초록 ▼

A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer system. A circuit module, such as a multiple chip module, having a first surface and a second surface is

A mounting assembly for a multiple chip module or other circuit module, which includes a board having a surface including an array of board contacts, such as a printed wiring board in a computer system. A circuit module, such as a multiple chip module, having a first surface and a second surface is included. The circuit module includes an array of circuit contacts on the first surface of the circuit module. An interposer between the board and the first surface of the circuit module, includes conductors between the circuit contacts in the array of circuit contacts on the circuit module and board contacts in the array of board contacts on the board. A thermal bridge member contacts the second surface of the circuit module. A heat spreader contacts the thermal bridge member to dissipate the heat over a large region. A fastener fastens the board, interposer, circuit module, thermal bridge member, and heat spreader together, such that thermal contact is made between the circuit module and the thermal bridge member and between the thermal bridge member and the heat spreader, and electrical contact is made between the array of circuit contacts and the conductors in the interposer, and between the conductors in the interposer and the array of board contacts. The fastener comprises a releasable mechanism which allows the circuit module to be easily inserted or removed. A circuit module may include the host processor and supporting circuitry for a computer.

대표청구항 ▼

An electronic assembly, comprising: a board having a surface including an array of board contacts; a circuit module having a first surface and a second surface opposite the first surface, including a substrate, a multilayer interconnect on the substrate, a plurality of integrated circuits on the sub

An electronic assembly, comprising: a board having a surface including an array of board contacts; a circuit module having a first surface and a second surface opposite the first surface, including a substrate, a multilayer interconnect on the substrate, a plurality of integrated circuits on the substrate in electrical communication with the multilayer interconnect, and an array of circuit contacts on the first surface in electrical communication with the multilayer interconnect; a connector including conductors for connection between circuit contacts in the array of circuit contacts on the circuit module and board contacts in the array of board contacts on the board; a heat spreader assembly in thermal contact with the second surface of the circuit module; and a fastener which fastens the circuit module to the board and to the heat spreader assembly such that thermal contact is made between the circuit module and the heat spreader, and electrical contact is made through the connector between the array of circuit contacts and the array of board contacts.