunsuke; Tsuji, Hitoshi; Tsukuda, Yasuo; Yamauchi, Hiroki, Substrate polishing apparatus.
    상세보기
  222. Kobayashi, Yoichi; Nakai, Shunsuke; Tsuji, Hitoshi; Tsukuda, Yasuo; Yamauchi, Hiroki, Substrate polishing apparatus.
    상세보기
  223. Kobayashi,Yoichi; Nakai,Shunsuke; Tsuji,Hitoshi; Tsukuda,Yasuo; Yamauchi,Hiroki, Substrate polishing apparatus.
    상세보기
  224. Kobayashi,Yoichi; Nakai,Shunsuke; Tsuji,Hitoshi; Tsukuda,Yasuo; Yamauchi,Hiroki, Substrate polishing apparatus.
    상세보기
  225. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  226. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  227. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  228. Birang, Manoocher; Pyatigorsky, Grigory, Substrate polishing metrology using interference signals.
    상세보기
  229. Swedek,Boguslaw A; Johansson,Nils; Wiswesser,Andreas Norbert; Birang,Manoocher, System and method for in-line metal profile measurement.
    상세보기
  230. Schlicker, Mike; Marxsen, Gerd, System and method for optical endpoint detection during CMP by using an across-substrate signal.
    상세보기
  231. Swedek,Boguslaw A.; Birang,Manoocher, System for endpoint detection with polishing pad.
    상세보기
  232. Swedek,Bogdan; Lischka,David J.; David,Jeffrey Drue; Benvegnu,Dominic J., System with sealed polishing pad.
    상세보기
  233. Chen,Zhan; Vacassy,Robert; Bayer,Benjamin; Khanna,Dinesh, Tunable selectivity slurries in CMP applications.
    상세보기
  234. Brusic, Vlasta; Jenkins, Richard Jon; Thompson, Christopher C., Use of CMP for aluminum mirror and solar cell fabrication.
    상세보기
  235. Molnar, Charles J., Versatile workpiece refining.
    상세보기
  236. Palou-Rivera, Ignasi; Swedek, Boguslaw A.; Karuppiah, Lakshmanan, Wafer edge characterization by successive radius measurements.
    상세보기
  237. Bajaj Rajeev ; Litvak Herbert E. ; Surana Rahul K. ; Jew Stephen C. ; Pecen Jiri, Wafer polishing device with movable window.
    상세보기
  238. Molnar,Charles J., Wafer refining.
    상세보기
  239. Reiss, Brian, Wet-process ceria compositions for polishing substrates, and methods related thereto.
    상세보기
  240. Reiss, Brian; Dysard, Jeffrey; Shekhar, Sairam, Wet-process ceria compositions for polishing substrates, and methods related thereto.
    상세보기
  241. Molnar,Charles J., situ finishing aid control.
    상세보기

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