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Covers for micromechanical sensors and other semiconductor devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-029/82
출원번호 US-0440528 (1995-05-12)
발명자 / 주소
  • Martin Jacob H. (Wellesley MA)
출원인 / 주소
  • The Charles Stark Draper Laboratory, Inc. (Cambridge MA 02)
인용정보 피인용 횟수 : 88  인용 특허 : 28

초록

A cover for a micromechanical device through which input/output connections to the device are made. The cover includes at least two doped semiconductor standoffs supporting an insulative layer. One or more metalized vias extend from a top surface of the insulative layer, or from a bottom surface of

대표청구항

A cover for a micromechanical device comprising: at least two conductive supports; and an insulative layer having a top surface and a bottom surface disposed over said at least two conductive supports, said insulative layer having at least one metalized via disposed therethrough to extend from said

이 특허에 인용된 특허 (28)

  1. Putty Michael W. (East Detroit MI) Hicks David B. (Farmington Hills MI) Chang Shih-Chia (Bloomfield Hills MI) Eddy David S. (Romeo MI), Active microaccelerometer.
  2. Wagner Bernhard (Berlin DEX) Benecke Wolfgang (Berlin DEX) Riethmller Werner (Berlin DEX) Schnakenberg Uwe (Berlin DEX), Apparatus for measuring mechanical forces and force actions.
  3. Hocker G. Benjamin (5730 Covington Cir. Minnetonka MN 55345) Burns David W. (5537 1st Ave. South Minneapolis MN 55419) Akinwande Akintunde I. (9968 Nord Rd. Bloomington MN 55437) Horning Robert D. (4, Diaphragm-based-sensors.
  4. Smith Rosemary L. (Newton MA) Collins Scott D. (Newton MA), Electrochemical microsensors and method of making such sensors.
  5. Wilbarg Robert R. (Hopewell Junction NY) Johnson ; Jr. Claude (Yorktown NY), Fabrication method for vacuum microelectronic devices.
  6. Zanini-Fisher Margherita (Bloomfield MI) Parsons Michael H. (Ann Arbor MI) Sooriakumar Kathirgamasundaram (Dearborn Heights MI) Haeberle Russell J. (Plymouth MI) McCarthy Shaun L. (Ann Arbor MI), Fabrication methods for silicon/glass capacitive absolute pressure sensors.
  7. Spangler Leland J. (1974 Traver Rd. ; Apt. No. 208 Ann Arbor MI 48105) Wise Kensall D. (3670 Charter Pl. Ann Arbor MI 48105), Fully integrated single-crystal silicon-on-insulator process, sensors and circuits.
  8. Zias Arthur R. (Los Altos CA) Block Barry (Los Altos Hills CA) Mapes Kenneth W. (San Jose CA) Nystrom Norman L. (Sunnyvale CA) Cadwell Robert M. (Los Altos CA), High sensitivity miniature pressure transducer.
  9. Schwarz Dwight L. (Kokomo IN) Maki William M. (Fort Wayne IN) Puterbaugh Glen R. (Kokomo IN) Hearn John A. (Kokomo IN), Hybrid accelerometer assembly.
