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Metal matrix composites containing electrical insulators 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-015/04
  • B32B-003/14
출원번호 US-0444171 (1995-05-18)
발명자 / 주소
  • Sawtell Ralph R. (Monroeville PA) Premkumar Mosur K. (Monroeville PA) Yun David I. (Murrysville PA)
출원인 / 주소
  • Aluminum Company of America (Pittsburgh PA 02)
인용정보 피인용 횟수 : 24  인용 특허 : 26

초록

A method of fabricating a metal matrix composite containing electrically isolated areas and the MMC formed from the method. The method comprises: (a) providing a liquid pool of unreinforced aluminum alloy; (b) infiltrating the unreinforced aluminum alloy into a stack comprising upper and lower porou

대표청구항

A metal matrix composite possessing regions that are electrically isolated from one another, said metal matrix composite formed by a method comprising: (a) placing an insulating substrate in a forming chamber, said insulating substrate being adjacent at least one porous ceramic preform; (b) evacuati

이 특허에 인용된 특허 (26)

  1. Sato Hideki (Yokohama JPX) Hatori Masakazu (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX), Aluminum nitride circuit board.
  2. Horiguchi Akihiro (Yokohama JPX) Kasori Mituo (Kawasaki JPX) Ueno Fumio (Kawasaki JPX) Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX) Endo Mitsuyoshi (Yamato JPX) Tanaka Shun-ichiro (Yok, Aluminum nitride sintered body having conductive metallized layer.
  3. Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX) Nagata Mitsuhiro (Yokohama JPX), Aluminum nitride substrate.
  4. Yoshida Hideaki (Saitama JPX) Kuromitsu Yoshirou (Saitama JPX) Toriumi Makoto (Saitama JPX) Yuzawa Michio (Saitama JPX), Ceramic substrate used for fabricating electric or electronic circuit.
  5. Roopchand Brijmohan J. (Murrysville PA) Yun David I. (Murrysville PA) Marinaro Douglas E. (Trafford PA) Hyland Mary E. (Oakmont PA), Coated ceramic bodies in composite armor.
  6. Short W. Harry (Mesa AZ), Cooling and power and/or ground distribution system for integrated circuits.
  7. Yun David I. (Murrysville PA) Sawtell Ralph R. (Monroeville PA) Hunt Warren H. (Export PA) Baumgartner H. Robert (Monroeville PA) Streicher Eric T. (New Kensington PA) Ehman Michael F. (Franklin Park, Fabrication of metal matrix composites by vacuum die casting.
  8. Booth Stuart E. (Wantage GB2) Clifford Andrew W. (Weymouth GB2) Parratt Noel J. (Loughton GB2), Fiber-reinforced metals.
  9. Nagumo Shinichi (Yokohama JPX), Heat-insulating layer to prevent temperature drop of combustion gas in internal combustion engine.
  10. Knoell Albert C. (La Crescenta CA) Loftin Timothy A. (Semi Valley CA), Hybrid metal matrix composite chassis structure for electronic circuits.
  11. Charbonnier Jean (Rives FRX), Machine for pressure casting of metal parts possibly containing fibres of ceramic materials.
  12. Belke ; Jr. Robert E. (Clay NY) Trojanowski George F. (Baldwinsville NY) Zakraysek Louis (Cicero NY), Metal matrix composite and structure using metal matrix composites for electronic applications.
  13. White Danny R. (Castle DE) Urquhart Andrew W. (Newark DE) Aghajanian Michael K. (Newark DE) Creber Dave K. (Ontario CAX), Metal matrix composites.
  14. Dolowy ; Jr. Joseph F. (Oxnard CA) Webb Bradley A. (Las Vegas NV) van den Bergh Mark (Thousand Oaks CA), Metal-matrix-composite.
  15. Klier Eric (Irving TX) Mortensen Andreas (Cambridge MA) Cornie James A. (North Chelmsford MA) Flemings Merton C. (Cambridge MA), Method and apparatus for continuous casting of composites.
  16. Charbonnier Jean (Voreppe FRX) Goliard Francois (Le Grand Lemps FRX), Method and apparatus for sand moulding composite articles with a die made of light alloy and a fibrous insert.
  17. Anderson Samuel J. (Tempe AZ) Romero Guillermo L. (Phoenix AZ), Method for forming a power circuit package.
  18. Sasaki Masayoshi (Ayase JPX) Saeki Fumio (Atsugi JPX) Hino Harumichi (Yokohama JPX), Method for producing fiber reinforced metal composition.
  19. Ruff Gary F. (Farmington Hills MI), Method of casting a metal matrix composite.
  20. Przybylek George J. (Warren NJ), Method of making a curved electrode plate.
  21. Cook Arnold J. (Pittsburgh PA), Method of vacuum casting.
  22. Kaufman, Lance R., Multiple substrate circuit package.
  23. Nakao Junichi (Hyogo JPX), Power semiconductor device suitable for automation of production.
  24. Roddy Joseph T. (St. Louis MO), Process of die casting with a particulate inert filler uniformly dispersed through the casting.
  25. Katzman Howard A. (Los Angeles CA), Pyrolyzed pitch coatings for carbon fiber.
  26. Skingle Thomas J. (Parma OH) Toaz Milton W. (Bedford OH), Reinforced piston.

