초록 ▼

A wafer transfer system is operable with a front or side loading wafer carrier to move one or more horizontally oriented wafers out of the carrier and to rotate the wafers to a vertical orientation in which the wafers are accessible for further processing. The transfer system provides a wafer extrac

A wafer transfer system is operable with a front or side loading wafer carrier to move one or more horizontally oriented wafers out of the carrier and to rotate the wafers to a vertical orientation in which the wafers are accessible for further processing. The transfer system provides a wafer extractor which employs a plurality of paired fingers of a size and configuration to fit between the spaced, stacked wafers in the carrier for lifting the wafers off the shoulders of the carrier. The fingers are then movable generally horizontally to remove the wafers from the carrier into two angled combs having ledges for receiving wafers. The fingers and combs are rotated to a vertical orientation in which the wafers are supported along their edges by the combs. The fingers are shifted horizontally a small amount relative to the combs to disengage from the wafers, either by a translation following the rotation or by rotating the fingers and combs about different axes. In this manner, the wafers are in a position from which they can be accessed by a robot arm according to the particular process. In a further embodiment, the fingers and combs are also translated forward during the rotation, thereby minimizing the floor space or footprint required by the system.

대표청구항 ▼

A semiconductor wafer transfer system for moving a wafer horizontally into and out of a wafer support device to and from a position in which the wafer is maintained in a vertical orientation accessible for further processing, the wafer support device having opposed, paired shoulders on interior wall

A semiconductor wafer transfer system for moving a wafer horizontally into and out of a wafer support device to and from a position in which the wafer is maintained in a vertical orientation accessible for further processing, the wafer support device having opposed, paired shoulders on interior walls thereof to support the wafer in a horizontal orientation, the support device further having a vertical opening therein, the wafer transfer system comprising: a base positioned adjacent the opening in the wafer support device; an extraction structure mounted to the base for generally horizontal reciprocal movement into and out of the wafer support device for removing the wafer from the wafer support device along a generally horizontal path, the extraction structure further mounted to the base for rotation to a generally vertical orientation; and a wafer support structure comprising wafer receiving elements disposed to receive the wafer from the extraction structure, the wafer support structure mounted to the base for rotation to a generally vertical orientation concurrently with the extraction structure.