초록 ▼

A compact housing for a workstation-class computer is disclosed. The apparatus includes a structural heat sink with a horizontal base heat sink that includes an interchangeable power source housing and a hard disk drive receptacle. The horizontal base heat sink operates to conduct heat away from the

A compact housing for a workstation-class computer is disclosed. The apparatus includes a structural heat sink with a horizontal base heat sink that includes an interchangeable power source housing and a hard disk drive receptacle. The horizontal base heat sink operates to conduct heat away from the functional elements positioned within the interchangeable power source housing and the hard disk drive receptacle. The structural heat sink also includes a vertical tower heat sink to support functional elements including a power converter. The vertical tower heat sink operates to conduct heat away from the functional elements. The vertical tower heat sink also includes support devices for receiving a detachable pivot display system. The structural heat sink is surrounded by a vented exterior skin that facilitates convective heat transfer from the structural heat sink.

대표청구항 ▼

A compact housing for a computer workstation, comprising: a structural heat sink including: a horizontal base heat sink to house a first plurality of electronic elements, said horizontal base heat sink including an interchangeable power source housing supporting an electrical connector, said horizon

A compact housing for a computer workstation, comprising: a structural heat sink including: a horizontal base heat sink to house a first plurality of electronic elements, said horizontal base heat sink including an interchangeable power source housing supporting an electrical connector, said horizontal base heat sink operating to conduct heat away from said first plurality of electronic elements; and a vertical tower heat sink fixedly attached to said horizontal base heat sink in a substantially orthogonal manner such that at least one electronic element of said first plurality of electronic elements is positioned on both sides of said vertical tower heat sink, said vertical tower heat sink including a first side and a second side to support a second plurality of electronic elements, said vertical tower heat sink operating to conduct heat away from said second plurality of electronic elements; and a vented exterior skin enclosing said structural heat sink, said vented exterior skin including a plurality of vents extending across the majority of the surface area of said vented exterior skin, said vented exterior skin operating to facilitate convective heat transfer from said structural heat sink so as to provide passive cooling capability that eliminates the need for active cooling devices.