초록 ▼

A water-absorbent resin particles that exhibits a centrifuged absorption capacity of 26 g/g or greater, an absorption under load of 24 g/g or greater at 0.6 psi load. Other aspects of the invention are processes for the preparation of such water-absorbent resin particles which comprise the inclusion

A water-absorbent resin particles that exhibits a centrifuged absorption capacity of 26 g/g or greater, an absorption under load of 24 g/g or greater at 0.6 psi load. Other aspects of the invention are processes for the preparation of such water-absorbent resin particles which comprise the inclusion of chlorine or bromine containing oxidizing agent followed by the heat-treatment to produce particles with superior centrifuged absorption capacity in combination with high absorption under load at high load, and acceptable levels of residuals. These water-absorbent resin particles provide superior performance when incorporated into absorbent structures.

대표청구항 ▼

A water-absorbent resin particle comprising: from 80 to 99.9 weight percent of a crosslinked carboxyl-containing polymer prepared by polymerizing a polymerization mixture which comprises: (a) from 70 to 99.9 weight percent of one or more ethylenically unsaturated carboxyl containing monomers, (b) fr

A water-absorbent resin particle comprising: from 80 to 99.9 weight percent of a crosslinked carboxyl-containing polymer prepared by polymerizing a polymerization mixture which comprises: (a) from 70 to 99.9 weight percent of one or more ethylenically unsaturated carboxyl containing monomers, (b) from 0.1 to 5 weight percent of one or more crosslinking agents, and (c) from 0 to 25 weight percent of one or more comonomers copolymerizable with the carboxyl containing monomer, (d) from 10 to 2000 ppm by weight of a chlorine or bromine containing oxidizing agent, wherein the weight percentages and ppm of the polymerization mixture are based on the total weight of (a), (b) and (c), wherein the oxidizing agent has been substantially uniformly distributed within the resin particle prior to heat-treatment, and wherein the resin particle has been heated at a temperature of from 170°C. to 250°C. for from 1 to 60 minutes.