이 특허를 인용한 특허 (24)

  1. Heo, Youngwook; Beall, John M., Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall.
  2. Yamagata Shin-ichi,JPX ; Suwata Osamu,JPX ; Kawai Chihiro,JPX ; Fukui Akira,JPX ; Takeda Yoshinobu,JPX, Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same.
  3. McKeeth, Dave J.; Fitzmaurice, Tim; Kosmosky, Roger A., Apparatus, system, and method for cutting tubes.
  4. Nagase Toshiyuki,JPX ; Kuromitsu Yoshirou,JPX ; Sugamura Kunio,JPX ; Kanda Yoshio,JPX ; Hatsushika Masafumi,JPX ; Otsuki Masato,JPX, Ceramic circuit board with heat sink.
  5. Jones Herman L. ; Taylor Edward A., Composite materials and methods for manufacturing composite materials.
  6. Karg, Karin M.; Neutra, Justin Andreas; Parnell, Jeff; Gorman, James, Discontinuous short fiber preform and fiber-reinforced aluminum billet and methods of manufacturing the same.
  7. Herman L. Jones ; Edward A. Taylor, Electronics packages having a composite structure and methods for manufacturing such electronics packages.
  8. Kirkpatrick, Douglas A.; Gitsevich, Aleksandr, High frequency inductive lamp and power oscillator.
  9. MacLennan Donald A. ; Dymond ; Jr. Lauren E. ; Gitsevich Aleksandr ; Grimm William G. ; Kipling Kent ; Kirkpatrick Douglas A. ; Ola Samuel A. ; Simpson James E. ; Trimble William C. ; Tsai Peter ; Tu, High frequency inductive lamp and power oscillator.
  10. MacLennan Donald A. ; Turner Brian P. ; Dolan James T. ; Kirkpatrick Douglas A. ; Leng Yongzhang, High frequency inductive lamp and power oscillator.
  11. Inoue Akihisa,JPX ; Oguchi Masahiro,JPX ; Nagahora Junichi,JPX ; Otsuki Masato,JPX ; Kohno Toru,JPX ; Takeda Shin,JPX ; Horio Yuma,JPX, Highly wear-resistant aluminum-based composite alloy and wear-resistant parts.
  12. MacLennan Donald A. ; Turner Brian P. ; Gitsevich Aleksandr ; Bass Gary K. ; Dolan James T. ; Kipling Kent ; Kirkpatrick Douglas A. ; Leng Yongzhang ; Levin Izrail ; Roy Robert J. ; Shanks Bruce ; Sm, Jacketed lamp bulb envelope.
  13. Yamagata, Shin-ichi; Suwata, Osamu; Kawai, Chihiro; Fukui, Akira; Takeda, Yoshinobu, Member for semiconductor device and method for producing the same.
  14. Ishiduka,Masanobu; Nishii,Kouta; Aso,Noriyasu; Kimura,Koichi; Fujiwara,Takayuki, Metal casting fabrication method.
  15. Bojarczuk ; Jr. Nestor Alexander ; Guha Supratik ; Gupta Arunava ; Purushothaman Sampath, Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair.
  16. Schmitt Theodore Nicolas,ATX, Metal matrix composite (MMC) body.
  17. Towata Shinichi,JPX ; Kamiya Nobuo,JPX ; Hohjo Hiroshi,JPX ; Nishino Naohisa,JPX ; Yamamoto Tsuyoshi,JPX ; Onda Shoichi,JPX, Metal matrix composite casting and manufacturing method thereof.
  18. Turner Brian P. ; Kipling Kent ; Shanks Bruce ; Smith Malcolm, Metal matrix composite integrated lamp head.
  19. Chong, Myung Gun; Heo, Cheol Ho; Son, Sang Hyuk; You, Dae Hyung, Metallic laminate and manufacturing method of light emitting diode package using the same.
  20. Weiland, Hasso; Chu, Men Glenn, Methods of making a reinforced composite and reinforced composite products.
  21. Gitsevich Aleksandr, Power oscillator.
  22. Kim, Joo Han; Kirk, Graham Charles; Labhart, Jay Todd; Shah, Binoy Milan; Utturkar, Yogen Vishwas; Charmarthy, Pramod; Deng, Tao, Reusable phase-change thermal interface structures.
  23. Yusa Kazuyuki,JPX, Semiconductor device.
  24. MacLennan Donald A. ; Tsai Peter, Wedding ring shaped excitation coil.
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