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Apparatus for encapsulating electronic packages 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-045/02
  • B29C-045/14
출원번호 US-0452130 (1995-05-26)
발명자 / 주소
  • Weber Patrick O. (San Jose CA)
출원인 / 주소
  • Hestia Technologies, Inc. (Sunnyvale CA 02)
인용정보 피인용 횟수 : 62  인용 특허 : 35

초록 ▼

A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink attached in the usual manner. A passage is provided either in the printed wiring board or in the heat sink so that during the transfer molding process,

대표청구항 ▼

An apparatus for encapsulating a laminate substrate having a heat sink thereon, comprising: a first mold platen having a recessed portion; a second mold platen for mating with the first mold platen to form a mold cavity adapted to receive the laminate substrate with the heat sink thereon, the second

이 특허에 인용된 특허 (35)

  1. Casati Paolo (Giovanni ITX) De Martiis Carlo C. (Milan ITX) Marchisi Giuseppe (Milan ITX), Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device.
    상세보기
  2. Moitzger Max (Lodi CA), Apparatus for encapsulating selected portions of a printed circuit board.
    상세보기
  3. Yamamoto Hiroshi (Ibaragi JPX), Arrangement of a semiconductor device for use in a card.
    상세보기
  4. Marrs Robert C. (Scottsdale AZ) Hirakawa Tadashi (Osaka JPX), Ball grid array with via interconnection.
    상세보기
  5. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Hanno JPX) Yamamoto Masakazu (Kodaira JPX) Ogihara Satoru (Hitachi JPX) Shinohara Hiroichi (Hitachi JPX) Suzuki Hideo (Katsuta JPX), Chip carrier.
    상세보기
  6. Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX), Connecting structure for electronic part and method of manufacturing the same.
    상세보기
  7. Shiobara, Toshio; Tomiyoshi, Kazutoshi, Epoxy resin composition.
    상세보기
  8. Juskey Frank J. (Coral Springs FL) Miles Barry M. (Plantation FL) Papageorge Marc V. (Plantation FL), Flip-chip package for integrated circuits.
    상세보기
  9. Prokop Jon S. (Richardson TX), High terminal count integrated circuit device package.
    상세보기
  10. Ackermann Karl-Peter (Niederrohrdorf CHX) Berner Gianni (Baden CHX), Highly integrated circuit and method for the production thereof.
    상세보기
  11. Mullen ; III William B. (Boca Raton FL) Urbish Glenn F. (Coral Springs FL) Freyman Bruce J. (Plantation FL), Leadless pad array chip carrier.
    상세보기
  12. McShane Michael B. (Austin TX) Lin Paul T. (Austin TX), Method for fabricating semiconductor device including package.
    상세보기
  13. Marrs Robert C. (Scottsdale AZ), Method for forming plastic molded package with heat sink for integrated circuit devices.
    상세보기
  14. Ishida Yoshihiro (Tokorozawa JPX) Komatsu Katsuji (Kawagoe JPX) Mimura Seiichi (Kawagoe JPX) Takenouchi Kikuo (Higashimurayama JPX) Yabe Isao (Tokorozawa JPX) Ichikawa Shingo (Sayama JPX) Shimada Yos, Method of making a resin encapsulated pin grid array with integral heatsink.
