초록 ▼

A system for wireless communication between a plurality of semiconductor chips is disclosed. Each data line in the present invention is coupled with a transmitter for transmitting information to any other semiconductor chip. Furthermore, each data line is coupled with a receiver for receiving inform

A system for wireless communication between a plurality of semiconductor chips is disclosed. Each data line in the present invention is coupled with a transmitter for transmitting information to any other semiconductor chip. Furthermore, each data line is coupled with a receiver for receiving information transmitted by any transmitter. The system also comprises multiple antennas, fabricated from the chip\s metalization layer. Nonetheless, separate antennas within the chip packaging can also be used. The antenna unit comprises a dipole and a loop antenna in a planar arrangement, thereby forming a spherical electromagnetic pattern of coverage and making the orientation between semiconductor chips for transmission purposes substantially irrelevant. Each transmitter in the system comprises a modulator for modulating the information being transmitted, while each receiver comprises a demodulator for demodulating the information transmitted. Several modulation schemes can be employed, though amplitude modulation is preferred, whereby each transmitter has a distinct carrier frequency within the operative radio frequency spectra－preferably above 900 MHz. Each transmitter and receiver is coupled to a power source comprising a capacitor, as a signal generator, and a rectifying circuit. To ensure that the communication between chips is noise/interference free, the entire system is shielded with a metal housing.

대표청구항 ▼

A method of manufacturing an single electronic component, comprising the steps of: providing an enclosure composed of electrically conductive material; and mounting within the enclosure a plurality of semiconductor chips, wherein each chip includes an RF transceiver for transmitting data to, and rec

A method of manufacturing an single electronic component, comprising the steps of: providing an enclosure composed of electrically conductive material; and mounting within the enclosure a plurality of semiconductor chips, wherein each chip includes an RF transceiver for transmitting data to, and receiving data from, the other chips independent of the physical alignment between each two chips within said plurality of chips, and wherein the chips are mounted without any physical connectors between the chips for transferring said data; whereby the electrically conductive enclosure maintains communication among the chips of the single electronic component.