  10. Bohrer, Philip J.; Higashi, Robert E.; Johnson, Robert G., Integral flow sensor and channel assembly.
  11. Barth Phillip W. (Palo Alto CA) Petersen Kurt E. (San Jose CA), Mechanical sensor for high temperature environments.
  12. Tsang Robert W. K. (Bedford MA) Core Theresa A. (North Andover MA), Method for fabricating monolithic chip containing integrated circuitry and suspended microstructure.
  13. Sliwa ; Jr. John W. (Palo Alto CA), Method of coplanar integration of semiconductor IC devices.
  14. Fitch Jon T. (Austin TX) Maniar Papu (Austin TX) Witek Keith E. (Austin TX) Gelatos Jerry (Austin TX) Moazzami Reza (Austin TX) Ajuria Sergio A. (Austin TX), Method of forming a semiconductor structure having an air region.
  15. Knutti James W. (Fremont CA) Allen Henry V. (Fremont CA) Petersen Kurt E. (San Jose CA) Kowalski Carl R. (Fremont CA), Method of making a semiconductor transducer.
  16. Wise Kensall D. (Ann Arbor MI) Chau Hin-Leung (Ann Arbor MI), Method of making an ultraminiature pressure sensor.
  17. Holm-Kennedy James W. (Honolulu HI) Lee Gordon P. (Waipahu HI), Multidimensional force sensor.
  18. Glenn Max C. (James City VA), Multiple level miniature electromechanical accelerometer switch.
  19. Tilmans Hendrikus A. C. (Enschede NLX), Resonant mechanical sensor.
  20. Chitty Gordon W. (Norfolk MA) Morrison ; Jr. Richard H. (Taunton MA) Olsen Everett O. (Wrentham MA) Panagou John G. (Attleboro MA) Zavracky Paul M. (Norwood MA), Resonant sensor and method of making same.
  21. Guckel Henry (Madison WI) Burns David W. (Madison WI), Sealed cavity semiconductor pressure transducers and method of producing the same.
  22. Guckel Henry (Madison WI) Burns David W. (Madison WI), Sealed cavity semiconductor pressure transducers and method of producing the same.
  23. Guckel Henry (Madison WI) Burns David W. (Madison WI), Sealed cavity semiconductor pressure transducers and method of producing the same.
  24. Knutti James W. (Fremont CA) Allen Henry V. (Fremont CA) Petersen Kurt E. (San Jose CA) Kowalski Carl R. (Fremont CA), Semiconductor transducer.
  25. Adams Victor J. (Tempe AZ) Bennett Paul T. (Phoenix AZ) Hughes Henry G. (Scottsdale AZ) Scofield ; Jr. Brooks L. (Tempe AZ) Stuckey Marilyn J. (Phoenix AZ), Semiconductor wafer level package.
  26. Wise Kensall D. (3670 Charter Pl. Ann Arbor MI 48105) Chau Hin-Leung (543 Church ; Apt. 16 Ann Arbor MI 48104), Ultraminiature single-crystal sensor with movable member.
  27. Stewart Robert E. (Woodland Hills CA), Vibrating accelerometer-multisensor.
  28. Horning Robert D. (Burnsville MN) Stratton Thomas G. (Roseville MN) Saathoff Deidrich J. (Burnsville MN), Wafer bonding enhancement technique.

