초록 ▼

A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the c

A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the components and/or IC chips. The solder performs are positioned and fixed in the openings through mechanical locking. The devices are located between components and PCB or substrate during the soldering processing. By using these devices, through hole type components and surface mount type parts can be attached onto the PCB through heat reflow soldering at same time without the wave soldering process, and overheating can be avoided during the soldering process especially for the pin grid array component. Another bonus for the application of the device is shorting the required lead time for research and development in new electronic products.

대표청구항 ▼

A solder delivery and array device for soldering electronic components having surface mounting leads or through hole pins to a printed circuit board, comprising: a solder preform, said solder preform having a body portion, a plurality of lugs and corresponding lockers, a means for retaining said sol

A solder delivery and array device for soldering electronic components having surface mounting leads or through hole pins to a printed circuit board, comprising: a solder preform, said solder preform having a body portion, a plurality of lugs and corresponding lockers, a means for retaining said solder preform including a flexible sheet material having a plurality of apertures for receiving said lugs, and an opening, wherein each of said lockers includes an enlarged portion for locking said plurality of lugs in said plurality of aperatures to prevent said body portion from withdrawing from said retaining means, and wherein said opening exposes said solder preform body portion to one side of the retaining means that is opposite to said solder preform body portion.