초록 ▼

A circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g. , copper, thereon separated by a suitable dielectric material, e.g. , polyimide. Each layer includes its own conductive location(s) which are designed for bein

A circuitized substrate for use in an electronic package wherein the substrate, e.g., ceramic, includes more than one conductive layer, e.g. , copper, thereon separated by a suitable dielectric material, e.g. , polyimide. Each layer includes its own conductive location(s) which are designed for being directly electrically connected, e.g., using solder, to respective contact sites on a semiconductor chip positioned on the substrate to form part of the final package. A method for making such a package is also provided. Significantly, the resulting package does not include interconnections between the conductive layers at the desired contact locations, these locations, as mentioned, instead being directly connected to the chip.

대표청구항 ▼

A circuitized substrate comprising: an electronic device including a substantially flat surface having first and second equal amount solder elements thereon; a dielectric substrate including an upper surface; a first circuit pattern on said upper surface and including at least one exposed contact lo

A circuitized substrate comprising: an electronic device including a substantially flat surface having first and second equal amount solder elements thereon; a dielectric substrate including an upper surface; a first circuit pattern on said upper surface and including at least one exposed contact location established at a first distance from said upper surface; a layer of dielectric material positioned on said first circuit pattern and including at least one opening therein located adjacent said one exposed contact location to thereby provide exposure of said contact location; a second circuit pattern located on said layer of dielectric material and including at least one exposed contact location established at a second distance from said upper surface of said dielectric substrate and spaced at a predetermined distance from said exposed contact location of said first circuit pattern, said second distance being greater than said first distance, said exposed contact locations of said first and second circuit patterns being separately directly electrically coupled to said first and second equal amount solder elements of said electronic device, respectively.