이 특허를 인용한 특허 (88)

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  19. Bettger, Kenneth J.; Stark, David H., Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units.
  20. Bettger, Kenneth J.; Stark, David H., Flexible edge seal for vacuum insulating glazing units.
  21. Thomas, Sunil, Flip-chip assembly of protected micromechanical devices.
  22. Thomas, Sunil, Flip-chip assembly of protected micromechanical devices.
  23. Thomas, Sunil, Flip-chip assembly of protected micromechanical devices.
  24. Glenn, Thomas P., Flip-chip micromachine package.
  25. Glenn Thomas P., Flip-chip micromachine package fabrication method.
  26. McCann, David, Flip-chip micromachine package using seal layer.
  27. Ding, Xiaoyi, Hermetically sealed microdevices having a single crystalline silicon getter for maintaining vacuum.
  28. Warner, Michael, High-frequency chip packages.
  29. Stark, David H, Insulated glazing units.
  30. Stark, David H., Insulating glass unit having multi-height internal standoffs and visible decoration.
  31. Yun, Changhan; Villarreal, Javier; Karpman, Maurice S., Interconnection of through-wafer vias using bridge structures.
  32. Salatino Matthew M. ; Young William R. ; Begley Patrick A., Lid wafer bond packaging and micromachining.
  33. Yoshizawa, Takahiko, MEMS device.
  34. Harney, Kieran P.; Felton, Lawrence E.; Nunan, Thomas Kieran; Alie, Susan A.; Wachtmann, Bruce, MEMS device with conductive path through substrate.
  35. Molfese, Antonio; Coronato, Luca; Cazzaniga, Gabriele; Esposito, Luigi, MEMS pressure sensor with improved insensitivity to thermo-mechanical stress.
  36. Martin, John R.; Zhang, Xin, MEMS sensor with cap electrode.
  37. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael, Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit.
  38. Spooner, Timothy R.; Harney, Kieran P., Method and device for protecting micro electromechanical system structures during dicing of a wafer.
  39. Felton, Lawrence E.; Luo, Jing, Method and device for protecting micro electromechanical systems structures during dicing of a wafer.
  40. Spooner, Timothy R.; Courage, David S.; Workman, Brad, Method and device for protecting micro electromechanical systems structures during dicing of a wafer.
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  42. Spooner,Timothy R.; Courage,David S.; Workman,Brad, Method and device for protecting micro electromechanical systems structures during dicing of a wafer.
  43. Li, Xiaochun; Datta, Arindom; Cheng, Xudong, Method for embedding thin film sensor in a material.
  44. Baek Seog-soon,KRX ; Ha Byeoung-ju,KRX ; Oh Young-soo,KRX, Method for fabricating micro inertia sensor.
  45. Daeche,Frank; Timme,Hans Joerg, Method for manufacturing a housing for a chip with a micromechanical structure.
  46. Aigner, Robert; Oppermann, Klaus-Günter, Method for producing a filled recess in a material layer, and an integrated circuit configuration produced by the method.
  47. Tilmans Hendrikus A. C.,NLX ; Beyne Eric,BEX ; Van de Peer Myriam,BEX, Method of fabrication of a microstructure having an internal cavity.
  48. Oguchi,Takahiro, Method of manufacturing an external force detection sensor.
  49. Oguchi,Takahiro, Method of manufacturing an external force detection sensor.
  50. Oguchi,Takahiro, Method of manufacturing external force detection sensor.
  51. Zilber, Gil; Katraro, Reuven; Aksenton, Julia; Oganesian, Vage, Methods and apparatus for packaging integrated circuit devices.
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  60. Nystrom, Michael J.; Humpston, Giles, Microelectronic assembly with multi-layer support structure.
  61. Nystrom, Michael J.; Humpston, Giles, Microelectronic assembly with multi-layer support structure.
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  70. Bieck, Dipl.-Ing. Florian; Leib, Jürgen, Process for making contact with and housing integrated circuits.
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  75. Tong, Qin Yi; Enquist, Paul M.; Rose, Anthony Scot, Room temperature metal direct bonding.
  76. Tong, Qin-Yi; Enquist, Paul M.; Rose, Anthony Scot, Room temperature metal direct bonding.
  77. Tong, Qin-Yi; Enquist, Paul M.; Rose, Anthony Scot, Room temperature metal direct bonding.
  78. Honer, Kenneth Allen, Sequential fabrication of vertical conductive interconnects in capped chips.
  79. Chen, Lung-Tai; Hsu, Yu-Wen; Chen, Sheah; Lin, Jing-Yuan; Pan, Li-Chi; Ho, Tzong-Che, Structure and fabrication method of a sensing device.
  80. Humpston,Giles, Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps.
  81. McWilliams,Bruce M.; Humpston,Giles; Haba,Belgacem; Tuckerman,David B., Structure and method of making sealed capped chips.
  82. Martin, John R.; Tsau, Christine H.; Frey, Timothy J., Substrate bonding with bonding material having rare earth metal.
  83. Enquist, Paul M.; Tong, Qin Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
  84. Felton,Lawrence E.; Harncy,Kieran P.; Roberts,Carl M., Wafer level capped sensor.
  85. Felton,Lawrence E.; Harney,Kieran P.; Roberts,Carl M., Wafer level capped sensor.
  86. Stark, David H., Wafer-level hermetic micro-device packages.
  87. Ding,Xiaoyi; Schuster,John P., Wafer-level sealed microdevice having trench isolation and methods for making the same.
  88. Ding,Xiaoyi; Schuster,John P., Wafer-level sealed microdevice having trench isolation and methods for making the same.
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