    상세보기
  15. Ohno Jun-ichi (Yokohama JPX) Fukazawa Koh-ichi (Tokyo JPX) Shindo Masamichi (Yokohama JPX), Method of making a semiconductor device having lead pins and a metal shell.
    상세보기
  16. Juskey Frank J. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL) Freyman Bruce J. (Plantation FL) Suppelsa Anthony B. (Coral Springs FL), Method of making a transfer molded semiconductor device.
    상세보기
  17. Chia Chok J. (Santa Clara CA), Method of molding a pin grid array package.
    상세보기
  18. Fox Leslie R. (Boxborough MA) Wade Paul C. (Shirley MA) Schmidt William L. (Acton MA), Method of packaging and powering integrated circuit chips and the chip assembly formed thereby.
    상세보기
  19. Horney James R. (Cockeysville MD), Method of producing a composite washer assembly.
    상세보기
  20. Freyman Bruce J. (Plantation FL) Juskey Frank J. (Coral Springs FL) Miles Barry M. (Plantation FL), Moisture relief for chip carrier.
    상세보기
  21. Chia Chok J. (Santa Clara CA), Molded pin grid array package GPT.
    상세보기
  22. Sano Takezo (Shiga JPX) Tsuruyoshi Kenichi (Kusatsu JPX), Molding apparatus with retractable preform support pins.
    상세보기
  23. Sakai Kunito (Hyogo JPX) Oshio Kazuharu (Hyogo JPX) Kanegae Hirozoh (Hyogo JPX), Molding machine and method.
    상세보기
  24. Worp Nicolaas H. (Margate FL) Freyman Bruce J. (Plantation FL) Conrath Kurt C. (Lauderhill FL), Overmolded semiconductor package with anchoring means.
    상세보기
  25. Komathu Kathuzi (Kawagoe JPX), Pin grid array package.
    상세보기
  26. Hirata Atsuomi (Nara JPX) Mamiya Hirokuni (Yokkaichi JPX), Plastic molded chip carrier package and method of fabricating the same.
    상세보기
  27. Chia Chok J. (Santa Clara CA), Plastic molded pin-grid-array power package.
    상세보기
  28. Birchler Robert O. (Dallas TX) Williams ; Jr. E. R. (Scottsdale AZ), Process for encapsulating electronic components in plastic.
    상세보기
  29. Palino Douglas F. (Marlboro MA) Fisher Amnon (Newton MA), Programmable ceramic high performance custom package.
    상세보기
  30. Konishi Akira (Kyoto JPX) Wakano Teruo (Kyoto JPX), Semiconductor device and its manufacture.
    상세보기
  31. Lin Paul T. (Austin TX) McShane Michael B. (Austin TX) Wilson Howard P. (Austin TX), Semiconductor device having a pad array carrier package.
    상세보기
  32. Sawaya Hiromichi (Kawasaki JPX), Semiconductor device including a package having a plurality of bumps arranged in a grid form as external terminals.
    상세보기
  33. Heinle Preston J. (Phoenix AZ), Slot transfer molding apparatus and methods.
    상세보기
  34. Juskey Frank J. (Coral Springs FL) Bernardoni Lonnie L. (Coral Springs FL) Swirbel Thomas J. (Davie FL) Miles Barry M. (Plantation FL), Transfer molded semiconductor package with improved adhesion.
    상세보기
  35. Juskey Frank J. (Coral Springs FL) Pennisi Robert W. (Boca Raton FL) Papageorge Marc V. (Plantation FL), Transfer molding compound.
    상세보기

