초록 ▼

A multilayer printed circuit board comprising conducting layers of a first material and conducting layers of a second material includes noncorrosive low resistance electrical contacts between conducting layers of the first and second material. The noncorrosive low resistance contacts allow the use o

A multilayer printed circuit board comprising conducting layers of a first material and conducting layers of a second material includes noncorrosive low resistance electrical contacts between conducting layers of the first and second material. The noncorrosive low resistance contacts allow the use of light weight conducting materials for particular layers of the circuit board to produce a light weight multilayer circuit board.

대표청구항 ▼

A low weight multilayer printed circuit board comprising: a first conducting layer comprising a first material; a second conducting layer comprising a second material; an insulating layer bonded to said conducting layers and disposed to separate said conducting layers from one another; and a structu

A low weight multilayer printed circuit board comprising: a first conducting layer comprising a first material; a second conducting layer comprising a second material; an insulating layer bonded to said conducting layers and disposed to separate said conducting layers from one another; and a structure interconnecting said first and said second conducting layers, said structure having a first contact point formed of said first material and a second contact point formed of said second material, said structure forming an electrical connection between said first and said second conducting layers such that said first contact point contacts said first layer and said second contact point contacts said second layer.