초록 ▼

A hybrid focal plane array (FPA) structure including a soft, localized, and thick epoxy for supporting the FPA on a cooling device. The hybrid FPA arrangement includes a crystalline optical substrate with a layer of an optically sensitive material disposed on one surface of the substrate. The optica

A hybrid focal plane array (FPA) structure including a soft, localized, and thick epoxy for supporting the FPA on a cooling device. The hybrid FPA arrangement includes a crystalline optical substrate with a layer of an optically sensitive material disposed on one surface of the substrate. The optically sensitive side of the substrate layer is coupled to a MUX chip via an interconnection scheme. The layered configuration of the detector, the optically-sensitive material, interconnection network, and the MUX is mounted to a platform or dewar cold plate with a pliable, thick epoxy which is locally deposited onto the platform to effectively form a raised mounting cushion which supports the MUX and reduces deleterious effects resulting form a close coupling of the FPA to the mounting platform.

대표청구항 ▼

A hybrid focal plane array structure for processing radiation comprising: a detector including an optical substrate for support of an optically sensitive material, and an optically sensitive layer for conversion of incoming radiation to electrical charge; electronic means for receiving the electrica

A hybrid focal plane array structure for processing radiation comprising: a detector including an optical substrate for support of an optically sensitive material, and an optically sensitive layer for conversion of incoming radiation to electrical charge; electronic means for receiving the electrical charge generated by the optically sensitive layer; interconnection means for mechanical, electrical and thermal coupling of the electronic means to the detector, such that the radiation detected by the detector is transmitted as electrical signals through the interconnection means to the electronic means; cooling means for supporting the electronic means, and for cooling the electronics means and detector; and isolation means for separating the electronic means from the cooling means, the isolation means being soft, localized, and sufficiently thick such that the electronic means is cooled by the cooling means without experiencing undesirable distortion, and the interconnection means is unaffected by in-plane and out-of-plane stress.