이 특허를 인용한 특허 (62)

  1. Karmazyn, Michael J., Angular encapsulation of tandem stacked printed circuit boards.
    상세보기
  2. Bolken, Todd O.; Peters, David L., Apparatus for encapsulating a multi-chip substrate array.
    상세보기
  3. Bolken,Todd O.; Peters,David L., Apparatus for encapsulating a multi-chip substrate array.
    상세보기
  4. Weber Patrick O., Apparatus for encapsulating electronic packages.
    상세보기
  5. Thummel Steven G., Apparatus for encasing array packages.
    상세보기
  6. Thummel, Steven G., Apparatus for encasing array packages.
    상세보기
  7. Thummel, Steven G., Apparatus for encasing array packages.
    상세보기
  8. Farnworth,Warren M., Apparatus for stereolithographic processing of components and assemblies.
    상세보기
  9. Johnson, Mark S.; Bolken, Todd O., Asymmetric transfer molding method and an asymmetric encapsulation made therefrom.
    상세보기
  10. Johnson, Mark S.; Bolken, Todd O., Asymmetric transfer molding method and an asymmetric encapsulation made therefrom.
    상세보기
  11. Leonard E. Mess, Ball grid array (BGA) encapsulation mold.
    상세보기
  12. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  13. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  14. Mess Leonard E., Ball grid array (BGA) encapsulation mold.
    상세보기
  15. Fan,Chun Ho; Lam,Wing Keung; Sze,Ming Wang; Labeeb,Sadak Thamby; McLellan,Neil; Kirloskar,Mohan, Ball grid array package and process for manufacturing same.
    상세보기
  16. Fan,Chun Ho; McLellan,Neil; Tsang,Kwok Cheung, Ball grid array package and process for manufacturing same.
    상세보기
  17. Huang,Cheng Wei; Yao,Kuang Wei, Chip package.
    상세보기
  18. Horiba Yasuhiro,JPX ; Kohmura Toshimi,JPX, Electronic part mounting device.
    상세보기
  19. Mess, Leonard E., Encapsulation method in a molding machine for an electronic device.
    상세보기
  20. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Heat spreader with spring IC package.
    상세보기
  21. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Heat spreader with spring IC package fabrication method.
    상세보기
  22. Saito, Toshio; Ozeki, Ikuhiko, Insert molding method and mold.
    상세보기
  23. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  24. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  25. Ma, Xiao-long; Lee, Chun-liang, Manufacturing mold and manufacturing method for color filter.
    상세보기
  26. Bolken, Todd O.; Peters, David L., Method and apparatus for encapsulating a multi-chip substrate array.
    상세보기
  27. LoBianco, Anthony; Greenwood, Jonathon, Method and apparatus for increasing thickness of molded body on semiconductor package.
    상세보기
  28. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  29. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  30. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  31. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  32. Bolken, Todd O.; Peters, David L., Method for encapsulating a multi-chip substrate array.
    상세보기
  33. Thummel Steven G., Method for encasing array packages.
    상세보기
  34. Thummel Steven G., Method for encasing array packages.
    상세보기
  35. Thummel, Steven G., Method for encasing array packages.
    상세보기
  36. Thummel,Steven G., Method for encasing plastic array packages.
    상세보기
  37. Lin,Ying Ren; Tsai,Ho Yi; Huang,Chien Ping; Hsiao,Cheng Hsu, Method for fabricating semiconductor packages.
    상세보기
  38. Appelt Bernd Karl-Heinz ; Boyko Christina Marie ; Farquhar Donald Seton ; Fuerniss Stephen Joseph ; Klodowski Michael Joseph, Method for filling holes in printed wiring boards.
    상세보기
  39. Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  40. Huang, Chien-Ping, Method of encapsulating a substrate-based package assembly without causing mold flash.
    상세보기
  41. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
    상세보기
  42. Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.
    상세보기
  43. Leonard E. Mess, Methods for ball grid array (BGA) encapsulation mold.
    상세보기
  44. Bolken, Todd O., Microelectronic devices and microelectronic die packages.
    상세보기
  45. Tsai, Chung-Che; Shan, Wei-Heng, Mold structure for package fabrication.
    상세보기
  46. Hess, Kevin J.; Lee, Chu-Chung, Molded semiconductor package having a filler material.
    상세보기
  47. Fillion Raymond Albert ; Daum Wolfgang ; Kolc Ronald Frank ; Kuk Donald William ; Wojnarowski Rob Ert John, Multimodule interconnect structure and process.
    상세보기
  48. Johnson, Mark S.; Bolken, Todd O., Overmolding encapsulation process.
    상세보기
  49. Johnson, Mark S.; Bolken, Todd O., Overmolding encapsulation process and encapsulated article made therefrom.
    상세보기
  50. Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.
    상세보기
  51. James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  52. James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  53. Dumoulin Ann,BEX ; Heerman Marcel,BEX ; Roggen Jean,BEX ; Beyne Eric,BEX ; Hoof Rita van,BEX, Polymer stud grid array.
    상세보기
  54. Ong E. C., Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits.
    상세보기
  55. Wang Kuo K. ; Han Sejin, Pressurized underfill encapsulation of integrated circuits.
    상세보기
  56. Wang Kuo K. ; Han Sejin, Pressurized underfill encapsulation of integrated circuits.
    상세보기
  57. Fan,Chun Ho; Kirloskar,Mohan; McLellan,Neil, Process for fabricating an integrated circuit package with reduced mold warping.
    상세보기
  58. Fan, Chun Ho; Labeeb, Sadak Thamby; Sze, Ming Wang, Process for manufacturing ball grid array package.
    상세보기
  59. Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
    상세보기
  60. Boutin Lynda,CAX ; Letourneau Martial A.,CAX ; Tetreault Real,CAX, Transfer molding method for forming integrated circuit package.
    상세보기
  61. John J. Lajza, Jr. ; Charles R. Ramsey ; Robert M. Smith, Ultra mold for encapsulating very thin packages.
    상세보기
  62. Lajza ; Jr. John J. ; Ramsey Charles R. ; Smith Robert M., Ultra mold for encapsulating very thin packages.
    상세보기

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