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Silicon nitride film formation method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-016/34
출원번호 US-0526900 (1995-09-12)
우선권정보 JP-0311478 (1994-12-15)
발명자 / 주소
  • Inaba Yutaka (Hyogo JPX) Kobayashi Kiyoteru (Hyogo JPX)
출원인 / 주소
  • Mitsubishi Denki Kabushiki Kaisha (Tokyo JPX 03)
인용정보 피인용 횟수 : 40  인용 특허 : 5

초록

In the formation of a silicon nitride film, dichlorosilane and ammonia are used as source gas and, for example, argon is used as carrier gas. The pressure (total pressure) inside a chamber is set to about 100 to 300 Torr (1.33×104 to 4.00×104 Pa). The desirable setting is that, for example, dichloro

대표청구항

A method of forming a stacked capacitor, comprising the steps of: (a) preparing a substrate of a silicon film having a silicon oxide film surrounding said silicon film in an upper portion of said substrate; (b) coating a silicon nitride film on the silicon oxide film on said silicon film by low pres

이 특허에 인용된 특허 (5)

  1. Nagashima Makoto (Machida JPX) Kobayashi Naoaki (Sakura CA JPX) Wong Jerry (Fremont CA), Cleaning method for semiconductor wafer processing apparatus.
  2. Fukuda Hisashi (Tokyo JPX), Method and device for cleaning substrates.
  3. Veltri Richard D. (East Hartford CT), Method of making CVD Si3N4.
  4. Tsukamoto Katsuhiro (Hyogo JPX) Shimizu Masahiro (Hyogo JPX) Miyatake Hiroshi (Hyogo JPX), Method of manufacturing semiconductor capacitive element.
  5. Hey H. Peter W. (San Jose CA) Carlson David W. (Santa Clara CA), Silicon nitride deposition.

이 특허를 인용한 특허 (40)

  1. Wong-Cheng Shih TW; Pravin K. Narwankar ; Randall S. Urdahl ; Turgut Sahin, Anneal for enhancing the electrical characteristic of semiconductor devices.
  2. Ito, Shinya, Enhanced deposition control in fabricating devices in a semiconductor wafer.
  3. Tan,Zhengquan; Li,Dongqing; Zygmunt,Walter, HDP-CVD deposition process for filling high aspect ratio gaps.
  4. Cook, Robert C.; Brors, Daniel L., High rate silicon nitride deposition method at low pressures.
  5. Narwankar Pravin K. ; Urdahl Randall S. ; Sahin Turgut ; Shih Wong-Cheng,TWX, Hydrogen anneal for curing defects of silicon/nitride interfaces of semiconductor devices.
  6. Kapoor, Bikram; Karim, M. Ziaul; Wang, Anchuan, Hydrogen assisted HDP-CVD deposition process for aggressive gap-fill technology.
  7. Tan, Zhengquan; Li, Dongqing; Zygmunt, Walter; Ishikawa, Tetsuya, Hydrogen assisted undoped silicon oxide deposition process for HDP-CVD.
  8. Smith, Preston; Choi, Chi-hing, In-situ silicon nitride and silicon based oxide deposition with graded interface for damascene application.
  9. Smith, Preston; Choi, Chi-hing, In-situ silicon nitride and silicon based oxide deposition with graded interface for damascene application.
  10. Karim,M. Ziaul; Li,DongQing; Byun,Jeong Soo; Pham,Thanh N., In-situ-etch-assisted HDP deposition.
  11. Karim,M. Ziaul; Li,DongQing; Byun,Jeong Soo; Pham,Thanh N., In-situ-etch-assisted HDP deposition using SiF.
  12. Karim, M. Ziaul; Li, DongQing; Byun, Jeong Soo; Pham, Thanh N., In-situ-etch-assisted HDP deposition using SiF4 and hydrogen.
  13. Hong, Sukwon; Tran, Toan; Mallick, Abhijit; Liang, Jingmei; Ingle, Nitin K., Low shrinkage dielectric films.
  14. Mungekar, Hemant P.; Wu, Jing; Lee, Young S.; Wang, Anchuan, Low wet etch rate silicon nitride film.
  15. Lee, Han-Choon, MIM capacitor and method of fabricating the same.
  16. Nakazawa Makoto,JPX ; Nagata Toshio,JPX, Manufacturing method for semiconductor device.
  17. Paranjpe,Ajit P., Method and apparatus for layer by layer deposition of thin films.
  18. Kim Ki-Young,KRX ; Hyun Kyung-Ho,KRX ; An Joong-Il,KRX, Method for depositing a silicon nitride layer.
  19. Sun-Woo Kwak KR; Jung-Hun Yun KR; Byung-Su Koo KR; Su-Young Kwon KR, Method for forming a capacitor.
  20. Sun-Woo Kwak KR; Jung-Hun Yun KR; Byung-Su Koo KR; Su-Young Kwon KR, Method for forming capacitor.
  21. Thakur Randhir P. S. ; Nuttall Michael ; Pan Pai-Hung, Method for growing field oxide to minimize birds' beak length.
  22. Lin Shih-Chi,TWX, Method for making a novel graded silicon nitride/silicon oxide (SNO) hard mask for improved deep sub-micrometer semiconductor processing.
  23. Shih-Chi Lin TW, Method for making a novel graded silicon nitride/silicon oxide (SNO) hard mask for improved deep sub-micrometer semiconductor processing.
  24. Nakajima Ryuji,JPX, Method for manufacturing semiconductor device capable of effectively carrying out hydrogen passivation.
  25. Chan Kevin K. ; Jones Erin C. ; McFeely Fenton R. ; Solomon Paul M. ; Yurkas John J., Method for protecting refractory metal thin film requiring high temperature processing in an oxidizing atmosphere and structure formed thereby.
  26. Yang, Michael X.; Ho, Henry; Chen, Steven A., Method of forming a film in a chamber and positioning a substitute in a chamber.
  27. Yang, Michael X.; Kao, Chien-Teh; Littau, Karl; Chen, Steven A.; Ho, Henry; Yu, Ying, Method of forming a silicon nitride layer on a substrate.
  28. Randhir P. S. Thakur, Method of forming a transistor gate.
  29. Karim, M. Ziaul; Moghadam, Farhad K.; Salimian, Siamak, Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation.
  30. Randhir P. S. Thakur, Methods to form electronic devices.
  31. Thakur Randhir P. S., Methods to form electronic devices.
  32. Thakur Randhir P. S., Methods to form electronic devices.
  33. Thakur, Randhir P. S., Methods to form electronic devices.
  34. Thakur, Randhir P. S., Methods to form electronic devices and methods to form a material over a semiconductive substrate.
  35. Thakur,Randhir P.S., Methods to form electronic devices and methods to form a material over a semiconductive substrate.
  36. Mungekar,Hemant P.; Lee,Young S; Vellaikal,Manoj; Greig,Karen; Kapoor,Bikram, Oxygen plasma treatment for enhanced HDP-CVD gapfill.
  37. Li,Lih Ping; Lu,Yung Chen, Post-cleaning chamber seasoning method.
  38. Nemani,Srinivas D.; Lee,Young S., Silicon oxide gapfill deposition using liquid precursors.
  39. Chan, Kevin K.; Jones, Erin C.; McFeely, Fenton R.; Solomon, Paul M.; Yurkas, John J., Structure having refractory metal film on a substrate.
  40. Rasheed,Muhammad M.; Kim,Steven H, Use of enhanced turbomolecular pump for gapfill deposition using high flows of low-mass fluent gas.
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