초록 ▼

A process tube is surrounded by a heater. A number of gas inlet holes and a number of gas outlet holes are formed in the side wall of the process tube, the gas inlet and outlet holes facing each other and formed distributed in the longitudinal direction of the process tube. An oxidizing gas is suppl

A process tube is surrounded by a heater. A number of gas inlet holes and a number of gas outlet holes are formed in the side wall of the process tube, the gas inlet and outlet holes facing each other and formed distributed in the longitudinal direction of the process tube. An oxidizing gas is supplied from a gas supply pipe to the gas inlet holes, and exhausted to a gas exhaust pipe via the gas outlet holes or lower gas outlet holes.

대표청구항 ▼

A furnace for manufacturing a semiconductor device, the furnace comprising: (a) an inner tube for receiving semiconductor wafers, the inner tube including a wall having a plurality of holes therein; and (b) an outer tube having a plurality of outer tube partitions disposed outside of and connected t

A furnace for manufacturing a semiconductor device, the furnace comprising: (a) an inner tube for receiving semiconductor wafers, the inner tube including a wall having a plurality of holes therein; and (b) an outer tube having a plurality of outer tube partitions disposed outside of and connected to said wall of the inner tube to jointly define independent gas passages with said wall, the gas passages communicating with the inside of the inner tube through associated holes of the plurality of holes, each of the gas passages serving as one of a gas inlet and a gas outlet.